169 Digital Signal Processors (DSPs) 30

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

ADSP-BF533SBBZ500

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

1.45 V

19

32

1.2,2.5/3.3

GRID ARRAY

BGA169,17X17,40

.8 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.5 mm

19 mm

ALSO REQUIRES 3V OR 3.3V SUPPLY

YES

16

40 MHz

30

260

MULTIPLE

19 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B169

3

Not Qualified

500 rpm

YES

YES

e1

ADSP-BF532SBBZ400

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

1.45 V

19

32

1.2,2.5/3.3

GRID ARRAY

BGA169,17X17,40

.8 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.5 mm

19 mm

ALSO REQUIRES 3V OR 3.3V SUPPLY

YES

16

40 MHz

260

MULTIPLE

19 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B169

3

Not Qualified

400 rpm

YES

YES

e1

TNETV2842VNDGGU

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

169

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

0

GRID ARRAY, LOW PROFILE, FINE PITCH

1.55 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

1.4 mm

12 mm

YES

0

20

220

MULTIPLE

12 mm

CMOS

1.6 V

.8 mm

FIXED POINT

S-PBGA-B169

3

YES

NO

e0

TNETV2840ENGGU

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

169

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

19

16

1.6,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA169,13X13,32

1.55 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

1.4 mm

65536

12 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

133 MHz

20

220

MULTIPLE

12 mm

CMOS

1.6 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B169

3

Not Qualified

YES

YES

e0

TMS320VC5441AZGUZE

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

0

GRID ARRAY, LOW PROFILE, FINE PITCH

1.55 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

12 mm

YES

0

30

260

MULTIPLE

12 mm

CMOS

1.6 V

.8 mm

FIXED POINT

S-PBGA-B169

3

YES

NO

e1

TMS320VC5441GGU

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

169

LFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.65 V

19

16

1.6,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA169,13X13,32

1.55 V

85 Cel

8

0 Cel

TIN LEAD

BOTTOM

1.4 mm

65536

12 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

133 MHz

20

220

MULTIPLE

12 mm

8

CMOS

1.6 V

24

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B169

3

Not Qualified

YES

YES

e0

TMS320VC5441GUDIT

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

169

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

19

16

1.6,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA169,13X13,32

1.55 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

1.4 mm

65536

12 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

133 MHz

20

220

MULTIPLE

12 mm

CMOS

1.6 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B169

3

Not Qualified

YES

YES

e0

TMS320VC5441GURDIT

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

169

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

19

16

1.6,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA169,13X13,32

1.55 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

1.4 mm

65536

12 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

133 MHz

20

220

MULTIPLE

12 mm

CMOS

1.6 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B169

3

Not Qualified

YES

YES

e0

TMS320VC5441GGUR

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

169

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

19

16

1.6,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA169,13X13,32

1.55 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

1.4 mm

65536

12 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

50 MHz

20

220

MULTIPLE

12 mm

CMOS

1.6 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B169

3

Not Qualified

YES

YES

e0

TMS320VC5441GGUA532

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

169

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

19

16

1.6,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA169,13X13,32

1.55 V

BOTTOM

1.4 mm

65536

12 mm

-40 TO 100 OPERATING CASE TEMPERATURE

YES

16

133 MHz

MULTIPLE

12 mm

CMOS

1.6 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B169

Not Qualified

YES

YES

TMS320VC5441ZGU

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

169

LFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.65 V

19

16

1.6,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA169,13X13,32

1.55 V

85 Cel

8

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

65536

12 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

133 MHz

30

260

MULTIPLE

12 mm

8

CMOS

1.6 V

24

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B169

3

Not Qualified

YES

YES

e1

TMS320VC5441GGURZE

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

169

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

19

16

1.6,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA169,13X13,32

1.55 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

1.4 mm

65536

12 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

133 MHz

20

220

MULTIPLE

12 mm

CMOS

1.6 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B169

3

Not Qualified

YES

YES

e0

TMS320VC5441AGGU

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

LFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.65 V

19

16

1.6,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA169,13X13,32

1.55 V

100 Cel

8

-40 Cel

TIN LEAD

BOTTOM

1.4 mm

65536

12 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

133 MHz

20

220

MULTIPLE

12 mm

8

CMOS

1.6 V

24

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B169

3

Not Qualified

YES

YES

e0

TMS320VC5441GGU532

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

19

16

1.6,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA169,13X13,32

1.55 V

100 Cel

-40 Cel

BOTTOM

1.4 mm

65536

12 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

50 MHz

MULTIPLE

12 mm

CMOS

1.6 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B169

Not Qualified

YES

YES

TMS320VC5441AZGU

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

LFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.65 V

19

16

1.6,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA169,13X13,32

1.55 V

100 Cel

8

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

65536

12 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

133 MHz

30

260

MULTIPLE

12 mm

8

CMOS

1.6 V

24

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B169

3

Not Qualified

YES

YES

e1

TMS320VC5441ZGUR

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

169

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

19

16

1.6,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA169,13X13,32

1.55 V

85 Cel

0 Cel

BOTTOM

1.4 mm

65536

12 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

133 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

12 mm

CMOS

1.6 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B169

Not Qualified

YES

YES

TMS320VC5441AGGU532

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.65 V

19

16

1.6,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA169,13X13,32

1.55 V

100 Cel

-40 Cel

BOTTOM

1.4 mm

65536

12 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

50 MHz

MULTIPLE

12 mm

CMOS

1.6 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B169

Not Qualified

YES

YES

ADBF533WBBZ5XX

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

1.45 V

19

GRID ARRAY

.95 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.5 mm

19 mm

YES

16

40 MHz

MULTIPLE

19 mm

CMOS

1.25 V

1 mm

FIXED POINT

S-PBGA-B169

Not Qualified

YES

YES

e1

ADBF533WYBBZ4XX

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

1.45 V

19

GRID ARRAY

.95 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.5 mm

19 mm

YES

16

40 MHz

MULTIPLE

19 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B169

Not Qualified

YES

YES

e1

ADSP-BF533WYBZ-4A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

20

32

1.2,2.5/3.3

GRID ARRAY

BGA169,17X17,40

.8 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.5 mm

19 mm

ALSO REQUIRES 3V OR 3.3V SUPPLY

YES

16

40 MHz

MULTIPLE

19 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B169

Not Qualified

400 rpm

YES

YES

e1

ADSP-BF531WBBZ-4A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

20

32

1.2,2.5/3.3

GRID ARRAY

BGA169,17X17,40

.8 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.5 mm

19 mm

ALSO REQUIRES 3V OR 3.3V SUPPLY

YES

16

40 MHz

MULTIPLE

19 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B169

Not Qualified

400 rpm

YES

YES

e1

ADSP-BF533SBBZ400

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

1.45 V

19

32

1.2,1.8/3.3,3.3

GRID ARRAY

BGA169,17X17,40

.8 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.5 mm

19 mm

ALSO REQUIRES 3V OR 3.3V SUPPLY

YES

16

40 MHz

30

260

MULTIPLE

19 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B169

3

Not Qualified

400 rpm

YES

YES

e1

ADSP-BF533SBB500

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

1.45 V

19

32

1.2,2.5/3.3

GRID ARRAY

BGA169,17X17,40

.8 V

85 Cel

-40 Cel

TIN LEAD SILVER

BOTTOM

2.5 mm

19 mm

ALSO REQUIRES 3V OR 3.3V SUPPLY

YES

16

40 MHz

20

225

MULTIPLE

19 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B169

3

Not Qualified

500 rpm

YES

YES

e0

ADSP-BF532WYBZ-4A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

20

32

1.2,2.5/3.3

GRID ARRAY

BGA169,17X17,40

.8 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.5 mm

19 mm

ALSO REQUIRES 3V OR 3.3V SUPPLY

YES

16

40 MHz

MULTIPLE

19 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B169

Not Qualified

400 rpm

YES

YES

e1

ADSP-BF532WBBZ-4A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

20

32

1.2,2.5/3.3

GRID ARRAY

BGA169,17X17,40

.8 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.5 mm

19 mm

ALSO REQUIRES 3V OR 3.3V SUPPLY

YES

16

40 MHz

MULTIPLE

19 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B169

Not Qualified

400 rpm

YES

YES

e1

ADSP-BF532SBB400

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

20

32

1.2,2.5/3.3

GRID ARRAY

BGA169,17X17,40

.8 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

2.5 mm

19 mm

ALSO REQUIRES 3V OR 3.3V SUPPLY

YES

16

40 MHz

MULTIPLE

19 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B169

3

Not Qualified

400 rpm

YES

YES

e0

ADSP-BF533WBBZ-5A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

20

32

1.2,2.5/3.3

GRID ARRAY

BGA169,17X17,40

.8 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.5 mm

19 mm

ALSO REQUIRES 3V OR 3.3V SUPPLY

YES

16

40 MHz

MULTIPLE

19 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B169

Not Qualified

500 rpm

YES

YES

e1

ADSP-BF531WYBZ-4A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

20

32

1.2,2.5/3.3

GRID ARRAY

BGA169,17X17,40

.8 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.5 mm

19 mm

ALSO REQUIRES 3V OR 3.3V SUPPLY

YES

16

40 MHz

MULTIPLE

19 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B169

Not Qualified

400 rpm

YES

YES

e1

ADSP-BF531SBBZ400

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

1.45 V

19

32

1.2,2.5/3.3

GRID ARRAY

BGA169,17X17,40

.8 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.5 mm

19 mm

ALSO REQUIRES 3V OR 3.3V SUPPLY

YES

16

40 MHz

260

MULTIPLE

19 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B169

3

Not Qualified

400 rpm

YES

YES

e1

ADSP-BF531SBB400

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

169

BGA

SQUARE

PLASTIC/EPOXY

YES

1.45 V

19

32

1.2,2.5/3.3

GRID ARRAY

BGA169,17X17,40

.8 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

2.5 mm

19 mm

ALSO REQUIRES 3V OR 3.3V SUPPLY

YES

16

40 MHz

MULTIPLE

19 mm

CMOS

1.2 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B169

3

Not Qualified

400 rpm

YES

YES

e0

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.