HVQCCN Power Management ICs 2,400+

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Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	Maximum Supply Current (Isup)	No. of Functions	No. of Channels	Technology	Screening Level	Terminal Form	Nominal Supply Voltage (Vsup)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Nominal Threshold Voltage (V)	Length	Adjustable Threshold
LT3651IUHE-4.2#PBF	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	AUTOMOTIVE	36	HVQCCN	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	BIPOLAR		NO LEAD	20 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-N36	1	32 V	.8 mm	5 mm	Not Qualified	6.5 V		e3	30	260		6 mm	YES
LTC1955EUH	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	32	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	2			NO LEAD	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N32	1	5.5 V	.8 mm	5 mm	Not Qualified	2.7 V		e0				5 mm	YES
LTC1955EUH#TRPBF	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	32	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	2			NO LEAD	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N32	1	5.5 V	.8 mm	5 mm	Not Qualified	2.7 V		e3	30	260		5 mm	YES
LTC2928IUHF	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	38	HVQCCN	RECTANGULAR	YES	PLASTIC/EPOXY		1	4	CMOS		NO LEAD	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	R-PQCC-N38	1	6 V	.8 mm	5 mm	Not Qualified	2.9 V		e0				7 mm	YES
LTC2936IUFD#PBF	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	24	HVQCCN	RECTANGULAR	YES	PLASTIC/EPOXY	1.5 mA	1		CMOS		NO LEAD	12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16X.2,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQCC-N24		13.9 V	.8 mm	4 mm		3.4 V		e3			+1V	5 mm	YES
LTC2937MPUHE#TRPBF	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	MILITARY	28	HVQCCN	RECTANGULAR	YES	PLASTIC/EPOXY		1	6	CMOS		NO LEAD	12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-55 Cel	MATTE TIN	QUAD	R-PQCC-N28		16.5 V	.8 mm	5 mm		4.5 V		e3				6 mm	YES
LTC2970CUFD#PBF	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT	COMMERCIAL	24	HVQCCN	RECTANGULAR	YES	PLASTIC/EPOXY	5 mA	1	2	CMOS		NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16X.2,20		.5 mm	70 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-N24	1	5.75 V	.8 mm	4 mm	Not Qualified	4.5 V	SEATED HT-CALCULATED	e3	30	260		5 mm	YES
LTC2970IUFD#PBF	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	24	HVQCCN	RECTANGULAR	YES	PLASTIC/EPOXY	5 mA	1	2	CMOS		NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16X.2,20		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-N24	1	5.75 V	.8 mm	4 mm	Not Qualified	4.5 V	SEATED HT-CALCULATED	e3	30	260		5 mm	YES
LTC3676EUJ#PBF	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	40	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	8	CMOS		NO LEAD	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQCC-N40	1	5.5 V	.8 mm	6 mm		2.7 V	THRESHOLD VOLTAGE(NOM)=0.4 V	e3	30	260	+0.4V	6 mm	YES
LTC3676EUJ#TRPBF	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	40	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	8	CMOS		NO LEAD	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQCC-N40	1	5.5 V	.8 mm	6 mm		2.7 V	THRESHOLD VOLTAGE(NOM)=0.4 V	e3	30	260	+0.4V	6 mm	YES
LTC4001EUF-1#PBF	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	OTHER	16	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	1	CMOS		NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-N16	1	5.5 V	.8 mm	4 mm	Not Qualified	4 V		e3	30	260		4 mm	YES
LTC4266AIUHF-3#PBF	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	38	HVQCCN	RECTANGULAR	YES	PLASTIC/EPOXY	3 mA	1	1	CMOS		NO LEAD	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC38,.2X.28,20		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-N38	1	4.3 V	.8 mm	5 mm	Not Qualified	3 V		e3	30	260		7 mm
LTC4281CUFD#TRPBF	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	COMMERCIAL	28	HVQCCN	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	CMOS		NO LEAD	12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQCC-N28	1	33 V	.8 mm	4 mm		2.9 V		e3	30	260		5 mm	YES
LTC4282AUH#TRPBF	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT		32	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	8 mA	1	2	CMOS		NO LEAD	12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		33 V	.8 mm	5 mm		2.9 V					1.28	5 mm	YES
LTC4282CUH#PBF	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	COMMERCIAL	32	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	4	CMOS		NO LEAD	12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-N32		33 V	.8 mm	5 mm		2.9 V		e3				5 mm	YES
LTC4282CUH#TRPBF	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	COMMERCIAL	32	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	4	CMOS		NO LEAD	12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-N32		33 V	.8 mm	5 mm		2.9 V		e3				5 mm	YES
LTC4282IUH#TRPBF	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	32	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	4	CMOS		NO LEAD	12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N32		33 V	.8 mm	5 mm		2.9 V		e3				5 mm	YES
LTC7862IUFD#TRPBF	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	AUTOMOTIVE	20	HVQCCN	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	CMOS		NO LEAD	12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	R-PQCC-N20	1	140 V	.8 mm	4 mm		4 V		e3		260		5 mm	YES
MAX17526BATP+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	AUTOMOTIVE	20	HVQCCN	SQUARE	YES	UNSPECIFIED	1.9 mA	1	1			NO LEAD	24 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.2SQ,25		.65 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	60 V	.8 mm	5 mm		5.5 V		e3	30	260	+12.4V	5 mm	YES
MAX20095ATIC/VY+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	AUTOMOTIVE	28	HVQCCN	SQUARE	YES	UNSPECIFIED	.055 mA	1	1		AEC-Q100	NO LEAD	14 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20		.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N28	1	36 V	.8 mm	5 mm		4.5 V		e3	30	260		5 mm	YES
MAX5954LETX+T	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	36	HVQCCN	SQUARE	YES	UNSPECIFIED		1	3	BICMOS		NO LEAD	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N36	1	3.6 V	.8 mm	6 mm	Not Qualified	3 V	ALSO REQUIRES 12V SUPPLY	e3	30	260		6 mm	NO
MAX6795TPYD2+	Maxim Integrated	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	20	HVQCCN	SQUARE	YES	UNSPECIFIED	.22 mA	1	1	BICMOS		NO LEAD	14 V	14	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	Automotive Circuits	.65 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N20	1	72 V	.8 mm	5 mm	Not Qualified	5 V	FIXED OR ADJ WATCH DOG TIMEOUT PERIODS	e3				5 mm	NO
MAX6870ETJ	Maxim Integrated	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	32	HVQCCN	SQUARE	YES	UNSPECIFIED	2 mA	1	6	BICMOS		NO LEAD	6.5 V	3/5,6/13	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	Power Management Circuits	.65 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	5.5 V	.8 mm	7 mm	Not Qualified	2.7 V		e0				7 mm	NO
MAX6870ETJ+	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	32	HVQCCN	SQUARE	YES	UNSPECIFIED		1	6	BICMOS		NO LEAD	6.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N32	1	5.5 V	.8 mm	7 mm	Not Qualified	2.7 V		e3	30	260		7 mm	NO
MAX6870ETJ-T	Maxim Integrated	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	32	HVQCCN	SQUARE	YES	UNSPECIFIED		1	6	BICMOS		NO LEAD	6.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N32		5.5 V	.8 mm	7 mm	Not Qualified	2.7 V		e0				7 mm	NO
MAX6870ETJ+T	Analog Devices	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	32	HVQCCN	SQUARE	YES	UNSPECIFIED	2 mA	1	6	BICMOS		NO LEAD	6.5 V	3/5,6/13	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	Power Management Circuits	.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N32	1	5.5 V	.8 mm	7 mm	Not Qualified	2.7 V		e3	30	260		7 mm	NO
MAX8677AETG+	Analog Devices	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	24	HVQCCN	SQUARE	YES	UNSPECIFIED	2 mA	1	1	BICMOS		NO LEAD	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	6.6 V	.8 mm	4 mm	Not Qualified	4.1 V		e3	30	260		4 mm	YES
MC32PF3000A0EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED		1	12	MOS		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm		2.8 V	ALSO REQUIRE SUPPLY VOLTAGE 3.7V TO 5.5V	e3	40	260		7 mm	YES
MC32PF3001A3EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED		1	10			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm		2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260		7 mm	YES
MC33FS8510D3ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	25 mA	1	6		AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm		5.1 V		e3	40	260	+7.5V	8 mm	NO
MC33FS8510D3ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	25 mA	1	6		AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm		5.1 V		e3	40	260	+7.5V	8 mm	NO
MC33PF8100EAES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm		2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8100EAESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm		2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8100EPES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm		2.7 V		e3	40	260		8 mm	YES
MC34PF3001A3EP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED		1	10			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm		2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260		7 mm	YES
MCP16501TD-E/RMB	Microchip Technology	POWER SUPPLY SUPPORT CIRCUIT	AUTOMOTIVE	24	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	4			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N24		5.5 V	.9 mm	4 mm		2.7 V					+2.55V	4 mm	YES
MCP16502TAA-E/S8B	Microchip Technology	POWER SUPPLY SUPPORT CIRCUIT	AUTOMOTIVE	32	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	6			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.12SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N32		5.5 V	1 mm	5 mm		2.7 V			NOT SPECIFIED	NOT SPECIFIED		5 mm	YES
MCP16502TAA-E/S8BVAO	Microchip Technology	POWER SUPPLY SUPPORT CIRCUIT	AUTOMOTIVE	32	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	6		AEC-Q100	NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.12SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N32		5.5 V	1 mm	5 mm		2.7 V			NOT SPECIFIED	NOT SPECIFIED		5 mm	YES
MCP39F501T-E/MQ	Microchip Technology	SWITCHING REGULATOR		28	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	2			NO LEAD	3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20		.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N28		3.6 V	1 mm	5 mm		2.7 V		e3				5 mm	YES
MCP73862-I/ML	Microchip Technology	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	16	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	4 mA	1	2			NO LEAD		4.5/12	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Power Management Circuits	.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	1	12 V	1 mm	4 mm	Not Qualified	8.7 V		e3				4 mm	NO
MMPF0100F3ANESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	14	MOS		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		e3	40	260		8 mm	YES
MMPF0100F6AEPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	14	MOS		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		e3	40	260		8 mm	YES
MMPF0100NPEP	Freescale Semiconductor	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	14			NO LEAD	3.6 V	2.8/4.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm	Not Qualified	2.8 V		e3	40	260		8 mm	YES
MMPF0100NPEPR2	Freescale Semiconductor	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	14			NO LEAD	3.6 V	2.8/4.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm	Not Qualified	2.8 V		e3	40	260		8 mm	YES
MP8020GQV	Monolithic Power Systems	POWER SUPPLY SUPPORT CIRCUIT		18	HVQCCN	RECTANGULAR	YES	UNSPECIFIED		1	1			NO LEAD	54 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC18,.12X.2,25		.65 mm	125 Cel	-40 Cel		QUAD	R-XQCC-N18		57 V	1 mm	3 mm		0 V					12.5	5 mm	NO
MP8020GQV-Z	Monolithic Power Systems	POWER SUPPLY SUPPORT CIRCUIT		18	HVQCCN	RECTANGULAR	YES	UNSPECIFIED		1	1			NO LEAD	54 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC18,.12X.2,25		.65 mm	125 Cel	-40 Cel		QUAD	R-XQCC-N18		57 V	1 mm	3 mm		0 V					12.5	5 mm	NO
NCV8855BMNR2G	Onsemi	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	40	HVQCCN	SQUARE	YES	UNSPECIFIED		1	1			NO LEAD	13.2 V	13.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Power Management Circuits	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N40	1	18 V	1 mm	6 mm	Not Qualified	9 V		e3	30	260		6 mm	YES
NXQ1TXA5/404J	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	32	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	5000 mA	1	2			NO LEAD	5 V	3.5/5.25	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Power Management Circuits	.5 mm	85 Cel	-20 Cel		QUAD	S-PQCC-N32	1	5.25 V	.85 mm	5 mm	Not Qualified	3.5 V	SEATED HEIGHT-NOM			260		5 mm	NO

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.