Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | Width | Data EEPROM Size | Additional Features | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | PWM Channels | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.7 V |
32 |
2.5,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
2.3 V |
85 Cel |
264 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.76 mm |
17 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
32 |
66 MHz |
260 |
17 mm |
CMOS |
180 mA |
2.5 V |
Bus Controllers |
I960; MPC850; MPC860; POWERPC 801; POWERPC 401 |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
0 |
1,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
.9 V |
85 Cel |
312.5 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.76 mm |
17 mm |
0 |
260 |
17 mm |
CMOS |
1 V |
Bus Controllers |
ISA; SPI; VGA |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
e1 |
|||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
64 |
1.8,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.6 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.76 mm |
17 mm |
64 |
133 MHz |
17 mm |
CMOS |
1.8 V |
Bus Controllers |
PCI |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.7 V |
32 |
2.5,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
2.3 V |
85 Cel |
264 MBps |
-40 Cel |
TIN LEAD |
BOTTOM |
1.76 mm |
17 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
32 |
66 MHz |
17 mm |
CMOS |
180 mA |
2.5 V |
Bus Controllers |
I960; MPC850; MPC860; POWERPC 801; POWERPC 401 |
1 mm |
S-PBGA-B256 |
Not Qualified |
e0 |
|||||||||||||||||||||||
Renesas Electronics |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.46 V |
32 |
GRID ARRAY |
3.14 V |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
1.8 mm |
17 mm |
32 |
50 MHz |
20 |
225 |
17 mm |
CMOS |
3.3 V |
MC68360; MPC860 |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
IEEE 1149.1 |
e0 |
|||||||||||||||||||||||||
Texas Instruments |
BUS CONTROLLER, PCMCIA |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
GRID ARRAY |
3 V |
70 Cel |
0 Cel |
BOTTOM |
2.32 mm |
27 mm |
32 |
33.33 MHz |
27 mm |
CMOS |
5 V |
PCI |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
|||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3,3.3/5 |
GRID ARRAY |
BGA256,20X20,50 |
70 Cel |
0 Cel |
BOTTOM |
CMOS |
Bus Controllers |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
BUS CONTROLLER, PCMCIA |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3,3.3/5 |
GRID ARRAY |
BGA256,20X20,50 |
3 V |
70 Cel |
130 MBps |
0 Cel |
BOTTOM |
2.32 mm |
27 mm |
32 |
33 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
27 mm |
CMOS |
3.3 V |
Bus Controllers |
PCI |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
|||||||||||||||||||||||||
Texas Instruments |
BUS CONTROLLER, PCMCIA |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3,3.3/5 |
GRID ARRAY |
BGA256,20X20,50 |
3 V |
70 Cel |
132 MBps |
0 Cel |
BOTTOM |
2.32 mm |
27 mm |
32 |
33 MHz |
27 mm |
CMOS |
3.3 V |
Bus Controllers |
PCI |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
|||||||||||||||||||||||||||
Texas Instruments |
BUS CONTROLLER, PCMCIA |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3,3.3/5 |
GRID ARRAY |
BGA256,20X20,50 |
3 V |
70 Cel |
130 MBps |
0 Cel |
BOTTOM |
2.32 mm |
27 mm |
ALSO REQUIRES 5V SUPPLY |
32 |
33 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
27 mm |
CMOS |
3.3 V |
Bus Controllers |
PCI; ISA |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
||||||||||||||||||||||||
Texas Instruments |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
GRID ARRAY |
3 V |
85 Cel |
-40 Cel |
BOTTOM |
2.02 mm |
17 mm |
32 |
66 MHz |
17 mm |
CMOS |
3.3 V |
1 mm |
S-PBGA-B256 |
Not Qualified |
||||||||||||||||||||||||||||||||
Texas Instruments |
BUS CONTROLLER, PCMCIA |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3,3.3/5 |
GRID ARRAY |
BGA256,20X20,50 |
3 V |
70 Cel |
130 MBps |
0 Cel |
BOTTOM |
2.32 mm |
27 mm |
32 |
33 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
27 mm |
CMOS |
3.3 V |
Bus Controllers |
PCI |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
|||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3,3.3/5 |
GRID ARRAY |
BGA256,20X20,50 |
70 Cel |
0 Cel |
BOTTOM |
CMOS |
Bus Controllers |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3,3.3/5 |
GRID ARRAY |
BGA256,16X16,40 |
3 V |
70 Cel |
0 Cel |
BOTTOM |
2.02 mm |
17 mm |
32 |
66 MHz |
17 mm |
CMOS |
3.3 V |
Bus Controllers |
1 mm |
S-PBGA-B256 |
Not Qualified |
|||||||||||||||||||||||||||||
Texas Instruments |
BUS CONTROLLER, PCMCIA |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3,3.3/5 |
GRID ARRAY |
BGA256,20X20,50 |
3 V |
70 Cel |
132 MBps |
0 Cel |
BOTTOM |
2.32 mm |
27 mm |
32 |
33.33 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
27 mm |
CMOS |
3.3 V |
Bus Controllers |
PCI; ISA |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
IEEE 1394 |
||||||||||||||||||||||||
Texas Instruments |
BUS CONTROLLER, PCMCIA |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3,3.3/5 |
GRID ARRAY |
BGA256,20X20,50 |
3 V |
70 Cel |
132 MBps |
0 Cel |
BOTTOM |
2.32 mm |
27 mm |
32 |
33 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
27 mm |
CMOS |
3.3 V |
Bus Controllers |
PCI; ISA |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
|||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3,3.3/5 |
GRID ARRAY |
BGA256,20X20,50 |
70 Cel |
0 Cel |
BOTTOM |
CMOS |
Bus Controllers |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3,3.3/5 |
GRID ARRAY |
BGA256,20X20,50 |
70 Cel |
0 Cel |
BOTTOM |
CMOS |
Bus Controllers |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
GRID ARRAY |
3 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.76 mm |
17 mm |
32 |
33 MHz |
17 mm |
CMOS |
3.3 V |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3 |
GRID ARRAY |
BGA256,16X16,40 |
3 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.76 mm |
17 mm |
32 |
66 MHz |
17 mm |
CMOS |
510 mA |
3.3 V |
Bus Controllers |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3 |
GRID ARRAY |
BGA256,16X16,40 |
3 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.76 mm |
17 mm |
32 |
66 MHz |
17 mm |
CMOS |
510 mA |
3.3 V |
Bus Controllers |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
64 |
GRID ARRAY |
BGA256,16X16,40 |
1.6 V |
85 Cel |
312.5 MBps |
-40 Cel |
BOTTOM |
1.76 mm |
17 mm |
64 |
133 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
CMOS |
1.8 V |
I2C; PCI; SMBUS; VGA |
1 mm |
S-PBGA-B256 |
|||||||||||||||||||||||||||
Diodes Incorporated |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3 |
GRID ARRAY |
BGA256,16X16,40 |
3 V |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
1.76 mm |
17 mm |
32 |
66 MHz |
17 mm |
CMOS |
510 mA |
3.3 V |
Bus Controllers |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
e0 |
|||||||||||||||||||||||||
Diodes Incorporated |
BUS CONTROLLER, PCI |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3 |
GRID ARRAY |
BGA256,16X16,40 |
3 V |
85 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
1.76 mm |
17 mm |
32 |
66 MHz |
17 mm |
CMOS |
510 mA |
3.3 V |
Bus Controllers |
1 mm |
S-PBGA-B256 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
GRID ARRAY |
3 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.76 mm |
17 mm |
32 |
33 MHz |
17 mm |
CMOS |
3.3 V |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
GRID ARRAY |
3 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.76 mm |
17 mm |
32 |
33 MHz |
17 mm |
CMOS |
3.3 V |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
GRID ARRAY |
3 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.76 mm |
17 mm |
32 |
33 MHz |
17 mm |
CMOS |
3.3 V |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
0 |
GRID ARRAY |
.9 V |
85 Cel |
-40 Cel |
BOTTOM |
1.76 mm |
17 mm |
0 |
100 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
CMOS |
1 V |
PCI |
1 mm |
S-PBGA-B256 |
Not Qualified |
IEEE 1149.6; IEEE 1149.1 |
|||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
GRID ARRAY |
3 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.76 mm |
17 mm |
32 |
33 MHz |
17 mm |
CMOS |
3.3 V |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||||||
Diodes Incorporated |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
0 |
GRID ARRAY |
.9 V |
85 Cel |
-40 Cel |
BOTTOM |
1.76 mm |
17 mm |
0 |
100 MHz |
17 mm |
CMOS |
1 V |
PCI |
1 mm |
S-PBGA-B256 |
Not Qualified |
IEEE 1149.6; IEEE 1149.1 |
||||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
GRID ARRAY |
3 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.76 mm |
17 mm |
32 |
33 MHz |
17 mm |
CMOS |
3.3 V |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
GRID ARRAY |
3 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.76 mm |
17 mm |
32 |
66 MHz |
17 mm |
CMOS |
3.3 V |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||||||
Diodes Incorporated |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
GRID ARRAY |
BGA256,16X16,40 |
.9 V |
85 Cel |
312.5 MBps |
-40 Cel |
BOTTOM |
1.76 mm |
17 mm |
17 mm |
CMOS |
1 V |
SMBUS |
1 mm |
S-PBGA-B256 |
|||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
GRID ARRAY |
3 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.76 mm |
17 mm |
32 |
33 MHz |
17 mm |
CMOS |
3.3 V |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
GRID ARRAY |
3 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.76 mm |
17 mm |
32 |
66 MHz |
17 mm |
CMOS |
3.3 V |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
64 |
GRID ARRAY |
BGA256,16X16,40 |
1.6 V |
85 Cel |
312.5 MBps |
-40 Cel |
BOTTOM |
1.76 mm |
17 mm |
64 |
133 MHz |
17 mm |
CMOS |
1.8 V |
I2C; PCI; SMBUS; VGA |
1 mm |
S-PBGA-B256 |
||||||||||||||||||||||||||||||
Renesas Electronics |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
64 |
1.2 |
GRID ARRAY |
BGA256,16X16,40 |
1.14 V |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
1.8 mm |
17 mm |
64 |
133 MHz |
225 |
17 mm |
CMOS |
1.2 V |
Bus Controllers |
PCI |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
IEEE 1149.6; IEEE 1149.1 |
e0 |
|||||||||||||||||||||||
|
Renesas Electronics |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
64 |
1.2 |
GRID ARRAY |
BGA256,16X16,40 |
1.14 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.8 mm |
17 mm |
64 |
133 MHz |
260 |
17 mm |
CMOS |
1.2 V |
Bus Controllers |
PCI |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
IEEE 1149.6; IEEE 1149.1 |
e1 |
||||||||||||||||||||||
Renesas Electronics |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.46 V |
32 |
GRID ARRAY |
3.14 V |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
3.5 mm |
27 mm |
32 |
50 MHz |
20 |
225 |
27 mm |
CMOS |
3.3 V |
MC68360; MPC860 |
1.27 mm |
S-PBGA-B256 |
3 |
Not Qualified |
IEEE 1149.1 |
e0 |
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Broadcom |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
GRID ARRAY |
BGA256,20X20,50 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
CMOS |
150 mA |
5 V |
Bus Controllers |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
e0 |
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Broadcom |
BUS CONTROLLER, SCSI |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
GRID ARRAY |
4.75 V |
70 Cel |
40 MBps |
0 Cel |
BOTTOM |
2.3 mm |
27 mm |
32 |
33.33 MHz |
27 mm |
CMOS |
5 V |
PCI |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
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Broadcom |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
GRID ARRAY |
3 V |
70 Cel |
0 Cel |
BOTTOM |
1.76 mm |
17 mm |
32 |
66 MHz |
260 |
17 mm |
CMOS |
3.3 V |
1 mm |
S-PBGA-B256 |
3 |
Not Qualified |
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Broadcom |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
GRID ARRAY |
BGA256,20X20,50 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
CMOS |
150 mA |
5 V |
Bus Controllers |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
e0 |
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Broadcom |
BUS CONTROLLER, SCSI |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
GRID ARRAY |
4.75 V |
70 Cel |
40 MBps |
0 Cel |
BOTTOM |
2.35 mm |
27 mm |
32 |
80 MHz |
27 mm |
CMOS |
5 V |
PCI |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
IEEE 1149.1 |
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Broadcom |
BUS CONTROLLER, SCSI |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
GRID ARRAY |
4.75 V |
70 Cel |
40 MBps |
0 Cel |
TIN LEAD |
BOTTOM |
2.3 mm |
27 mm |
32 |
33.33 MHz |
30 |
225 |
27 mm |
CMOS |
5 V |
PCI |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
X3.131 |
e0 |
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Broadcom |
BUS CONTROLLER, SCSI |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
GRID ARRAY |
4.75 V |
70 Cel |
40 MBps |
0 Cel |
BOTTOM |
2.35 mm |
27 mm |
32 |
80 MHz |
27 mm |
CMOS |
5 V |
PCI |
1.27 mm |
S-PBGA-B256 |
Not Qualified |
IEEE 1149.1 |
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Broadcom |
BUS CONTROLLER, PCI |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
133 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
S-PBGA-B256 |
Not Qualified |
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Broadcom |
BUS CONTROLLER, PCI |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 |
GRID ARRAY |
264 MBps |
TIN LEAD |
BOTTOM |
66 MHz |
CMOS |
2.5 V |
Bus Controllers |
I960; MPC850; MPC860; POWERPC 80X/82X; POWERPC 401 |
S-PBGA-B256 |
Not Qualified |
e0 |
Bus controllers are integrated circuits that are used to manage and control the flow of data and control signals between different devices in a computer system. They are commonly used in systems that have multiple buses, such as a memory bus and an I/O bus. Bus controllers ensure that data is transferred efficiently and correctly between different devices in the system.
One of the primary functions of a bus controller is to manage bus arbitration. Bus arbitration is the process of resolving conflicts that occur when two or more devices on the bus attempt to access the bus at the same time. Bus controllers use various algorithms to determine which device has priority access to the bus and when other devices can access it.
Another important function of bus controllers is to manage the transfer of data and control signals between devices on the bus. This involves controlling the timing and synchronization of signals, as well as error detection and correction. Bus controllers also manage other aspects of the bus, such as interrupt handling and power management.