QCCN Power Management ICs 465

Reset All

Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	Maximum Supply Current (Isup)	No. of Functions	No. of Channels	Technology	Terminal Form	Nominal Supply Voltage (Vsup)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Qualification	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Nominal Threshold Voltage (V)	Length	Adjustable Threshold
MC34PF1550A2EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC34PF1550A9EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC32PF4210A3ES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		56	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	14		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	0 Cel		QUAD	S-PQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		40	260	+2.4V	8 mm	YES
MC32PF4210A1ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		56	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	14		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	0 Cel		QUAD	S-PQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		40	260	+2.4V	8 mm	YES
MC32PF4210A4ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		56	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	14		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	0 Cel		QUAD	S-PQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		40	260	+2.4V	8 mm	YES
MC32PF1550A7EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC34PF1550A3EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC32PF1550A0EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V		40	260	+6.5V	5 mm	YES
MC32PF4210A2ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		56	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	14		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	0 Cel		QUAD	S-PQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		40	260	+2.4V	8 mm	YES
MC34PF4210A4ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		56	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	14		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		40	260	+2.4V	8 mm	YES
MC34PF1550A1EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC32PF4210A0ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		56	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	14		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	0 Cel		QUAD	S-PQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		40	260	+2.4V	8 mm	YES
MC32PF1550A2EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC32PF1550A9EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC34PF1550A5EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC32PF4210A4ES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		56	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	14		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	0 Cel		QUAD	S-PQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		40	260	+2.4V	8 mm	YES
MC34PF1550A0EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC32PF1550A8EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V		40	260	+6.5V	5 mm	YES
MC32PF1550A7EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC34PF1550A8EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC32PF4210A3ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		56	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	14		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	0 Cel		QUAD	S-PQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		40	260	+2.4V	8 mm	YES
MC32PF1550A2EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC32PF4210A2ES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		56	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	14		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	0 Cel		QUAD	S-PQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		40	260	+2.4V	8 mm	YES
MC32PF1550A5EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC32PF1550A1EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC32PF4210A0ES	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		56	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	14		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	0 Cel		QUAD	S-PQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		40	260	+2.4V	8 mm	YES
MC34PF1550A9EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC34PF1550A7EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC34PF1550A8EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC34PF4210A3ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		56	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	14		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		40	260	+2.4V	8 mm	YES
MC34PF4210A0ESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		56	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	14		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		40	260	+2.4V	8 mm	YES
MC34PF1550A3EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC34PF1550A0EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC32PF1550A8EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC34PF1550A7EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC32PF1550A9EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC32PF1550A0EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MC34PF1550A2EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V	e4	40	260	+6.5V	5 mm	YES
MB39A302WQN	Infineon Technologies	POWER SUPPLY SUPPORT CIRCUIT	OTHER	48	QCCN	SQUARE	YES	PLASTIC/EPOXY					NO LEAD	12 V	12	CHIP CARRIER	LCC48,.28SQ,20	Power Management Circuits	.5 mm	85 Cel	-30 Cel		QUAD	S-PQCC-N48					Not Qualified
TLF35584QVVS2	Infineon Technologies	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	48	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	1		NO LEAD			CHIP CARRIER				150 Cel	-40 Cel		QUAD	S-PQCC-N48	3											NO
935281214125	Nexperia	POWER SUPPLY SUPPORT CIRCUIT	AUTOMOTIVE	8	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	1	CMOS	NO LEAD	3.3 V		CHIP CARRIER				125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N8	1	5.5 V	.5 mm	1.6 mm		2.3 V	e4	30	260		1.6 mm	NO
AP9060FM8-7	Diodes Incorporated	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	3	QCCN	RECTANGULAR	YES	UNSPECIFIED	.031 mA	1	1		NO LEAD	5 V	3/30	SPECIAL SHAPE	LCC3(UNSPEC)	Power Management Circuits		85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	UNSPECIFIED	R-XXSS-N3	1	30 V	.83 mm	1.1 mm	Not Qualified	3 V	e4	30	260		1.4 mm	NO
MAX6882ETE	Maxim Integrated		INDUSTRIAL	16	QCCN	SQUARE	YES	PLASTIC/EPOXY	1.8 mA			BICMOS	NO LEAD		3/5	CHIP CARRIER	LCC16,.16SQ,25	Power Management Circuits	.635 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N16					Not Qualified		e0
5962-9326705M2X	Maxim Integrated	POWER SUPPLY MANAGEMENT CIRCUIT	MILITARY		QCCN		YES	CERAMIC, METAL-SEALED COFIRED		1	1		NO LEAD			CHIP CARRIER				125 Cel	-55 Cel	TIN LEAD	QUAD			5.5 V			Not Qualified	1.2 V	e0					NO
MAX16002BTC	Maxim Integrated		AUTOMOTIVE	12	QCCN	SQUARE	YES	PLASTIC/EPOXY	.07 mA			BICMOS	NO LEAD		2.5/5	CHIP CARRIER	LCC12,.16SQ,32	Power Management Circuits	.8 mm	125 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N12					Not Qualified		e0
MAX16009TG	Maxim Integrated		AUTOMOTIVE	24	QCCN	SQUARE	YES	PLASTIC/EPOXY	.07 mA				NO LEAD		2.5/5	CHIP CARRIER	LCC24,.16SQ,20	Power Management Circuits	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N24					Not Qualified		e0			+1.24V		YES
MAX16000DTC	Maxim Integrated		AUTOMOTIVE	12	QCCN	SQUARE	YES	PLASTIC/EPOXY	.07 mA			BICMOS	NO LEAD		2.5/5	CHIP CARRIER	LCC12,.16SQ,32	Power Management Circuits	.8 mm	125 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N12					Not Qualified		e0
MAX8845YETC+T	Maxim Integrated		INDUSTRIAL	12	QCCN	SQUARE	YES	PLASTIC/EPOXY				BICMOS	NO LEAD	5 V	5	CHIP CARRIER	LCC12,.12SQ,20	Power Management Circuits	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N12	3				Not Qualified		e3	30	260

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.