Part | RoHS | Manufacturer | Other IC type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Surface Mount | Total Dose (V) | Maximum Switching Frequency | Package Body Material | Maximum Supply Current (Isup) | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Bandwidth | Terminal Form | Maximum Negative Supply Voltage (Vsup) | Nominal Negative Supply Voltage (Vsup) | Nominal Supply Voltage (Vsup) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Control Mode | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Signal Current | Height | Width (mm) | Qualification | Normal Position (V) | Nominal Off-state Isolation | Minimum Supply Voltage (Vsup) | Additional Features | Minimum Input Voltage | Minimum Negative Supply Voltage (Vsup) | JESD-609 Code | Switching (V) | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Switch-on Time | Maximum On-state Resistance (Ron) | Nominal Threshold Voltage (V) | Maximum Switch-off Time | Maximum Positive Input Voltage | Nominal On-state Resistance Match | Length | Adjustable Threshold | Maximum Input Voltage |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
SPST |
48 |
LFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
4 mA |
1 |
8 |
HVCMOS |
GULL WING |
-160 V |
5 V |
3.3/5,+-40/+-160 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Multiplexer or Switches |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
SEPARATE OUTPUT |
5.5 V |
1.6 mm |
3 A |
7 mm |
Not Qualified |
NO |
33 dB |
3 V |
-30 V |
-40 V |
e3 |
5000 ns |
38 ohm |
5000 ns |
1.9 ohm |
7 mm |
190 V |
|||||||||||||||||
|
Microchip Technology |
CROSS POINT SWITCH |
INDUSTRIAL |
44 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
.3 mA |
1 |
4 |
NO LEAD |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.28SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N44 |
SEPARATE OUTPUT |
2 |
2.625 V |
.9 mm |
7 mm |
Not Qualified |
2.375 V |
.1 V |
e3 |
7 mm |
1.7 V |
|||||||||||||||||||||||||||
|
Microchip Technology |
SPST |
COMMERCIAL |
48 |
LFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
3 mA |
8 |
8 |
CMOS |
GULL WING |
5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.28SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
SEPARATE OUTPUT |
5.5 V |
1.6 mm |
3 A |
7 mm |
NO |
33 dB |
3 V |
IT ALSO REQUIRES VPP (40V TO VNN +200V) AND VNN (-40V TO -160V) SUPPLY |
-30 V |
e3 |
5000 ns |
38 ohm |
5000 ns |
1.9 ohm |
7 mm |
30 V |
||||||||||||||||||||
|
Microchip Technology |
CROSS POINT SWITCH |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
130 mA |
1 |
2 |
NO LEAD |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
2 |
3.6 V |
.9 mm |
3 mm |
Not Qualified |
2.375 V |
3.3V NOMINAL ALSO AVAILABLE |
e4 |
40 |
260 |
3 mm |
||||||||||||||||||||||||||
|
Microchip Technology |
CROSS POINT SWITCH |
INDUSTRIAL |
32 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
250 mA |
2 |
2 |
NO LEAD |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.20SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
SEPARATE OUTPUT |
2 |
2.625 V |
.9 mm |
5 mm |
Not Qualified |
2.375 V |
e4 |
40 |
260 |
5 mm |
|||||||||||||||||||||||||||
|
Microchip Technology |
CROSS POINT SWITCH |
INDUSTRIAL |
32 |
HTQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
190 mA |
2 |
2 |
GULL WING |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE |
TQFP32,.35SQ,31 |
.8 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G32 |
SEPARATE OUTPUT |
3 |
3.6 V |
1.2 mm |
7 mm |
Not Qualified |
2.3 V |
e4 |
7 mm |
|||||||||||||||||||||||||||||
|
Microchip Technology |
SINGLE-ENDED MULTIPLEXER |
48 |
LFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
4 mA |
1 |
16 |
CMOS |
GULL WING |
5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
SEPARATE OUTPUT |
5.5 V |
1.6 mm |
7 mm |
NO |
33 dB |
3 V |
e3 |
5000 ns |
38 ohm |
5000 ns |
1.3 ohm |
7 mm |
|||||||||||||||||||||||||
|
Microchip Technology |
SPST |
28 |
QCCJ |
SQUARE |
YES |
PLASTIC/EPOXY |
4 mA |
1 |
8 |
HVCMOS |
J BEND |
-160 V |
5 V |
3.3/5,+-40/+-160 |
CHIP CARRIER |
LDCC28,.5SQ |
Multiplexer or Switches |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J28 |
SEPARATE OUTPUT |
5.5 V |
4.573 mm |
3 A |
11.43 mm |
Not Qualified |
NO |
33 dB |
3 V |
-30 V |
-40 V |
e3 |
5000 ns |
38 ohm |
5000 ns |
1.9 ohm |
11.43 mm |
190 V |
|||||||||||||||||
|
Microchip Technology |
SINGLE-ENDED MULTIPLEXER |
COMMERCIAL |
48 |
LFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
4 mA |
1 |
16 |
CMOS |
GULL WING |
5 V |
3.3/5,+-40/+-160 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Multiplexer or Switches |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
5.5 V |
1.6 mm |
7 mm |
Not Qualified |
NO |
33 dB |
3 V |
ALSO REQUIRES VPP (40V TO VNN +200V) AND VNN (-40V TO -160V) SUPPLY |
-30 V |
e3 |
5000 ns |
38 ohm |
5000 ns |
1.9 ohm |
7 mm |
30 V |
|||||||||||||||||||
|
Microchip Technology |
SINGLE-ENDED MULTIPLEXER |
COMMERCIAL |
42 |
TFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
4 mA |
1 |
16 |
CMOS |
BALL |
5 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA42,8X8,24 |
.6 mm |
70 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B42 |
5.5 V |
1.02 mm |
5.29 mm |
Not Qualified |
NO |
33 dB |
3 V |
-30 V |
e1 |
5000 ns |
38 ohm |
5000 ns |
1.9 ohm |
5.3 mm |
30 V |
||||||||||||||||||||||
|
Microchip Technology |
SINGLE-ENDED MULTIPLEXER |
COMMERCIAL |
42 |
TFBGA |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
4 mA |
1 |
16 |
BALL |
5 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA42,8X8,24 |
.68 mm |
70 Cel |
0 Cel |
BOTTOM |
R-PBGA-B42 |
5.5 V |
1.02 mm |
5.29 mm |
NO |
33 dB |
3 V |
-30 V |
5000 ns |
38 ohm |
5000 ns |
1.9 ohm |
5.3 mm |
30 V |
||||||||||||||||||||||||||
|
Microchip Technology |
CROSS POINT SWITCH |
INDUSTRIAL |
28 |
QCCJ |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
8 |
CMOS |
J BEND |
5 V |
5/12,GND/-7 |
CHIP CARRIER |
LDCC28,.5SQ |
Multiplexer or Switches |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J28 |
SEPARATE OUTPUT |
13.2 V |
4.57 mm |
11.505 mm |
Not Qualified |
95 dB |
4.5 V |
e3 |
100 ns |
185 ohm |
5 ohm |
11.505 mm |
||||||||||||||||||||||||
|
Microchip Technology |
CROSS POINT SWITCH |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
16 |
CMOS |
J BEND |
-7 V |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
13.2 V |
4.57 mm |
16.585 mm |
Not Qualified |
95 dB |
4.5 V |
8 X 16 ARRAY |
e3 |
185 ohm |
5 ohm |
16.585 mm |
|||||||||||||||||||||||||||
|
Microchip Technology |
SPDT |
COMMERCIAL |
48 |
LFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
4 mA |
1 |
12 |
HVCMOS |
GULL WING |
-160 V |
5 V |
4.5/13.2 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Multiplexer or Switches |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
SEPARATE OUTPUT |
13.2 V |
1.6 mm |
3 A |
7 mm |
Not Qualified |
NO |
30 dB |
4.5 V |
-10 V |
e3 |
5000 ns |
38 ohm |
5000 ns |
1.9 ohm |
7 mm |
||||||||||||||||||
|
Microchip Technology |
SPDT |
COMMERCIAL |
48 |
LFQFP |
SQUARE |
YES |
UNSPECIFIED |
4 mA |
6 |
12 |
GULL WING |
-160 V |
5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-XQFP-G48 |
SEPARATE OUTPUT |
13.2 V |
1.6 mm |
7 mm |
NC |
30 dB |
4.5 V |
6 SPDT |
-10 V |
5000 ns |
38 ohm |
5000 ns |
5 ohm |
7 mm |
||||||||||||||||||||||||
Microchip Technology |
SPDT |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SPST |
COMMERCIAL |
28 |
QCCJ |
SQUARE |
YES |
PLASTIC/EPOXY |
3 mA |
8 |
8 |
CMOS |
J BEND |
5 V |
CHIP CARRIER |
LDCC28,.5SQ |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J28 |
SEPARATE OUTPUT |
5.5 V |
4.573 mm |
3 A |
11.43 mm |
NO |
33 dB |
3 V |
IT ALSO REQUIRES VPP (40V TO VNN +200V) AND VNN (-40V TO -160V) SUPPLY |
-30 V |
e3 |
5000 ns |
38 ohm |
5000 ns |
1.9 ohm |
11.43 mm |
30 V |
||||||||||||||||||||
Microchip Technology |
SINGLE-ENDED MULTIPLEXER |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
SINGLE-ENDED MULTIPLEXER |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SINGLE-ENDED MULTIPLEXER |
COMMERCIAL |
48 |
LFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
4 mA |
1 |
16 |
CMOS |
GULL WING |
5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
BGA42,8X8,24 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
3 |
5.5 V |
1.6 mm |
7 mm |
NO |
33 dB |
3 V |
-30 V |
e3 |
260 |
5000 ns |
38 ohm |
5000 ns |
1.9 ohm |
7 mm |
30 V |
|||||||||||||||||||||
|
Microchip Technology |
CROSS POINT SWITCH |
INDUSTRIAL |
40 |
DIP |
RECTANGULAR |
NO |
PLASTIC/EPOXY |
1 |
16 |
CMOS |
THROUGH-HOLE |
-7 V |
5 V |
5/12,GND/-7 |
IN-LINE |
DIP40,.6 |
Multiplexer or Switches |
2.54 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T40 |
SEPARATE OUTPUT |
13.2 V |
6.35 mm |
15.24 mm |
Not Qualified |
95 dB |
4.5 V |
8 X 16 ARRAY |
e3 |
100 ns |
185 ohm |
5 ohm |
51.75 mm |
||||||||||||||||||||||
|
Microchip Technology |
CROSS POINT SWITCH |
INDUSTRIAL |
44 |
QCCJ |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
16 |
CMOS |
J BEND |
-7 V |
5 V |
CHIP CARRIER |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
13.2 V |
4.57 mm |
16.585 mm |
Not Qualified |
95 dB |
4.5 V |
8 X 16 ARRAY |
e3 |
185 ohm |
5 ohm |
16.585 mm |
|||||||||||||||||||||||||||
|
Microchip Technology |
SPST |
48 |
LFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
7.5 mA |
1 |
8 |
HVCMOS |
GULL WING |
-225 V |
5 V |
3.3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Multiplexer or Switches |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
SEPARATE OUTPUT |
5.5 V |
1.6 mm |
4.5 A |
7 mm |
Not Qualified |
NO |
33 dB |
3 V |
-90 V |
-100 V |
e3 |
5000 ns |
23 ohm |
5000 ns |
1.15 ohm |
7 mm |
40 V |
|||||||||||||||||
|
Microchip Technology |
SPST |
48 |
LFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
4.5 mA |
1 |
8 |
HVCMOS |
GULL WING |
5 V |
3.3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Multiplexer or Switches |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
SEPARATE OUTPUT |
5.5 V |
1.6 mm |
4.5 A |
7 mm |
Not Qualified |
NO |
33 dB |
3 V |
-90 V |
e3 |
5000 ns |
23 ohm |
5000 ns |
1.15 ohm |
7 mm |
40 V |
|||||||||||||||||||
|
Microchip Technology |
CROSS POINT SWITCH |
INDUSTRIAL |
28 |
QCCJ |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
8 |
CMOS |
J BEND |
5 V |
5/12,GND/-7 |
CHIP CARRIER |
LDCC28,.5SQ |
Multiplexer or Switches |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J28 |
SEPARATE OUTPUT |
13.2 V |
4.57 mm |
11.505 mm |
Not Qualified |
95 dB |
4.5 V |
e3 |
100 ns |
185 ohm |
5 ohm |
11.505 mm |
||||||||||||||||||||||||
|
Microchip Technology |
SINGLE-ENDED MULTIPLEXER |
COMMERCIAL |
48 |
LFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
4 mA |
1 |
16 |
CMOS |
GULL WING |
5 V |
3.3/5,+-40/+-160 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Multiplexer or Switches |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
5.5 V |
1.6 mm |
7 mm |
Not Qualified |
NO |
33 dB |
3 V |
IT ALSO REQUIRES VPP (40V TO VNN +200V) AND VNN (-40V TO -160V) SUPPLY |
-30 V |
e3 |
5000 ns |
38 ohm |
5000 ns |
1.9 ohm |
7 mm |
30 V |
|||||||||||||||||||
|
Microchip Technology |
CROSS POINT SWITCH |
INDUSTRIAL |
16 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
130 mA |
1 |
2 |
NO LEAD |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
SEPARATE OUTPUT |
2 |
3.6 V |
.9 mm |
3 mm |
Not Qualified |
2.375 V |
3.3V NOMINAL ALSO AVAILABLE |
e4 |
40 |
260 |
3 mm |
||||||||||||||||||||||||||
|
Microchip Technology |
CROSS POINT SWITCH |
INDUSTRIAL |
44 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
.3 mA |
1 |
4 |
NO LEAD |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.28SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N44 |
SEPARATE OUTPUT |
2.625 V |
.9 mm |
7 mm |
Not Qualified |
2.375 V |
.1 V |
e3 |
7 mm |
1.7 V |
||||||||||||||||||||||||||||
Microchip Technology |
SPST |
COMMERCIAL |
64 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
4 mA |
16 |
16 |
HVCMOS |
NO LEAD |
-150 V |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-N64 |
5.5 V |
1 mm |
3 A |
9 mm |
NO |
55 dB |
3 V |
15 V |
-240 V |
6000 ns |
48 ohm |
6000 ns |
9.6 ohm |
9 mm |
245 V |
|||||||||||||||||||||||
|
Microchip Technology |
SINGLE-ENDED MULTIPLEXER |
COMMERCIAL |
48 |
LFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
4 mA |
1 |
16 |
GULL WING |
5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.28SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
5.5 V |
1.6 mm |
7 mm |
NO |
33 dB |
3 V |
-30 V |
e3 |
5000 ns |
38 ohm |
5000 ns |
1.9 ohm |
7 mm |
30 V |
||||||||||||||||||||||||
|
Microchip Technology |
SPDT |
48 |
LFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
2 mA |
1 |
16 |
HVCMOS |
GULL WING |
5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
SEPARATE OUTPUT |
5.5 V |
1.6 mm |
2.5 A |
7 mm |
NO |
33 dB |
3 V |
-30 V |
e3 |
5000 ns |
27 ohm |
5000 ns |
1.35 ohm |
7 mm |
190 V |
||||||||||||||||||||||
|
Microchip Technology |
SPST |
COMMERCIAL |
48 |
LFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
4 mA |
1 |
8 |
HVCMOS |
GULL WING |
5 V |
4.5/13.2 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Multiplexer or Switches |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
SEPARATE OUTPUT |
13.2 V |
1.6 mm |
3 A |
7 mm |
Not Qualified |
NO |
33 dB |
4.5 V |
ALSO REQUIRES VPP (40V TO VNN +200V) AND VNN (-40V TO -160V) SUPPLY |
e3 |
5000 ns |
38 ohm |
5000 ns |
1.9 ohm |
7 mm |
|||||||||||||||||||
|
Microchip Technology |
SPST |
COMMERCIAL |
121 |
TFBGA |
SQUARE |
YES |
UNSPECIFIED |
20 mA |
32 |
BALL |
-4.5 V |
6 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA121,11x11,31 |
.8 mm |
70 Cel |
0 Cel |
BOTTOM |
S-XBGA-B121 |
SEPARATE OUTPUT |
6.3 V |
1.2 mm |
10 mm |
NC |
56 dB |
4.5 V |
-6.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
5000 ns |
8 ohm |
5000 ns |
4.7 ohm |
10 mm |
||||||||||||||||||||||||
|
Microchip Technology |
SPST |
48 |
LFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
2 mA |
2 |
8 |
HVCMOS |
GULL WING |
-100 V |
3.3 V |
3.3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Multiplexer or Switches |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
SEPARATE OUTPUT |
5.5 V |
1.6 mm |
2.5 A |
7 mm |
Not Qualified |
NO |
33 dB |
3 V |
-10 V |
e3 |
5000 ns |
32 ohm |
5000 ns |
1.6 ohm |
7 mm |
|||||||||||||||||||
|
Microchip Technology |
SPST |
48 |
LFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
8 mA |
1 |
24 |
HVCMOS |
GULL WING |
-160 V |
5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
COMMON OUTPUT |
5.5 V |
1.6 mm |
3 A |
7 mm |
NO |
33 dB |
3 V |
-30 V |
-40 V |
e3 |
5000 ns |
26 ohm |
5000 ns |
1.3 ohm |
7 mm |
-30 V |
||||||||||||||||||||
|
Microchip Technology |
SPST |
64 |
VFBGA |
SQUARE |
YES |
PLASTIC/EPOXY |
8 mA |
24 |
1 |
HVCMOS |
BALL |
5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA64,10X10,25 |
.65 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B64 |
SEPARATE OUTPUT |
5.5 V |
1 mm |
2 A |
7 mm |
NO |
33 dB |
3 V |
-30 V |
e1 |
5000 ns |
26 ohm |
5000 ns |
1.3 ohm |
7 mm |
30 V |
||||||||||||||||||||||
|
Microchip Technology |
SPDT |
COMMERCIAL |
64 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
3 mA |
1 |
32 |
NO LEAD |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.32SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N64 |
COMMON OUTPUT |
3 |
5.5 V |
1 mm |
3 A |
8 mm |
33 dB |
3 V |
-30 V |
e3 |
40 |
260 |
5000 ns |
38 ohm |
5000 ns |
1.9 ohm |
8 mm |
30 V |
||||||||||||||||||||
|
Microchip Technology |
SPDT |
COMMERCIAL |
64 |
HVQCCN |
SQUARE |
YES |
UNSPECIFIED |
3 mA |
1 |
32 |
NO LEAD |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.32SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N64 |
COMMON OUTPUT |
3 |
5.5 V |
1 mm |
3 A |
8 mm |
33 dB |
3 V |
-30 V |
e3 |
40 |
260 |
5000 ns |
38 ohm |
5000 ns |
1.9 ohm |
8 mm |
30 V |
Multiplexers and switches are electronic components used in digital and analog circuits to route signals between different inputs and outputs. They allow a single input signal to be sent to multiple output channels or vice versa.
A multiplexer, also known as a "mux," is a digital component that selects one of several input signals and forwards it to a single output. Multiplexers are often used in data communication systems to transmit multiple signals over a single communication channel. They can also be used in digital circuits to route control signals and address lines.
A switch is an electronic component that connects or disconnects two or more circuits. Switches can be mechanical or electronic and are used to control the flow of current in a circuit. In digital circuits, switches are used to connect or disconnect components and can be used to create logic gates and other digital components.
Multiplexers and switches are important components in various electronic systems, including communication systems, data processing systems, and control systems. They can be used to route signals between different parts of a circuit and to switch between different modes of operation. Multiplexers and switches can also be used to improve the efficiency of a system by reducing the number of components needed to perform a particular function.