Part | RoHS | Manufacturer | Other IC type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Surface Mount | Total Dose (V) | Maximum Switching Frequency | Package Body Material | Maximum Supply Current (Isup) | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Bandwidth | Terminal Form | Maximum Negative Supply Voltage (Vsup) | Nominal Negative Supply Voltage (Vsup) | Nominal Supply Voltage (Vsup) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Control Mode | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Signal Current | Height | Width (mm) | Qualification | Normal Position (V) | Nominal Off-state Isolation | Minimum Supply Voltage (Vsup) | Additional Features | Minimum Input Voltage | Minimum Negative Supply Voltage (Vsup) | JESD-609 Code | Switching (V) | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Switch-on Time | Maximum On-state Resistance (Ron) | Nominal Threshold Voltage (V) | Maximum Switch-off Time | Maximum Positive Input Voltage | Nominal On-state Resistance Match | Length | Adjustable Threshold | Maximum Input Voltage |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
SPST |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC, GLASS-SEALED |
9 mA |
4 |
1 |
JFET |
THROUGH-HOLE |
-15 V |
15 V |
IN-LINE |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
66 dB |
e0 |
450 ns |
75 ohm |
300 ns |
.9 ohm |
19.05 mm |
||||||||||||||||||||||||||||
Analog Devices |
MILITARY |
28 |
DIP |
RECTANGULAR |
NO |
CERAMIC |
1.5 mA |
1 |
16 |
CMOS |
THROUGH-HOLE |
12/15,GND/-12/-15 |
IN-LINE |
DIP28,.6 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
.02 A |
Not Qualified |
e0 |
BREAK-BEFORE-MAKE |
450 ns |
1000 ohm |
||||||||||||||||||||||||||||||||
Analog Devices |
SINGLE-ENDED MULTIPLEXER |
MILITARY |
28 |
DIP |
RECTANGULAR |
NO |
CERAMIC, GLASS-SEALED |
24 mA |
1 |
16 |
BIPOLAR |
THROUGH-HOLE |
-15 V |
15 V |
+-15 |
IN-LINE |
DIP28,.6 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.72 mm |
.025 A |
15.24 mm |
Not Qualified |
66 dB |
OVERVOLTAGE PROTECTION |
e0 |
BREAK-BEFORE-MAKE |
2500 ns |
580 ohm |
500 ns |
36 ohm |
|||||||||||||||||||||||
Analog Devices |
SINGLE-ENDED MULTIPLEXER |
MILITARY |
28 |
QCCN |
SQUARE |
YES |
CERAMIC |
1.5 mA |
1 |
16 |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
12/15,GND/-12/-15 |
CHIP CARRIER |
LCC28,.45SQ |
Multiplexer or Switches |
1.27 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-XQCC-N28 |
.03 A |
Not Qualified |
e0 |
BREAK-BEFORE-MAKE |
600 ns |
1000 ohm |
||||||||||||||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
16 |
TSSOP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
4 |
CMOS |
GULL WING |
12/+-15 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Multiplexer or Switches |
.635 mm |
125 Cel |
-55 Cel |
DUAL |
R-PDSO-G16 |
SEPARATE OUTPUT |
MAKE-BEFORE-BREAK |
105 ns |
625 ohm |
||||||||||||||||||||||||||||||||||||
Analog Devices |
DIFFERENTIAL MULTIPLEXER |
MILITARY |
28 |
DIP |
RECTANGULAR |
NO |
CERAMIC, GLASS-SEALED |
24 mA |
1 |
8 |
BIPOLAR |
MIL-STD-883 |
THROUGH-HOLE |
-15 V |
15 V |
+-15 |
IN-LINE |
DIP28,.6 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.72 mm |
.025 A |
15.24 mm |
Not Qualified |
66 dB |
e0 |
BREAK-BEFORE-MAKE |
2200 ns |
580 ohm |
2500 ns |
52.2 ohm |
|||||||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC, GLASS-SEALED |
4 |
1 |
MIL-PRF-38535 |
THROUGH-HOLE |
-15 V |
15 V |
IN-LINE |
125 Cel |
-55 Cel |
DUAL |
R-GDIP-T16 |
NOT SPECIFIED |
NOT SPECIFIED |
500 ns |
80 ohm |
400 ns |
12 ohm |
|||||||||||||||||||||||||||||||||||
Analog Devices |
MILITARY |
18 |
DIP |
RECTANGULAR |
NO |
CERAMIC |
1.5 mA |
1 |
4 |
CMOS |
THROUGH-HOLE |
12/+-15 |
IN-LINE |
DIP18,.3 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T18 |
.03 A |
Not Qualified |
e0 |
BREAK-BEFORE-MAKE |
600 ns |
1000 ohm |
||||||||||||||||||||||||||||||||
Analog Devices |
DIFFERENTIAL MULTIPLEXER |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC, GLASS-SEALED |
15 mA |
1 |
4 |
BIPOLAR |
MIL-STD-883 |
THROUGH-HOLE |
-15 V |
15 V |
+-15 |
IN-LINE |
DIP16,.3 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
5.08 mm |
.025 A |
7.62 mm |
Not Qualified |
66 dB |
e0 |
BREAK-BEFORE-MAKE |
1300 ns |
400 ohm |
2100 ns |
36 ohm |
19.05 mm |
||||||||||||||||||||||
Analog Devices |
SPDT |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC, GLASS-SEALED |
1 |
1 |
CMOS |
THROUGH-HOLE |
-15 V |
15 V |
IN-LINE |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
54 dB |
e0 |
400 ns |
40 ohm |
200 ns |
8 ohm |
||||||||||||||||||||||||||||||
Analog Devices |
SINGLE-ENDED MULTIPLEXER |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC |
.5 mA |
1 |
8 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
-15 V |
15 V |
+-15 |
IN-LINE |
DIP16,.3 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-XDIP-T16 |
.02 A |
Not Qualified |
e0 |
1500 ns |
450 ohm |
|||||||||||||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
14 |
DIE |
RECTANGULAR |
YES |
UNSPECIFIED |
.01 mA |
2 |
1 |
CMOS |
NO LEAD |
-15 V |
15 V |
UNCASED CHIP |
125 Cel |
-55 Cel |
TIN LEAD |
UPPER |
R-XUUC-N14 |
Not Qualified |
54 dB |
e0 |
400 ns |
40 ohm |
200 ns |
8 ohm |
||||||||||||||||||||||||||||||||
Analog Devices |
DPST |
MILITARY |
14 |
DIE |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
2 |
CMOS |
NO LEAD |
-15 V |
15 V |
UNCASED CHIP |
125 Cel |
-55 Cel |
TIN LEAD |
UPPER |
R-XUUC-N14 |
Not Qualified |
54 dB |
e0 |
400 ns |
40 ohm |
200 ns |
8 ohm |
|||||||||||||||||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
14 |
DIE |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
CMOS |
NO LEAD |
-15 V |
15 V |
UNCASED CHIP |
125 Cel |
-55 Cel |
TIN LEAD |
UPPER |
R-XUUC-N14 |
Not Qualified |
54 dB |
e0 |
400 ns |
75 ohm |
200 ns |
3 ohm |
|||||||||||||||||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
14 |
DIE |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
-15 V |
15 V |
UNCASED CHIP |
125 Cel |
-55 Cel |
TIN LEAD |
UPPER |
R-XUUC-N14 |
Not Qualified |
54 dB |
e0 |
400 ns |
75 ohm |
200 ns |
3 ohm |
|||||||||||||||||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
4 |
CMOS |
-15 V |
15 V |
+-15 |
DIE OR CHIP |
Multiplexer or Switches |
125 Cel |
-55 Cel |
SEPARATE OUTPUT |
Not Qualified |
NC |
BREAK-BEFORE-MAKE |
400 ns |
100 ohm |
||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
DPST |
MILITARY |
14 |
DIE |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
2 |
CMOS |
NO LEAD |
-15 V |
15 V |
UNCASED CHIP |
125 Cel |
-55 Cel |
TIN LEAD |
UPPER |
R-XUUC-N14 |
Not Qualified |
54 dB |
e0 |
200 ns |
50 ohm |
125 ns |
3 ohm |
|||||||||||||||||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
10 |
TO-100 |
ROUND |
NO |
METAL |
2 |
1 |
CMOS |
WIRE |
-15 V |
15 V |
CYLINDRICAL |
125 Cel |
-55 Cel |
TIN LEAD |
BOTTOM |
O-MBCY-W10 |
Not Qualified |
54 dB |
e0 |
400 ns |
75 ohm |
200 ns |
3 ohm |
|||||||||||||||||||||||||||||||||
Analog Devices |
SPDT |
MILITARY |
14 |
DIE |
RECTANGULAR |
YES |
UNSPECIFIED |
.01 mA |
1 |
1 |
CMOS |
NO LEAD |
-15 V |
15 V |
UNCASED CHIP |
125 Cel |
-55 Cel |
TIN LEAD |
UPPER |
R-XUUC-N14 |
Not Qualified |
54 dB |
e0 |
400 ns |
40 ohm |
200 ns |
8 ohm |
||||||||||||||||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
4 |
1 |
CMOS |
-18 V |
-15 V |
15 V |
125 Cel |
-55 Cel |
TIN LEAD |
18 V |
Not Qualified |
70 dB |
4.5 V |
-4.5 V |
e0 |
600 ns |
175 ohm |
450 ns |
|||||||||||||||||||||||||||||||||||||||
Analog Devices |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC |
2 |
CMOS |
THROUGH-HOLE |
5,+-15 |
IN-LINE |
DIP16,.3 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-XDIP-T16 |
SEPARATE OUTPUT |
Not Qualified |
e0 |
BREAK-BEFORE-MAKE |
200 ns |
75 ohm |
||||||||||||||||||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC, GLASS-SEALED |
4 |
1 |
THROUGH-HOLE |
-20 V |
IN-LINE |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
20 V |
5.842 mm |
7.62 mm |
Not Qualified |
5 V |
-5 V |
e0 |
80 ohm |
|||||||||||||||||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC, GLASS-SEALED |
2 |
1 |
CMOS |
THROUGH-HOLE |
-20 V |
IN-LINE |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
20 V |
5.842 mm |
7.62 mm |
Not Qualified |
5 V |
-5 V |
e0 |
35 ohm |
||||||||||||||||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC, GLASS-SEALED |
4 |
1 |
THROUGH-HOLE |
-20 V |
IN-LINE |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
20 V |
5.842 mm |
7.62 mm |
Not Qualified |
5 V |
-5 V |
e0 |
85 ohm |
|||||||||||||||||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC, GLASS-SEALED |
4 |
1 |
THROUGH-HOLE |
-20 V |
IN-LINE |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
20 V |
5.842 mm |
7.62 mm |
Not Qualified |
5 V |
-5 V |
e0 |
85 ohm |
|||||||||||||||||||||||||||||||||
Analog Devices |
SPDT |
MILITARY |
14 |
DIE |
RECTANGULAR |
YES |
UNSPECIFIED |
.01 mA |
2 |
1 |
CMOS |
NO LEAD |
-15 V |
15 V |
UNCASED CHIP |
125 Cel |
-55 Cel |
TIN LEAD |
UPPER |
R-XUUC-N14 |
Not Qualified |
54 dB |
e0 |
400 ns |
75 ohm |
200 ns |
3 ohm |
||||||||||||||||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
14 |
DIE |
RECTANGULAR |
YES |
UNSPECIFIED |
.01 mA |
1 |
1 |
CMOS |
NO LEAD |
-15 V |
15 V |
UNCASED CHIP |
125 Cel |
-55 Cel |
TIN LEAD |
UPPER |
R-XUUC-N14 |
Not Qualified |
54 dB |
e0 |
400 ns |
75 ohm |
200 ns |
3 ohm |
||||||||||||||||||||||||||||||||
Analog Devices |
DPST |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC, GLASS-SEALED |
2 |
2 |
THROUGH-HOLE |
-20 V |
IN-LINE |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
20 V |
5.842 mm |
7.62 mm |
Not Qualified |
5 V |
-5 V |
e0 |
35 ohm |
|||||||||||||||||||||||||||||||||
Analog Devices |
DIFFERENTIAL MULTIPLEXER |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC |
.5 mA |
1 |
4 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
-15 V |
15 V |
+-15 |
IN-LINE |
DIP16,.3 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-XDIP-T16 |
.02 A |
Not Qualified |
e0 |
1500 ns |
450 ohm |
|||||||||||||||||||||||||||||
Analog Devices |
SPDT |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC, GLASS-SEALED |
2 |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
-15 V |
15 V |
5,+-15 |
IN-LINE |
DIP16,.3 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
SEPARATE OUTPUT |
1 |
5.08 mm |
7.62 mm |
Not Qualified |
54 dB |
e0 |
BREAK-BEFORE-MAKE |
245 |
400 ns |
40 ohm |
200 ns |
8 ohm |
||||||||||||||||||||||
Analog Devices |
SPDT |
MILITARY |
14 |
DIP |
RECTANGULAR |
NO |
CERAMIC |
1 |
CMOS |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
-15 V |
15 V |
+-15 |
IN-LINE |
DIP14,.3 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-XDIP-T14 |
Not Qualified |
e0 |
BREAK-BEFORE-MAKE |
|||||||||||||||||||||||||||||||||
Analog Devices |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC |
1 |
CMOS |
THROUGH-HOLE |
5,+-15 |
IN-LINE |
DIP16,.3 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-XDIP-T16 |
SEPARATE OUTPUT |
1 |
Not Qualified |
NO |
e0 |
BREAK-BEFORE-MAKE |
200 ns |
75 ohm |
||||||||||||||||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC, GLASS-SEALED |
2 |
2 |
CMOS |
THROUGH-HOLE |
-15 V |
15 V |
IN-LINE |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
1 |
5.08 mm |
7.62 mm |
Not Qualified |
54 dB |
e0 |
400 ns |
40 ohm |
200 ns |
8 ohm |
|||||||||||||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
14 |
DIE |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
CMOS |
NO LEAD |
-15 V |
15 V |
5,+-15 |
UNCASED CHIP |
DIE OR CHIP |
Multiplexer or Switches |
125 Cel |
-55 Cel |
TIN LEAD |
UPPER |
R-XUUC-N14 |
18 V |
Not Qualified |
NO |
54 dB |
4.5 V |
e0 |
BREAK-BEFORE-MAKE |
150 ns |
50 ohm |
125 ns |
3 ohm |
||||||||||||||||||||||||||
Analog Devices |
MILITARY |
10 |
ROUND |
METAL |
2 |
CMOS |
WIRE |
CYLINDRICAL |
CAN10,.23 |
Multiplexer or Switches |
125 Cel |
-55 Cel |
TIN LEAD |
BOTTOM |
O-MBCY-W10 |
SEPARATE OUTPUT |
NO |
e0 |
BREAK-BEFORE-MAKE |
||||||||||||||||||||||||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
14 |
DIE |
RECTANGULAR |
YES |
UNSPECIFIED |
2 |
1 |
CMOS |
NO LEAD |
-15 V |
15 V |
UNCASED CHIP |
125 Cel |
-55 Cel |
TIN LEAD |
UPPER |
R-XUUC-N14 |
Not Qualified |
54 dB |
e0 |
150 ns |
50 ohm |
125 ns |
3 ohm |
|||||||||||||||||||||||||||||||||
Analog Devices |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC |
2 |
CMOS |
THROUGH-HOLE |
5,+-15 |
IN-LINE |
DIP16,.3 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-XDIP-T16 |
SEPARATE OUTPUT |
1 |
Not Qualified |
NO |
e0 |
BREAK-BEFORE-MAKE |
200 ns |
75 ohm |
||||||||||||||||||||||||||||||||
Analog Devices |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC |
2 |
CMOS |
THROUGH-HOLE |
5,+-15 |
IN-LINE |
DIP16,.3 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-XDIP-T16 |
SEPARATE OUTPUT |
Not Qualified |
e0 |
BREAK-BEFORE-MAKE |
400 ns |
60 ohm |
||||||||||||||||||||||||||||||||||
Analog Devices |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC |
1 |
CMOS |
THROUGH-HOLE |
5,+-15 |
IN-LINE |
DIP16,.3 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-XDIP-T16 |
Not Qualified |
e0 |
BREAK-BEFORE-MAKE |
400 ns |
150 ohm |
|||||||||||||||||||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC, GLASS-SEALED |
2 |
1 |
CMOS |
THROUGH-HOLE |
-18 V |
-15 V |
15 V |
IN-LINE |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
1 |
18 V |
5.08 mm |
7.62 mm |
Not Qualified |
54 dB |
4.5 V |
-4.5 V |
e0 |
400 ns |
75 ohm |
200 ns |
3 ohm |
|||||||||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC, GLASS-SEALED |
4 |
1 |
CMOS |
MIL-STD-883 Class B |
THROUGH-HOLE |
-18 V |
-15 V |
15 V |
+-15 |
IN-LINE |
DIP16,.3 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
SEPARATE OUTPUT |
1 |
18 V |
5.08 mm |
7.62 mm |
Not Qualified |
NC |
70 dB |
4.5 V |
-4.5 V |
e0 |
BREAK-BEFORE-MAKE |
600 ns |
175 ohm |
450 ns |
|||||||||||||||||||
Analog Devices |
SPST |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC |
4 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
-15 V |
15 V |
+-15 |
IN-LINE |
DIP16,.3 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-XDIP-T16 |
SEPARATE OUTPUT |
Not Qualified |
NO |
e0 |
BREAK-BEFORE-MAKE |
175 ohm |
||||||||||||||||||||||||||||||
Analog Devices |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC |
1 |
CMOS |
THROUGH-HOLE |
5,+-15 |
IN-LINE |
DIP16,.3 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-XDIP-T16 |
Not Qualified |
NO |
e0 |
BREAK-BEFORE-MAKE |
150 ns |
75 ohm |
||||||||||||||||||||||||||||||||||
Analog Devices |
DPST |
MILITARY |
16 |
QCCN |
SQUARE |
YES |
CERAMIC, METAL-SEALED COFIRED |
2 |
2 |
NO LEAD |
-20 V |
CHIP CARRIER |
125 Cel |
-55 Cel |
TIN LEAD |
QUAD |
S-CQCC-N16 |
20 V |
Not Qualified |
5 V |
-5 V |
e0 |
35 ohm |
||||||||||||||||||||||||||||||||||||
Analog Devices |
SPDT |
MILITARY |
14 |
DIE |
RECTANGULAR |
YES |
UNSPECIFIED |
1 |
1 |
CMOS |
NO LEAD |
-15 V |
15 V |
UNCASED CHIP |
125 Cel |
-55 Cel |
TIN LEAD |
UPPER |
R-XUUC-N14 |
Not Qualified |
54 dB |
e0 |
400 ns |
75 ohm |
200 ns |
3 ohm |
|||||||||||||||||||||||||||||||||
Analog Devices |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
CERAMIC |
2 |
CMOS |
THROUGH-HOLE |
5,+-15 |
IN-LINE |
DIP16,.3 |
Multiplexer or Switches |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-XDIP-T16 |
SEPARATE OUTPUT |
1 |
Not Qualified |
e0 |
BREAK-BEFORE-MAKE |
400 ns |
60 ohm |
|||||||||||||||||||||||||||||||||
Analog Devices |
SPDT |
MILITARY |
20 |
QCCN |
SQUARE |
YES |
UNSPECIFIED |
1 |
1 |
CMOS |
MIL-STD-883 Class B |
NO LEAD |
-15 V |
15 V |
CHIP CARRIER |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-XQCC-N20 |
2.54 mm |
8.89 mm |
Not Qualified |
54 dB |
400 ns |
40 ohm |
200 ns |
8 ohm |
8.89 mm |
||||||||||||||||||||||||||||||
Analog Devices |
MILITARY |
14 |
DFP |
RECTANGULAR |
YES |
CERAMIC |
2 |
CMOS |
FLAT |
-15 V |
15 V |
+-15 |
FLATPACK |
FL14,.3 |
Multiplexer or Switches |
1.27 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-XDFP-F14 |
SEPARATE OUTPUT |
Not Qualified |
NC |
e0 |
BREAK-BEFORE-MAKE |
1000 ns |
100 ohm |
Multiplexers and switches are electronic components used in digital and analog circuits to route signals between different inputs and outputs. They allow a single input signal to be sent to multiple output channels or vice versa.
A multiplexer, also known as a "mux," is a digital component that selects one of several input signals and forwards it to a single output. Multiplexers are often used in data communication systems to transmit multiple signals over a single communication channel. They can also be used in digital circuits to route control signals and address lines.
A switch is an electronic component that connects or disconnects two or more circuits. Switches can be mechanical or electronic and are used to control the flow of current in a circuit. In digital circuits, switches are used to connect or disconnect components and can be used to create logic gates and other digital components.
Multiplexers and switches are important components in various electronic systems, including communication systems, data processing systems, and control systems. They can be used to route signals between different parts of a circuit and to switch between different modes of operation. Multiplexers and switches can also be used to improve the efficiency of a system by reducing the number of components needed to perform a particular function.