Part | RoHS | Manufacturer | Other IC type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Surface Mount | Total Dose (V) | Maximum Switching Frequency | Package Body Material | Maximum Supply Current (Isup) | Maximum Output Current | Trim or Adjustable Output (V) | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Bandwidth | Terminal Form | Main Out Ripple Voltage | Control Technique | Nominal Negative Supply Voltage (Vsup) | Nominal Supply Voltage (Vsup) | Power Supplies (V) | Switcher Config | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Output Voltage | Control Mode | Protection(s) | Maximum Total Power Output | Minimum Operating Temperature | Terminal Finish | Maximum Output Voltage | Terminal Position | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width (mm) | Qualification | Normal Position (V) | Minimum Supply Voltage (Vsup) | Nominal Input Voltage | Additional Features | Minimum Input Voltage | Maximum Negative Input Voltage | JESD-609 Code | Switching (V) | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Maximum Switch-on Time | Maximum On-state Resistance (Ron) | Nominal Threshold Voltage (V) | Length | Adjustable Threshold | Nominal Output Voltage | Maximum Input Voltage |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
64 |
HTFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
2 |
GULL WING |
1.1 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
1.26 V |
1.2 mm |
10 mm |
.99 V |
ALSO REQUIRE SUPPLY VOLTAGE 3V TO 3.6V |
e4 |
30 |
260 |
10 mm |
NO |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
64 |
HTFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
2 |
GULL WING |
1.1 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
1.26 V |
1.2 mm |
10 mm |
.99 V |
ALSO REQUIRE SUPPLY VOLTAGE 3V TO 3.6V |
e4 |
30 |
260 |
10 mm |
NO |
||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
64 |
HLFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
9 |
CMOS |
GULL WING |
60 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
90 V |
1.6 mm |
10 mm |
16 V |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
YES |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
64 |
HLFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
9 |
CMOS |
GULL WING |
60 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
90 V |
1.6 mm |
10 mm |
16 V |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
YES |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
64 |
HLFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
9 |
CMOS |
AEC-Q100 |
GULL WING |
60 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
3 |
90 V |
1.6 mm |
10 mm |
16 V |
30 |
260 |
10 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
64 |
HTFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
14 mA |
1 |
1 |
GULL WING |
48 V |
48 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Power Management Circuits |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
57 V |
1.2 mm |
10 mm |
Not Qualified |
21.5 V |
e4 |
30 |
260 |
10 mm |
NO |
||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
64 |
HVQCCN |
SQUARE |
YES |
3100 kHz |
PLASTIC/EPOXY |
21 A |
1 |
9 |
NO LEAD |
13 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
3.575 V |
QUAD |
S-PQCC-N64 |
3 |
21 V |
1 mm |
8 mm |
5.6 V |
e4 |
30 |
12 |
260 |
8 mm |
YES |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
64 |
HTFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
14 mA |
1 |
1 |
GULL WING |
48 V |
48 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Power Management Circuits |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
57 V |
1.2 mm |
10 mm |
Not Qualified |
21.5 V |
e4 |
30 |
260 |
10 mm |
NO |
||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
64 |
HLFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
9 |
CMOS |
AEC-Q100 |
GULL WING |
60 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
3 |
90 V |
1.6 mm |
10 mm |
16 V |
30 |
260 |
10 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
64 |
HTFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
14 mA |
1 |
4 |
GULL WING |
48 V |
48 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Power Management Circuits |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
57 V |
1.2 mm |
10 mm |
Not Qualified |
44 V |
e4 |
30 |
260 |
10 mm |
NO |
||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
AUTOMOTIVE |
64 |
HTFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
GULL WING |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
HQFP64,.47SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
80 V |
1.2 mm |
10 mm |
e4 |
30 |
260 |
10 mm |
NO |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY SUPPORT CIRCUIT |
AUTOMOTIVE |
64 |
HVQCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
NO LEAD |
12 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-N64 |
80 V |
.8 mm |
7 mm |
6 V |
e3 |
11 mm |
YES |
||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
INDUSTRIAL |
64 |
HLFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
9 |
CMOS |
AEC-Q100 |
GULL WING |
50 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
3 |
75 V |
1.6 mm |
10 mm |
16 V |
30 |
260 |
10 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY SUPPORT CIRCUIT |
AUTOMOTIVE |
64 |
HVQCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
NO LEAD |
12 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-N64 |
80 V |
.8 mm |
7 mm |
6 V |
e3 |
11 mm |
YES |
||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY SUPPORT CIRCUIT |
AUTOMOTIVE |
64 |
HVQCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
NO LEAD |
12 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-N64 |
1 |
80 V |
.8 mm |
7 mm |
6 V |
e3 |
30 |
260 |
11 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY SUPPORT CIRCUIT |
AUTOMOTIVE |
64 |
HVQCCN |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
1 |
NO LEAD |
12 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-N64 |
1 |
80 V |
.8 mm |
7 mm |
6 V |
e3 |
30 |
260 |
11 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
64 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
NO LEAD |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N64 |
3 |
3.6 V |
1 mm |
9 mm |
3 V |
e4 |
30 |
260 |
9 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
POWER SUPPLY MANAGEMENT CIRCUIT |
64 |
HTFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
AEC-Q100 |
GULL WING |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
64 V |
1.2 mm |
10 mm |
9.6 V |
NOT SPECIFIED |
NOT SPECIFIED |
+22.78V |
10 mm |
NO |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
64 |
HQFP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
14 |
GULL WING |
FLATPACK, HEAT SINK/SLUG |
105 Cel |
-40 Cel |
QUAD |
R-PQFP-G64 |
3 |
61.6 V |
9.6 V |
40 |
260 |
NO |
|||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
64 |
HQFP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
14 |
GULL WING |
FLATPACK, HEAT SINK/SLUG |
105 Cel |
-40 Cel |
QUAD |
R-PQFP-G64 |
3 |
61.6 V |
9.6 V |
40 |
260 |
NO |
|||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
64 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
50 mA |
1 |
1 |
NO LEAD |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
Power Management Circuits |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N64 |
3 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
3 V |
e4 |
30 |
260 |
9 mm |
YES |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
POWER SUPPLY MANAGEMENT CIRCUIT |
64 |
HLFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
24 |
GULL WING |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
NICKEL GOLD PALLADIUM SILVER |
QUAD |
S-PQFP-G64 |
3 |
40 V |
1.6 mm |
10 mm |
3 V |
10 mm |
YES |
||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
64 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
50 mA |
1 |
1 |
NO LEAD |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
Power Management Circuits |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N64 |
3 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
3 V |
e4 |
30 |
260 |
9 mm |
YES |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
POWER SUPPLY MANAGEMENT CIRCUIT |
64 |
HLFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
24 |
GULL WING |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
NICKEL GOLD PALLADIUM SILVER |
QUAD |
S-PQFP-G64 |
3 |
40 V |
1.6 mm |
10 mm |
3 V |
10 mm |
YES |
||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
64 |
HLFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
9 |
CMOS |
AEC-Q100 |
GULL WING |
50 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
3 |
75 V |
1.6 mm |
10 mm |
15 V |
260 |
10 mm |
YES |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
64 |
HLFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
9 |
CMOS |
AEC-Q100 |
GULL WING |
50 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
3 |
75 V |
1.6 mm |
10 mm |
16 V |
30 |
260 |
10 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
64 |
HLFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
14 |
MOS |
AEC-Q100 |
GULL WING |
56 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
R-PQFP-G64 |
3 |
61.6 V |
1.6 mm |
10 mm |
9.6 V |
40 |
260 |
8.5 |
10 mm |
NO |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
64 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
NO LEAD |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N64 |
3 |
3.6 V |
1 mm |
9 mm |
3 V |
e4 |
30 |
260 |
9 mm |
YES |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
64 |
HLFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
9 |
CMOS |
AEC-Q100 |
GULL WING |
50 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
3 |
75 V |
1.6 mm |
10 mm |
15 V |
260 |
10 mm |
YES |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
64 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
8 |
CMOS |
NO LEAD |
12 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
MATTE TIN |
QUAD |
S-PQCC-N64 |
1 |
15 V |
.8 mm |
9 mm |
4.5 V |
ALSO OPERATES IN 3.3V |
e3 |
30 |
260 |
9 mm |
YES |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
64 |
HLFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
14 |
MOS |
AEC-Q100 |
GULL WING |
56 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
R-PQFP-G64 |
3 |
61.6 V |
1.6 mm |
10 mm |
9.6 V |
40 |
260 |
8.5 |
10 mm |
NO |
||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
64 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
4 |
CMOS |
NO LEAD |
12 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
MATTE TIN |
QUAD |
S-PQCC-N64 |
15 V |
.8 mm |
9 mm |
4.5 V |
e3 |
9 mm |
YES |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
AUTOMOTIVE |
64 |
HTFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
AEC-Q100 |
GULL WING |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
1.2 mm |
10 mm |
10 mm |
NO |
|||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
POWER SUPPLY MANAGEMENT CIRCUIT |
64 |
HTFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
AEC-Q100 |
GULL WING |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
64 V |
1.2 mm |
10 mm |
9.6 V |
NOT SPECIFIED |
NOT SPECIFIED |
+22.78V |
10 mm |
NO |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
AUTOMOTIVE |
64 |
HTFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
14 |
AEC-Q100 |
GULL WING |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
80 V |
1.2 mm |
10 mm |
e4 |
30 |
260 |
10 mm |
NO |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
64 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
8 |
CMOS |
NO LEAD |
12 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
MATTE TIN |
QUAD |
S-PQCC-N64 |
1 |
15 V |
.8 mm |
9 mm |
4.5 V |
ALSO OPERATES IN 3.3V |
e3 |
30 |
260 |
9 mm |
YES |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
64 |
HQFP |
RECTANGULAR |
YES |
PLASTIC/EPOXY |
1 |
8 |
GULL WING |
FLATPACK, HEAT SINK/SLUG |
105 Cel |
-40 Cel |
QUAD |
R-PQFP-G64 |
3 |
61.6 V |
9.6 V |
40 |
260 |
NO |
|||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
64 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
NO LEAD |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N64 |
3 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
3 V |
e4 |
30 |
260 |
9 mm |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
POWER SUPPLY SUPPORT CIRCUIT |
INDUSTRIAL |
64 |
HLFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
14 |
MOS |
GULL WING |
56 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
61.6 V |
1.6 mm |
10 mm |
9.6 V |
10 mm |
NO |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
COMMERCIAL |
64 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
4 |
CMOS |
NO LEAD |
12 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-N64 |
15 V |
.8 mm |
9 mm |
4.5 V |
e3 |
9 mm |
YES |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
64 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
4 |
CMOS |
NO LEAD |
12 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
MATTE TIN |
QUAD |
S-PQCC-N64 |
1 |
15 V |
.8 mm |
9 mm |
4.5 V |
e3 |
30 |
260 |
9 mm |
YES |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
POWER SUPPLY MANAGEMENT CIRCUIT |
COMMERCIAL |
64 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
4 |
CMOS |
NO LEAD |
12 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-N64 |
15 V |
.8 mm |
9 mm |
4.5 V |
e3 |
9 mm |
YES |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
AUTOMOTIVE |
64 |
HTFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
16 |
AEC-Q100 |
GULL WING |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
80 V |
1.2 mm |
10 mm |
e4 |
30 |
260 |
10 mm |
NO |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
64 |
HTFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
14 mA |
1 |
4 |
GULL WING |
48 V |
48 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Power Management Circuits |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
57 V |
1.2 mm |
10 mm |
Not Qualified |
44 V |
e4 |
30 |
260 |
10 mm |
NO |
||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
64 |
HTFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
14 mA |
1 |
4 |
GULL WING |
48 V |
48 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Power Management Circuits |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
57 V |
1.2 mm |
10 mm |
Not Qualified |
44 V |
e4 |
30 |
260 |
10 mm |
NO |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
POWER SUPPLY MANAGEMENT CIRCUIT |
64 |
LQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
54 |
AEC-Q100 |
GULL WING |
3.3 V |
FLATPACK, LOW PROFILE |
QFP64,.47SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
TIN |
DUAL |
S-PQFP-G64 |
3 |
3.6 V |
1.6 mm |
10 mm |
2.7 V |
e3 |
40 |
260 |
+2.73V |
10 mm |
YES |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY MANAGEMENT CIRCUIT |
AUTOMOTIVE |
64 |
HVQCCN |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
1 |
NO LEAD |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N64 |
3 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
3 V |
e4 |
30 |
260 |
9 mm |
YES |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
POWER SUPPLY SUPPORT CIRCUIT |
64 |
HTFQFP |
SQUARE |
YES |
PLASTIC/EPOXY |
1 |
12 |
AEC-Q100 |
GULL WING |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
80 V |
1.2 mm |
10 mm |
e4 |
260 |
10 mm |
NO |
Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.
PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.
PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.
One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.