Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | Width | Data EEPROM Size | Additional Features | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | PWM Channels | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
2.7 V |
85 Cel |
.125 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
4 mm |
0 |
48 MHz |
4 mm |
CMOS |
3.3 V |
I2C, SPI, UART, USB |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
|||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.14 V |
85 Cel |
-40 Cel |
PURE TIN |
QUAD |
1 mm |
8 mm |
26 MHz |
30 |
260 |
8 mm |
CMOS |
1.2 V |
I2C |
.4 mm |
S-XQCC-N68 |
3 |
|||||||||||||||||||||||||||||
|
FTDI |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
76 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC76,.35SQ,16 |
.9 V |
85 Cel |
625 MBps |
-40 Cel |
QUAD |
1 mm |
9 mm |
32 |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
CMOS |
1 V |
VBUS |
.4 mm |
S-XQCC-N76 |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
BUS CONTROLLER, I2C |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.3 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
5 mm |
8 |
260 |
5 mm |
CMOS |
2.5 V |
8049; 8051; 6800; 68000; Z80 |
.65 mm |
S-PQCC-N20 |
1 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||
Broadcom |
BUS CONTROLLER, PCI |
BALL |
376 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
CMOS |
I2C |
S-PBGA-B376 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
1 V |
85 Cel |
625 MBps |
-40 Cel |
BOTTOM |
1.5 mm |
15 mm |
15 mm |
CMOS |
I2C; SMBUS; SPI; VGA |
1 mm |
S-PBGA-B196 |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
3 V |
85 Cel |
12 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
5 mm |
0 |
12 MHz |
30 |
260 |
5 mm |
CMOS |
15 mA |
3.3 V |
Bus Controllers |
I2C; UART |
.5 mm |
S-PQCC-N32 |
2 |
Not Qualified |
RS232; RS485 |
e4 |
|||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
3 V |
70 Cel |
1.5 MBps |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
5 mm |
0 |
12 MHz |
30 |
260 |
5 mm |
CMOS |
15 mA |
3.3 V |
Bus Controllers |
I2C |
.5 mm |
S-PQCC-N32 |
2 |
Not Qualified |
RS232; RS485 |
e4 |
|||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
BALL |
25 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA25,5X5,16 |
1.6 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
.62 mm |
1.97 mm |
8 |
26 MHz |
1.97 mm |
CMOS |
40 mA |
1.8 V |
UART |
.4 mm |
S-PBGA-B25 |
1 |
|||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.20SQ,20 |
1.6 V |
85 Cel |
.125 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
5 mm |
52 MHz |
260 |
5 mm |
CMOS |
110 mA |
1.8 V |
I2C; USB |
.5 mm |
S-XQCC-N32 |
3 |
e3 |
||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
1.6 V |
85 Cel |
60 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
7 mm |
ALSO REQUIRES 3.3V SUPPLY |
24 MHz |
7 mm |
CMOS |
1.8 V |
I2C; SMBUS; SPI; UART; USB |
.5 mm |
S-PQCC-N48 |
e3 |
|||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
2 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
1.6 V |
70 Cel |
60 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
7 mm |
ALSO REQUIRES 3.3V SUPPLY |
24 MHz |
7 mm |
CMOS |
80 mA |
1.8 V |
I2C; SMBUS; SPI; UART; USB |
.5 mm |
S-PQCC-N48 |
e3 |
||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.31 V |
TS 16949 |
1.25,3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
1.22 V |
70 Cel |
625 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
9 mm |
ALSO OPERATES AT 3.3 V SUPPLY |
25 MHz |
9 mm |
CMOS |
1.25 V |
Bus Controllers |
I2C; SMBUS; SPI; USB |
.5 mm |
S-PQCC-N64 |
Not Qualified |
e3 |
||||||||||||||||||||||||
|
Standard Microsystems |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.31 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.22 V |
70 Cel |
0 Cel |
QUAD |
1 mm |
9 mm |
ALSO OPRATES AT 3.3 V SUPPLY |
25 MHz |
9 mm |
CMOS |
1.25 V |
I2C; SMBUS |
.5 mm |
S-XQCC-N64 |
||||||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.32 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100,.47SQ,16 |
1.08 V |
85 Cel |
625 MBps |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
.9 mm |
12 mm |
25 MHz |
12 mm |
CMOS |
1.2 V |
I2C; SMBUS; SPI |
.4 mm |
S-XQCC-N100 |
e3 |
||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
AEC-Q100; TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.24SQ,20 |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
6 mm |
24 MHz |
6 mm |
CMOS |
300 mA |
3.3 V |
I2C; SMBUS; USB |
.5 mm |
S-PQCC-N36 |
e3 |
||||||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
14 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
4.4 V |
70 Cel |
60.03 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
3.5 mm |
30 |
260 |
3.5 mm |
CMOS |
.03 mA |
5 V |
I2C |
.5 mm |
S-PQCC-N14 |
2 |
e3 |
|||||||||||||||||||||||||||
|
Texas Instruments |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
1.1,3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SLGA100,15X15,24 |
.99 V |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.8 mm |
9 mm |
1.05-V SUPPLY MAY BE USED AS LONG AS MINIMUM SUPPLY CONDITIONS ARE MET |
24 MHz |
30 |
260 |
9 mm |
CMOS |
1.1 V |
Bus Controllers |
I2C; SMBUS |
.6 mm |
S-PQCC-N100 |
3 |
Not Qualified |
e4 |
|||||||||||||||||||||||
|
Renesas Electronics |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
OTHER |
NO LEAD |
40 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
CHIP CARRIER |
85 Cel |
0 Cel |
TIN BISMUTH |
QUAD |
CMOS |
5 V |
S-XQCC-N40 |
e6 |
|||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
100 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC100,.47SQ,16 |
1.08 V |
85 Cel |
625 MBps |
-40 Cel |
QUAD |
.9 mm |
12 mm |
also available with 3.3v supply |
25 MHz |
12 mm |
CMOS |
1.2 V |
I2C; SMBUS; SPI; UART; USB |
.4 mm |
S-PQCC-N100 |
|||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.20SQ,20 |
1.6 V |
70 Cel |
.125 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
5 mm |
52 MHz |
5 mm |
CMOS |
110 mA |
1.8 V |
I2C; USB |
.5 mm |
S-XQCC-N32 |
e3 |
||||||||||||||||||||||||||||
Texas Instruments |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3,3.3/5 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA257,19X19,32 |
3 V |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
1.4 mm |
16 mm |
32 |
66 MHz |
20 |
220 |
16 mm |
CMOS |
3.3 V |
Bus Controllers |
.8 mm |
S-PBGA-B257 |
3 |
Not Qualified |
e0 |
||||||||||||||||||||||||
Microchip Technology |
BUS CONTROLLER, PCI |
BALL |
650 |
SQUARE |
PLASTIC/EPOXY |
YES |
105 Cel |
174000 MBps |
-40 Cel |
BOTTOM |
CMOS |
I2C, PCI, SMBUS, UART |
S-PBGA-B650 |
||||||||||||||||||||||||||||||||||||||||||||
|
Marvell Technology |
BUS CONTROLLER, PCI |
COMMERCIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.05 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.27SQ,16 |
.95 V |
60 Cel |
625 MBps |
-10 Cel |
QUAD |
.9 mm |
7 mm |
0 |
25 MHz |
7 mm |
CMOS |
1 V |
SPI |
.4 mm |
S-XQCC-N56 |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.26 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.14 V |
85 Cel |
-40 Cel |
PURE TIN |
QUAD |
1 mm |
8 mm |
8 mm |
CMOS |
1.2 V |
I2C |
.4 mm |
S-XQCC-N68 |
3 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
2 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA121,11X11,32 |
1.15 V |
70 Cel |
625 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
10 mm |
16 |
19.2 MHz |
10 mm |
CMOS |
200 mA |
1.2 V |
I2C, I2S, SMBUS, SPI, UART, USB |
.8 mm |
S-PBGA-B121 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
1.2 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA121,11X11,32 |
1.15 V |
85 Cel |
185 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
10 mm |
19.2 MHz |
10 mm |
CMOS |
200 mA |
1.2 V |
Bus Controllers |
I2C |
.8 mm |
S-PBGA-B121 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
COMMERCIAL |
BALL |
192 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA192,14X14,32 |
.95 V |
70 Cel |
1250 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.45 mm |
12 mm |
25 MHz |
12 mm |
CMOS |
750 mA |
1 V |
I2C; SPI |
.8 mm |
S-PBGA-B192 |
e1 |
||||||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
NO LEAD |
56 |
HVQCCN |
SQUARE |
YES |
2 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
1.6 V |
85 Cel |
60 MBps |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
8 mm |
ALSO OPERATES AT 3.3 V SUPPLY |
12 MHz |
40 |
260 |
8 mm |
CMOS |
.24 mA |
1.8 V |
USB |
.5 mm |
S-XQCC-N56 |
3 |
e3 |
|||||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
GULL WING |
128 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP128,.63SQ,16 |
3 V |
85 Cel |
35 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1.2 mm |
14 mm |
24 MHz |
30 |
260 |
14 mm |
CMOS |
165 mA |
3.3 V |
Memory Controllers |
I2C; UART; USB |
.4 mm |
S-PQFP-G128 |
3 |
Not Qualified |
e3 |
||||||||||||||||||||||
|
Microchip Technology |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
36 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
AEC-Q100; TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG |
LCC36,.24SQ,20 |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
6 mm |
24 MHz |
6 mm |
CMOS |
300 mA |
3.3 V |
I2C; SMBUS; USB |
.5 mm |
S-XQCC-N36 |
e3 |
||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
CMOS |
I2C |
S-PBGA-B324 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
245 |
CMOS |
S-PBGA-B676 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||
|
Marvell Technology |
BUS CONTROLLER, PCI |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.21 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.27SQ,16 |
.95 V |
85 Cel |
750 MBps |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
600 mA |
1 V |
SPI; UART |
.4 mm |
S-XQCC-N56 |
|||||||||||||||||||||||||||||||
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
19 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
3 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
14 mm |
16 |
12 MHz |
14 mm |
CMOS |
100 mA |
3.3 V |
I2C, IDE, SPI, UART |
.5 mm |
S-PQFP-G100 |
|||||||||||||||||||||||||||||||
|
Intel |
BUS CONTROLLER, PCI |
BALL |
836 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.1 V |
0 |
GRID ARRAY |
.998 V |
2000 MBps |
BOTTOM |
2.207 mm |
25 mm |
0 |
25 mm |
CMOS |
1.05 V |
I2C; ISA; SMBUS; PCI; ATA |
S-PBGA-B836 |
IEEE 802.3 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
2.7 V |
105 Cel |
.125 MBps |
-40 Cel |
QUAD |
.6 mm |
4 mm |
0 |
48 MHz |
4 mm |
CMOS |
3.3 V |
I2C; SPI; UART; USB |
.5 mm |
S-XQCC-N24 |
3 |
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|
Infineon Technologies |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
2.7 V |
85 Cel |
.125 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
6 mm |
48 MHz |
6 mm |
CMOS |
3.3 V |
USB |
.5 mm |
S-PQCC-N40 |
3 |
e4 |
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|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
245 |
CMOS |
I2C |
S-PBGA-B324 |
4 |
e1 |
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Digital Equipment |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3,3.3/5 |
FLATPACK |
QFP160,1.2SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
Bus Controllers |
.635 mm |
S-PQFP-G160 |
Not Qualified |
e0 |
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Intel |
BUS CONTROLLER, PCI |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3,3.3/5 |
FLATPACK |
QFP160,1.2SQ |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
3.75 mm |
28 mm |
33 MHz |
28 mm |
CMOS |
3.3 V |
Bus Controllers |
.65 mm |
S-PQFP-G160 |
Not Qualified |
e0 |
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|
Marvell Technology |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
625 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 V |
24 |
GRID ARRAY, HEAT SINK/SLUG |
BGA625,25X25,32 |
.9 V |
70 Cel |
1000 MBps |
0 Cel |
BOTTOM |
2.53 mm |
21 mm |
16 |
100 MHz |
21 mm |
CMOS |
.95 V |
ATA; I2C; SPI; UART |
.8 mm |
S-PBGA-B625 |
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|
Marvell Technology |
BUS CONTROLLER, PCI |
COMMERCIAL |
BALL |
481 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
22 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.95 V |
70 Cel |
625 MBps |
0 Cel |
BOTTOM |
1.6 mm |
19 mm |
36 |
19 mm |
CMOS |
1 V |
ATA; I2C; SPI; UART |
.8 mm |
S-PBGA-B481 |
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|
NXP Semiconductors |
BUS CONTROLLER, UNIVERSAL SERIAL BUS |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
3 V |
85 Cel |
11.1 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
7 mm |
OPERATES AT 5V SUPPLY WITH REGULATOR |
16 |
6 MHz |
7 mm |
CMOS |
3.3 V |
Bus Controllers |
H8S/2357; 8051 |
.5 mm |
S-PQCC-N48 |
3 |
Not Qualified |
e3 |
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Broadcom |
BUS CONTROLLER, PCI |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.7 V |
32 |
2.5,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
2.3 V |
85 Cel |
264 MBps |
-40 Cel |
TIN LEAD |
BOTTOM |
1.76 mm |
17 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
32 |
66 MHz |
17 mm |
CMOS |
180 mA |
2.5 V |
Bus Controllers |
I960; MPC850; MPC860; POWERPC 801; POWERPC 401 |
1 mm |
S-PBGA-B256 |
Not Qualified |
e0 |
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|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
ITS ALSO REQUIRES 3.3 V SUPPLY |
260 |
CMOS |
I2C |
S-PBGA-B196 |
3 |
e1 |
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|
Broadcom |
BUS CONTROLLER, PCI |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
TIN SILVER COPPER |
BOTTOM |
245 |
CMOS |
S-PBGA-B676 |
4 |
e1 |
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Broadcom |
BUS CONTROLLER, PCI |
UNSPECIFIED |
SQUARE |
UNSPECIFIED |
70 Cel |
0 Cel |
UNSPECIFIED |
CMOS |
I2C, PCI, SMBUS |
Bus controllers are integrated circuits that are used to manage and control the flow of data and control signals between different devices in a computer system. They are commonly used in systems that have multiple buses, such as a memory bus and an I/O bus. Bus controllers ensure that data is transferred efficiently and correctly between different devices in the system.
One of the primary functions of a bus controller is to manage bus arbitration. Bus arbitration is the process of resolving conflicts that occur when two or more devices on the bus attempt to access the bus at the same time. Bus controllers use various algorithms to determine which device has priority access to the bus and when other devices can access it.
Another important function of bus controllers is to manage the transfer of data and control signals between devices on the bus. This involves controlling the timing and synchronization of signals, as well as error detection and correction. Bus controllers also manage other aspects of the bus, such as interrupt handling and power management.