9 Power Management ICs 205

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Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	Maximum Supply Current (Isup)	No. of Functions	No. of Channels	Technology	Terminal Form	Nominal Supply Voltage (Vsup)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Nominal Threshold Voltage (V)	Length	Adjustable Threshold
LC709203FXE-01MH	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	CMOS	BALL	3.6 V	2.5/4.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B9	1	4.5 V	.51 mm	1.6 mm	Not Qualified	2.5 V		e1	30	260		1.76 mm
MAX17262REWL+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.03 mA	1	1		BALL			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B9	1	4.9 V	.69 mm	1.448 mm		2.3 V		e2	30	260		1.468 mm	NO
FUSB302BUCX	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B9	1	5.5 V	.526 mm	1.215 mm		2.7 V		e1	30	260		1.26 mm	YES
FUSB302UCX	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	2		BALL	3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B9	1	5.5 V	.619 mm	1.215 mm		3 V		e1	30	260		1.26 mm	YES
STC3117IJT	STMicroelectronics	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B9		4.5 V	.705 mm	1.46 mm		2.7 V			NOT SPECIFIED	NOT SPECIFIED		1.564 mm	YES
FSFR2100USL	Onsemi	POWER SUPPLY SUPPORT CIRCUIT		9		RECTANGULAR	NO	UNSPECIFIED		1	1		THROUGH-HOLE			FLANGE MOUNT						MATTE TIN	ZIG-ZAG	R-XZFM-T9					Not Qualified			e3					NO
MAX17260SEWL+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT		9	VFBGA	RECTANGULAR	YES	UNSPECIFIED	.03 mA	1	1		BALL			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-XBGA-B9	1	4.9 V	.69 mm	1.448 mm		2.3 V		e2	30	260		1.468 mm	NO
FSFR2100US	Onsemi	POWER SUPPLY SUPPORT CIRCUIT		9		RECTANGULAR	NO	UNSPECIFIED		1	1		THROUGH-HOLE			FLANGE MOUNT						MATTE TIN	ZIG-ZAG	R-XZFM-T9					Not Qualified			e3					NO
MAX17043X+T10	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT	OTHER	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.6 V	2.5/4.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,16	Power Management Circuits	.4 mm	70 Cel	-20 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B9	1	4.5 V	.69 mm	1.415 mm	Not Qualified	2.5 V		e2	30	260		1.595 mm	NO
FSFR2100U	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	AUTOMOTIVE	9	ZIP	RECTANGULAR	NO	PLASTIC/EPOXY		1	1		THROUGH-HOLE			FLANGE MOUNT	ZIP9/13,.13,.05		1.27 mm	130 Cel	-40 Cel		ZIG-ZAG	R-XZFM-T9				10.7 mm								26.2 mm
BQ27426YZFR	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-PBGA-B9	1	4.5 V	.625 mm	1.58 mm		2.45 V		e1	30	260		1.62 mm	NO
FSUSB242UCX	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	1		BALL	4.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B9	1	5.5 V	.526 mm	1.2 mm		2.7 V		e1	30	260		1.2 mm	NO
MAX17055EWL+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B9	1	4.9 V	.69 mm	1.407 mm		2.3 V		e2	30	260		1.498 mm	NO
MAX17043X+	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT	OTHER	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.6 V	2.5/4.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,16	Power Management Circuits	.4 mm	70 Cel	-20 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B9	1	4.5 V	.69 mm	1.415 mm	Not Qualified	2.5 V		e2	30	260		1.595 mm	NO
MAX17260SEWL+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B9	1	4.9 V	.69 mm	1.448 mm		2.3 V		e2	30	260		1.468 mm	NO
LC709203FXE-05MH	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY	.0045 mA	1	1		BALL	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20		.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B9	1	4.5 V	.51 mm	1.6 mm		2.5 V		e1	30	260		1.76 mm	NO
LC709203FXE-03MH	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	CMOS	BALL	3.6 V	2.5/4.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B9	1	4.5 V	.51 mm	1.6 mm	Not Qualified	2.5 V		e1	30	260		1.76 mm
BQ27220YZFR	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	UNSPECIFIED		1	1		BALL	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-XBGA-B9	1	4.5 V	.625 mm	1.58 mm		2.45 V		e1	30	260		1.6205 mm	NO
BQ27421YZFR-G1A	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.6 V	3.6	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B9	1	4.5 V	.625 mm	1.58 mm	Not Qualified	2.45 V		e1	30	260		1.62 mm	NO
BQ27426YZFT	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-PBGA-B9	1	4.5 V	.625 mm	1.58 mm		2.45 V		e1	30	260		1.62 mm	NO
MAX17055EWL+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B9	1	4.9 V	.69 mm	1.407 mm		2.3 V		e2	30	260		1.498 mm	NO
MAX17260BEWL+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT		9	VFBGA	RECTANGULAR	YES	UNSPECIFIED	.03 mA	1	1		BALL			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-XBGA-B9	1	4.9 V	.69 mm	1.448 mm		2.3 V		e2	30	260		1.468 mm	NO
MAX17260BEWL+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT		9	VFBGA	RECTANGULAR	YES	UNSPECIFIED	.03 mA	1	1		BALL			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-XBGA-B9	1	4.9 V	.69 mm	1.448 mm		2.3 V		e2	30	260		1.468 mm	NO
TUSB422IYFPR	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	UNSPECIFIED		1	1		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B9	1	5.5 V	.5 mm	1.335 mm		2.7 V		e1	30	260		1.38 mm	NO
FUSB300CUCX	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	2		BALL	3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B9	1	3.5 V	.625 mm	1.215 mm		3 V		e1	30	260		1.215 mm	YES
BQ27621YZFR-G1A	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	UNSPECIFIED	.027 mA	1	1		BALL	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-XBGA-B9	1	4.5 V	.625 mm	1.58 mm		2.45 V		e1	30	260		1.6205 mm	NO
BQ27220YZFT	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	UNSPECIFIED		1	1		BALL	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-XBGA-B9	1	4.5 V	.625 mm	1.58 mm		2.45 V		e1	30	260		1.6205 mm	NO
BQ27421YZFT-G1B	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.6 V	3.6	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B9	1	4.5 V	.625 mm	1.58 mm	Not Qualified	2.45 V		e1	30	260		1.62 mm	NO
MAX20340EWL+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9		SQUARE	YES	PLASTIC/EPOXY	.05 mA	1	1		BALL	5 V						85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	S-PBGA-B9	1	5.5 V				3.4 V		e2	30	260			YES
MAX20340EWL+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9		SQUARE	YES	PLASTIC/EPOXY	.05 mA	1	1		BALL	5 V						85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	S-PBGA-B9	1	5.5 V				3.4 V		e2	30	260			YES
BQ27421YZFR-G1B	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	3.6 V	3.6	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B9	1	4.5 V	.625 mm	1.58 mm	Not Qualified	2.45 V		e1	30	260		1.62 mm	NO
FSFR1800L	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	AUTOMOTIVE	9	ZIP	RECTANGULAR	NO	PLASTIC/EPOXY		1	1		THROUGH-HOLE			FLANGE MOUNT	ZIP9/13H,.15,.5		1.27 mm	130 Cel	-40 Cel	Matte Tin (Sn)	ZIG-ZAG	R-XZFM-T9				10.7 mm				e3				26.2 mm
MAX17261MEWL+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B9	1	4.9 V	.69 mm	1.448 mm		2.3 V		e2	30	260		1.468 mm	NO
MAX17261MEWL+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B9	1	4.9 V	.69 mm	1.448 mm		2.3 V		e2	30	260		1.468 mm	NO
MAX17262REWL+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B9	1	4.9 V	.69 mm	1.448 mm		2.3 V		e2	30	260		1.468 mm	NO
BQ27427YZFR	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT		9	VFBGA	RECTANGULAR	YES	UNSPECIFIED		1	1		BALL	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20		.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B9	1	4.5 V	.625 mm	1.58 mm		2.45 V		e1	30	260		1.6205 mm	NO
FSFR1800US	Onsemi	POWER SUPPLY SUPPORT CIRCUIT		9		RECTANGULAR	NO	UNSPECIFIED		1	1		THROUGH-HOLE			FLANGE MOUNT						TIN	ZIG-ZAG	R-XZFM-T9					Not Qualified			e3					NO
LC709203FXE-02MH	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	CMOS	BALL	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B9	1	4.5 V	.51 mm	1.6 mm		2.5 V		e1				1.76 mm
LC709203FXE-04MH	Onsemi	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	CMOS	BALL	3.6 V	2.5/4.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B9	1	4.5 V	.51 mm	1.6 mm	Not Qualified	2.5 V		e1				1.76 mm
TUSB422IYFPT	Texas Instruments	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	VFBGA	RECTANGULAR	YES	UNSPECIFIED		1	1		BALL	3.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B9	1	5.5 V	.5 mm	1.335 mm		2.7 V		e1	30	260		1.38 mm	NO
TA7900S	Toshiba	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	9	SIP	RECTANGULAR	NO	PLASTIC/EPOXY		1	1	BIPOLAR	THROUGH-HOLE			IN-LINE			2.54 mm	85 Cel	-40 Cel	TIN LEAD	SINGLE	R-PSIP-T9		17 V	7.9 mm	3.2 mm	Not Qualified	7 V		e0				22.28 mm	NO
LM8805TLX-3.0	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	1		BALL			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B9		5.5 V	.6 mm	1.465 mm		1 V						1.465 mm	NO
LM8805TLE-3.0/NOPB	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	FBGA	SQUARE	YES	PLASTIC/EPOXY	.05 mA	1	1		BALL		2.5/5	GRID ARRAY, FINE PITCH	BGA9,3X3,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B9	1	5.5 V		1.46 mm	Not Qualified	1 V	RESET THRESHOLD VOLTAGE IS 2.3V	e1	30	260	+2.3V	1.46 mm	NO
LM8805TLE	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	1		BALL			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B9		5.5 V	.6 mm	1.465 mm		1 V						1.465 mm	NO
LM8805TLX-3.0/NOPB	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	FBGA	SQUARE	YES	PLASTIC/EPOXY	.05 mA	1	1		BALL		2.5/5	GRID ARRAY, FINE PITCH	BGA9,3X3,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B9	1	5.5 V		1.46 mm	Not Qualified	1 V	RESET THRESHOLD VOLTAGE IS 2.3V	e1	30	260	+2.3V	1.46 mm	NO
LM8805TLE/NOPB	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	FBGA	SQUARE	YES	PLASTIC/EPOXY	.05 mA	1	1		BALL		2.5/5	GRID ARRAY, FINE PITCH	BGA9,3X3,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B9	1	5.5 V		1.46 mm	Not Qualified	1 V	RESET THRESHOLD VOLTAGE IS 2.3V	e1	30	260	+2.3V	1.46 mm	NO
LM8805TLE-3.0	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	1		BALL			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B9		5.5 V	.6 mm	1.465 mm		1 V						1.465 mm	NO
LM8805TLX	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	9	VFBGA	SQUARE	YES	PLASTIC/EPOXY		1	1		BALL			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B9		5.5 V	.6 mm	1.465 mm		1 V						1.465 mm	NO

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.