1031 Digital Signal Processors (DSPs) 27

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

TMS320DM8168CCYGA2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

105 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

27 MHz

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168CCYG2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168CCYG4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168CCYG

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8167SCYG2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8167SCYG4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168CCYGH

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMX320DM8168BCYG2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

1031

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

16

GRID ARRAY, FINE PITCH

.95 V

BOTTOM

3.31 mm

25 mm

YES

16

27 MHz

MULTIPLE

25 mm

CMOS

1 V

.65 mm

FLOATING POINT

S-PBGA-B1031

NO

NO

TMX320DM8168ACYG

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

1031

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

16

32

1

GRID ARRAY

BGA1031,37X37,25

.95 V

BOTTOM

3.31 mm

16384

25 mm

YES

16

48 MHz

MULTIPLE

25 mm

CMOS

1 V

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

Not Qualified

YES

NO

TMS320DM8168ACYG2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

1031

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

16

32

1

GRID ARRAY, FINE PITCH

BGA1031,37X37,25

.95 V

TIN SILVER COPPER

BOTTOM

3.31 mm

16384

25 mm

YES

16

27 MHz

30

245

MULTIPLE

25 mm

CMOS

1 V

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

NO

NO

e1

TMS320DM8165SCYG

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168BCYG0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

BALL

1031

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

28

32

1

GRID ARRAY, FINE PITCH

BGA1031,37X37,25

.95 V

TIN SILVER COPPER

BOTTOM

3.31 mm

16384

25 mm

YES

16

27 MHz

30

245

MULTIPLE

25 mm

CMOS

1 V

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8165SCYG4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168BCYG2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

BALL

1031

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

28

32

1

GRID ARRAY, FINE PITCH

BGA1031,37X37,25

.95 V

TIN SILVER COPPER

BOTTOM

3.31 mm

16384

25 mm

YES

16

27 MHz

30

245

MULTIPLE

25 mm

CMOS

1 V

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8165BCYG0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

BALL

1031

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

28

32

1

GRID ARRAY, FINE PITCH

BGA1031,37X37,25

.95 V

TIN SILVER COPPER

BOTTOM

3.31 mm

16384

25 mm

YES

16

27 MHz

30

245

MULTIPLE

25 mm

CMOS

1 V

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168SCYG2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8167BCYG2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

BALL

1031

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

28

32

1

GRID ARRAY, FINE PITCH

BGA1031,37X37,25

.95 V

TIN SILVER COPPER

BOTTOM

3.31 mm

16384

25 mm

YES

16

27 MHz

30

245

MULTIPLE

25 mm

CMOS

1 V

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168SCYG

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168SCYGA2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

105 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168BCYGA2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

BALL

1031

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

28

32

1

GRID ARRAY, FINE PITCH

BGA1031,37X37,25

.95 V

TIN SILVER COPPER

BOTTOM

3.31 mm

16384

25 mm

YES

16

27 MHz

30

245

MULTIPLE

25 mm

CMOS

1 V

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8166SCYG

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

BALL

1031

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1

GRID ARRAY, FINE PITCH

BGA1031,37X37,25

BOTTOM

16384

CMOS

1 V

Digital Signal Processors

.635 mm

FLOATING POINT

S-PBGA-B1031

Not Qualified

TMS320DM8165SCYG2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8166SCYG2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

BALL

1031

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1

GRID ARRAY, FINE PITCH

BGA1031,37X37,25

TIN SILVER COPPER

BOTTOM

16384

30

245

CMOS

1 V

Digital Signal Processors

.635 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

e1

TMS320DM8166SCYG4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

BALL

1031

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1

GRID ARRAY, FINE PITCH

BGA1031,37X37,25

BOTTOM

16384

CMOS

1 V

Digital Signal Processors

.635 mm

FLOATING POINT

S-PBGA-B1031

Not Qualified

TMS320DM8167SCYG

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8168SCYG4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320DM8166BCYG0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

BALL

1031

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

28

32

1

GRID ARRAY, FINE PITCH

BGA1031,37X37,25

.95 V

TIN SILVER COPPER

BOTTOM

3.31 mm

16384

25 mm

YES

16

27 MHz

30

245

MULTIPLE

25 mm

CMOS

1 V

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.