NXP Semiconductors Power Management ICs 2,400+

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Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	Maximum Supply Current (Isup)	No. of Functions	No. of Channels	Technology	Screening Level	Terminal Form	Nominal Supply Voltage (Vsup)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Qualification	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Nominal Threshold Voltage (V)	Length	Adjustable Threshold
MMPF0200F0AEPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	12	MOS		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V			40	260		8 mm	YES
MC32PF3000A6EP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED		1	12	MOS		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm		2.8 V	ALSO REQUIRE SUPPLY VOLTAGE 3.7V TO 5.5V	e3	40	260		7 mm	YES
MC33771BTA1AE/R2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	64	HLFQFP	SQUARE	YES	PLASTIC/EPOXY		1	14	MOS		GULL WING	56 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	105 Cel	-40 Cel		QUAD	S-PQFP-G64		61.6 V	1.6 mm	10 mm		9.6 V						10 mm	NO
MC33772BTA1AE	NXP Semiconductors																									3								40	260
MC34PF3000A3EP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED		1	12	MOS		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm		2.8 V	ALSO REQUIRE SUPPLY VOLTAGE 3.7V TO 5.5V	e3	40	260		7 mm	YES
MM9Z1J638BM2EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	48	HVQCCN	SQUARE	YES	UNSPECIFIED	40 mA	1	1		AEC-Q100	NO LEAD	1.8 V	3.5/28	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Power Management Circuits	.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	1.98 V	.9 mm	7 mm	Not Qualified	1.72 V	IT ALSO OPERATES AT 3.8 TO 28 VOLT	e3	40	260	+28V	7 mm	YES
MPF5020CMMACESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
NX5P2924DUKZ	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																								1									260
PC33PF8200A0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
MC32PF3000A5EP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED		1	12	MOS		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm		2.8 V	ALSO REQUIRE SUPPLY VOLTAGE 3.7V TO 5.5V	e3	40	260		7 mm	YES
MC34PF8100A0EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																								3								40	260
MC34PF8100A0EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																								3								40	260
MMPF0100F0ANESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	14	MOS		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		e3	40	260		8 mm	YES
CRN120H	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		8		SQUARE	YES	PLASTIC/EPOXY		1	1			NO LEAD							105 Cel			QUAD	S-PQCC-N8	1									260			NO
MC32PF3000A2EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED		1	12	MOS		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm		2.8 V	ALSO REQUIRE SUPPLY VOLTAGE 3.7V TO 5.5V	e3	40	260		7 mm	YES
MC32PF8121A0EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm		2.7 V			40	260		8 mm	YES
MC33772BTP1AER2	NXP Semiconductors																									3								40	260
MC33PF8100CFES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																					TIN			3							e3	40	260
MC34PF1550A6EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V		e4	40	260	+6.5V	5 mm	YES
MC34PF1550A6EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V		e4	40	260	+6.5V	5 mm	YES
MC34PF3001A3EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED		1	10			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm		2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260		7 mm	YES
MMPF0100F0AZESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	14	MOS		NO LEAD	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V			40	260		8 mm	YES
MMPF0200F6AEPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	12	MOS		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		e3	40	260		8 mm	YES
MPF5020AMMA0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																								3								40	260
MWCT1012CFM	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	32	HQCCN	SQUARE	YES	UNSPECIFIED		1	1			NO LEAD	3.3 V		CHIP CARRIER, HEAT SINK/SLUG				85 Cel	-40 Cel		QUAD	S-XQCC-N32	3	3.6 V				2.7 V			40	260			NO
NXQ1TXH5DB1401UL	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT																								1									260
PC33PF8100A0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT
PTN5150HXMP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	12	VQCCN	SQUARE	YES	PLASTIC/EPOXY	.13 mA	1	2			NO LEAD	3.3 V		CHIP CARRIER, VERY THIN PROFILE	LCC12,.063SQ,16		.4 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQCC-N12	3	5.5 V	.4 mm	1.6 mm		2.7 V	ESD Value for CC1, CC2, VBUS_DET pins is 3A	e3	30	260	+0.2V	1.6 mm	NO
MC32PF1550A3EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V		e4	40	260	+6.5V	5 mm	YES
MC32PF1550A5EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm		2.5 V		e4	40	260	+6.5V	5 mm	YES
MC32PF3000A0EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED		1	12	MOS		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm		2.8 V	ALSO REQUIRE SUPPLY VOLTAGE 3.7V TO 5.5V	e3	40	260		7 mm	YES
MC32PF3001A3EPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED		1	10			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm		2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260		7 mm	YES
MC33771CTA2AER2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT		64	HLFQFP	SQUARE	YES	PLASTIC/EPOXY		1	8	MOS	AEC-Q100	GULL WING	56 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	105 Cel	-40 Cel		QUAD	R-PQFP-G64	3	61.6 V	1.6 mm	10 mm		9.6 V			40	260	8.5	10 mm	NO
MC33FS8510D3ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	25 mA	1	6		AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm		5.1 V		e3	40	260	+7.5V	8 mm	NO
MC33FS8510D3ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	25 mA	1	6		AEC-Q100	NO LEAD			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	125 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	36 V	1 mm	8 mm		5.1 V		e3	40	260	+7.5V	8 mm	NO
MC33PF8100EAES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm		2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8100EAESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm		2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8100EPES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm		2.7 V		e3	40	260		8 mm	YES
MC34704BEP/R2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	56	HQCCN	SQUARE	YES	UNSPECIFIED		1	8			NO LEAD	3.6 V	3/5	CHIP CARRIER, HEAT SINK/SLUG	LCC56,.27SQ,16	Power Management Circuits	.4 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N56	3	5.5 V	1.1 mm	7 mm	Not Qualified	2.7 V			40	260		7 mm	YES
MC34PF3001A3EP	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	48	HVQCCN	SQUARE	YES	UNSPECIFIED		1	10			NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	3	4.5 V	.9 mm	7 mm		2.8 V	OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V	e3	40	260		7 mm	YES
MCZ33903DS3EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MCZ33903DS5EKR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	32	HSSOP	RECTANGULAR	YES	PLASTIC/EPOXY		1	1	MOS		GULL WING	10.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G32	3	28 V	2.45 mm	7.5 mm		5.5 V		e3	40	260		11 mm	YES
MMPF0100F3ANESR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	14	MOS		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		e3	40	260		8 mm	YES
MMPF0100F6AEPR2	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	UNSPECIFIED		1	14	MOS		NO LEAD	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	4.5 V	.9 mm	8 mm		2.8 V		e3	40	260		8 mm	YES
MMPF0200F6AEP,557	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	INDUSTRIAL	56	VQCCN	SQUARE	YES	UNSPECIFIED		1	12	MOS		NO LEAD	3.6 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		4.5 V	.9 mm	8 mm		2.8 V						8 mm	YES
NXQ1TXA5/404J	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	32	HVQCCN	SQUARE	YES	PLASTIC/EPOXY	5000 mA	1	2			NO LEAD	5 V	3.5/5.25	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Power Management Circuits	.5 mm	85 Cel	-20 Cel		QUAD	S-PQCC-N32	1	5.25 V	.85 mm	5 mm	Not Qualified	3.5 V	SEATED HEIGHT-NOM			260		5 mm	NO
NXQ1TXL5/101J	NXP Semiconductors	POWER SUPPLY SUPPORT CIRCUIT	OTHER	32	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	2			NO LEAD	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-PQCC-N32	1	5.25 V	.85 mm	5 mm		3.4 V	SEATED HEIGHT-NOM			260		5 mm	NO
MC33772BTP2AE	NXP Semiconductors																									3								40	260

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.