30 Power Management ICs 242

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Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	Maximum Supply Current (Isup)	No. of Functions	No. of Channels	Technology	Terminal Form	Nominal Supply Voltage (Vsup)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Nominal Threshold Voltage (V)	Length	Adjustable Threshold
MAX77960BEFV06+T	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT		30	VQCCN	SQUARE	YES	UNSPECIFIED		1			NO LEAD	9 V		CHIP CARRIER, VERY THIN PROFILE	LCC30(UNSPEC)			85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N30	1	25.4 V	.6 mm	4 mm		3.5 V		e3	30	260	3.5	4 mm	YES
MAX77650EWV+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	5		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	5.5 V	.69 mm	2.148 mm		2.7 V		e2	30	260		2.748 mm	YES
MAX77659AENV+T	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT		30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	1.8 mA	1	2		BALL	3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	5.5 V	.5 mm	2.368 mm		2.7 V		e2	30	260	1.9	2.548 mm	YES
MAX8900BEWV+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	2 mA	1	1	BICMOS	BALL	6 V	6	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	8.7 V	.69 mm	2.375 mm	Not Qualified	3.4 V		e2	30	260		2.67 mm	YES
MAX77654DENV+T	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT		30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	8		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	5.5 V	.5 mm	2.338 mm		2.7 V		e2	30	260	2.85	2.788 mm	YES
MAX77650CEWV+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	5		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	5.5 V	.69 mm	2.148 mm		2.7 V		e2	30	260		2.748 mm	YES
MAX77654ENV+T	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT		30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	8		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B30		5.5 V	.5 mm	2.338 mm		2.7 V			30	260	2.85	2.788 mm	YES
MAX77654AENV+T	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT		30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	8		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	5.5 V	.5 mm	2.338 mm		2.7 V		e2	30	260	2.85	2.788 mm	YES
MAX77651AEWV+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.06 mA	1	4		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	5.5 V	.69 mm	2.148 mm		2.7 V		e2	30	260	+2.85V	2.748 mm	YES
MAX14728EWV+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	LFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.36 mA	1	1	BICMOS	BALL	5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	28 V	.69 mm	2.197 mm		3 V		e2	30	260	+10V	2.537 mm	YES
MAX77654AENVN+T	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT		30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	8		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	5.5 V	.5 mm	2.338 mm		2.7 V		e2	30	260	2.85	2.788 mm	YES
MAX77654ENVN+T	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT		30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	8		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B30		5.5 V	.5 mm	2.338 mm		2.7 V			30	260	2.85	2.788 mm	YES
MAX77651BEWVA+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	5		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	5.5 V	.69 mm	2.148 mm		2.7 V		e2	30	260		2.748 mm	YES
MAX77651EWV+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	5		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	5.5 V	.69 mm	2.148 mm		2.7 V		e2	30	260		2.748 mm	YES
MAX77960BEFV12+	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT		30	VQCCN	SQUARE	YES	UNSPECIFIED		1			NO LEAD	9 V		CHIP CARRIER, VERY THIN PROFILE	LCC30(UNSPEC)			85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N30	1	25.4 V	.6 mm	4 mm		3.5 V		e3	30	260	3.5	4 mm	YES
MAX77654CENV+T	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT		30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	8		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B30		5.5 V	.5 mm	2.338 mm		2.7 V			30	260	2.85	2.788 mm	YES
MAX77651BEWVA+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.06 mA	1	4		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	5.5 V	.69 mm	2.148 mm		2.7 V		e2	30	260	+2.85V	2.748 mm	YES
MAX77650AEWV+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	5		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	5.5 V	.69 mm	2.148 mm		2.7 V		e2	30	260		2.748 mm	YES
MAX77961BEFV06+	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT		30	VQCCN	SQUARE	YES	UNSPECIFIED		1			NO LEAD	9 V		CHIP CARRIER, VERY THIN PROFILE	LCC30(UNSPEC)			85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N30	1	25.4 V	.6 mm	4 mm		3.5 V		e3	30	260	3.5	4 mm	YES
MAX14727EWV+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	LFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.36 mA	1	1	BICMOS	BALL	5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	28 V	.69 mm	2.197 mm		3 V		e2	30	260	+13.75V	2.537 mm	YES
MAX77650CEWV+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.06 mA	1	4		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	5.5 V	.69 mm	2.148 mm		2.7 V		e2	30	260	+2.85V	2.748 mm	YES
MAX77650AEWV+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	5		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	5.5 V	.69 mm	2.148 mm		2.7 V		e2	30	260		2.748 mm	YES
MAX77654NENV+T	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT		30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	8		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	5.5 V	.5 mm	2.338 mm		2.7 V		e2	30	260	2.85	2.788 mm	YES
MAX8900BEWV+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	2 mA	1	1	BICMOS	BALL	6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	8.7 V	.69 mm	2.375 mm		3.4 V	ALSO HAS OVLO THRESHOLD 9V	e2	30	260	+3.2V	2.67 mm	YES
MAX14731EWV+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	LFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.36 mA	1	1	BICMOS	BALL	5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	28 V	.69 mm	2.197 mm		3 V		e2	30	260	+5.92V	2.537 mm	YES
MAX8900AEWV+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	BICMOS	BALL	6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	6.3 V	.69 mm	2.375 mm		3.4 V		e2	30	260		2.67 mm	YES
LA5317M	Onsemi		COMMERCIAL	30	SSOP	RECTANGULAR	YES	PLASTIC/EPOXY	3 mA				GULL WING	20 V	20	SMALL OUTLINE, SHRINK PITCH	SOP30,.4,40	Power Management Circuits	1 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G30					Not Qualified
LC05732A02RA	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				100 Cel	-40 Cel		BOTTOM	R-PBGA-B30		4.3 V	.625 mm	1.97 mm		2.2 V						4.01 mm	NO
LC05711ARA	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	100 Cel	-40 Cel		BOTTOM	R-PBGA-B30			.625 mm	1.97 mm								4.01 mm	NO
FAN54300UCX	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.5 mA	1	1		BALL	5 V	5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B30	1	6 V	.625 mm	2.26 mm	Not Qualified	4 V	ALSO REQUIRE 4 TO 9.5V VIN SUPPLY VOLTAGE	e1	30	260		2.46 mm	YES
LC05732A03RA	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				100 Cel	-40 Cel		BOTTOM	R-PBGA-B30		4.3 V	.625 mm	1.97 mm		2.2 V						4.01 mm	NO
LC05732A03RATBG	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	UFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.006 mA	1	1	MOS	BALL	4 V		GRID ARRAY, ULTRA THIN PROFILE, FINE PITCH	BGA30,4X10,16		.4 mm	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B30	1		.625 mm	1.97 mm				e1	30	260	+3.7V	4.01 mm	YES
LC05732ARA	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	100 Cel	-40 Cel		BOTTOM	R-PBGA-B30		4.3 V	.625 mm	1.97 mm		2.2 V						4.01 mm	NO
LC05732A02RATBG	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.006 mA	1	1	MOS	BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,4X9,16		.4 mm	100 Cel	-40 Cel		BOTTOM	R-PBGA-B30			.625 mm	1.97 mm					NOT SPECIFIED	NOT SPECIFIED	+3.7V	4.01 mm	NO
MAX8939BEWV+T	Maxim Integrated	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	9	BICMOS	BALL	3.7 V	3.7	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B30	1	5.5 V	.69 mm	2.52 mm	Not Qualified	2.9 V		e1	30	260		3.03 mm	YES
MAX8939EWV+T	Maxim Integrated	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	BICMOS	BALL	3.7 V	3.7	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B30	1	5.5 V	.69 mm	2.52 mm	Not Qualified	2.9 V		e1	30	260		3.03 mm	YES
MAX8939EWV+	Maxim Integrated		INDUSTRIAL	30	FBGA	RECTANGULAR	YES	PLASTIC/EPOXY				BICMOS	BALL	3.7 V	3.7	GRID ARRAY, FINE PITCH	BGA30,5X6,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B30	1				Not Qualified			e1	30	260
MAX8900CEWV+T	Maxim Integrated	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	2 mA	1	1	BICMOS	BALL	6 V	6	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	6.3 V	.69 mm	2.375 mm	Not Qualified	3.4 V		e2	30	260		2.67 mm	YES
MAX8939AEWV+T	Maxim Integrated	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	BICMOS	BALL	3.7 V	3.7	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B30	1	5.5 V	.69 mm	2.52 mm	Not Qualified	2.9 V		e1	30	260		3.03 mm	YES
MAX8967CEWV+	Maxim Integrated		INDUSTRIAL	30	FBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.12 mA			BICMOS	BALL		1.8,3.6	GRID ARRAY, FINE PITCH	BGA30,5X6,16	Power Management Circuits	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B30					Not Qualified
MAX77659ENV+	Maxim Integrated	POWER SUPPLY MANAGEMENT CIRCUIT		30	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	1.8 mA	1	2		BALL	3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B30	1	5.5 V	.5 mm	2.368 mm		2.7 V		e2	30	260	1.9	2.548 mm	YES
TD62650F	Toshiba	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	SSOP	RECTANGULAR	YES	PLASTIC/EPOXY	15 mA	1	1	BIPOLAR	GULL WING	8 V	5	SMALL OUTLINE, SHRINK PITCH	SOP30,.4,40	Power Management Circuits	1 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G30		17 V	2.7 mm	7.5 mm	Not Qualified	7 V	ADDITIONAL 5V SUPPLY REQUIRED		NOT SPECIFIED	NOT SPECIFIED		15.4 mm	NO
TD62652F	Toshiba	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	SSOP	RECTANGULAR	YES	PLASTIC/EPOXY	15 mA	1	1	BIPOLAR	GULL WING	8 V	5	SMALL OUTLINE, SHRINK PITCH	SOP30,.4,40	Power Management Circuits	1 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G30		17 V	2.7 mm	7.5 mm	Not Qualified	7 V	ADDITIONAL 5V SUPPLY REQUIRED		NOT SPECIFIED	NOT SPECIFIED		15.4 mm	NO
TD62652FG	Toshiba	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	SSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	BIPOLAR	GULL WING	8 V	5	SMALL OUTLINE, SHRINK PITCH	SOP30,.4,40	Power Management Circuits	1 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G30		17 V	2.7 mm	7.5 mm	Not Qualified	7 V	ADDITIONAL 5V SUPPLY REQUIRED		NOT SPECIFIED	NOT SPECIFIED		15.4 mm	NO
TD62650FG	Toshiba	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	SSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	BIPOLAR	GULL WING	8 V	5	SMALL OUTLINE, SHRINK PITCH	SOP30,.4,40	Power Management Circuits	1 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G30		17 V	2.7 mm	7.5 mm	Not Qualified	7 V	ADDITIONAL 5V SUPPLY REQUIRED		NOT SPECIFIED	NOT SPECIFIED		15.4 mm	NO
TD62651FG	Toshiba	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	SSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	BIPOLAR	GULL WING	8 V	5	SMALL OUTLINE, SHRINK PITCH	SOP30,.4,40	Power Management Circuits	1 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G30		17 V	2.7 mm	7.5 mm	Not Qualified	7 V	ADDITIONAL 5V SUPPLY REQUIRED		NOT SPECIFIED	NOT SPECIFIED		15.4 mm	NO
TD62651F	Toshiba	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	30	SSOP	RECTANGULAR	YES	PLASTIC/EPOXY	15 mA	1	1	BIPOLAR	GULL WING	8 V	5	SMALL OUTLINE, SHRINK PITCH	SOP30,.4,40	Power Management Circuits	1 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G30		17 V	2.7 mm	7.5 mm	Not Qualified	7 V	ADDITIONAL 5V SUPPLY REQUIRED		NOT SPECIFIED	NOT SPECIFIED		15.4 mm	NO
DA9168-XXU72	Renesas Electronics	POWER SUPPLY MANAGEMENT CIRCUIT		30	VFBGA	RECTANGULAR	YES	UNSPECIFIED		1	2		BALL	5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA30,5X6,16		.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBGA-B36		10 V	.56 mm	2.145 mm		4 V	IT ALSO HAS THRESHOLD 4, 4.2, 5.8, 6.53, 8.95, 11.05, 2, 2.8, 3, 4.6				+4.6	2.545 mm	YES

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.