201 Digital Signal Processors (DSPs) 16

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TMS320VC5502ZAV200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	201	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	16	20	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA201,17X17,32	1.2 V	85 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	32768	15 mm		YES	32	20 MHz	30	260	MULTIPLE	15 mm	4	CMOS	239 mA	1.26 V	6		MROM	.8 mm	FIXED POINT	S-PBGA-B201	3		YES	NO	e1	16
TMX320VC5501GZZ300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	201	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		22			GRID ARRAY, LOW PROFILE, FINE PITCH		1.2 V	85 Cel		-40 Cel		BOTTOM	1.4 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	50 MHz			MULTIPLE	15 mm		CMOS		1.26 V				.8 mm	FIXED POINT	S-PBGA-B201		Not Qualified	YES	NO
TMX320VC5502GZZ200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	201	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	16	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA201,17X17,32	1.2 V	85 Cel		-40 Cel		BOTTOM	1.4 mm	32768	15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	15 mm		CMOS		1.26 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B201		Not Qualified	YES	NO
TMX320VC5502GZZ300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	201	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	16	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA201,17X17,32	1.2 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	1.4 mm	32768	15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	50 MHz			MULTIPLE	15 mm		CMOS		1.26 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B201		Not Qualified	YES	NO	e0
TMS320VC5501GBE300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	201	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	16	22	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA201,17X17,32	1.2 V	85 Cel	4	-40 Cel	TIN LEAD	BOTTOM	1.4 mm	16384	15 mm		YES	32	20 MHz	20	220	MULTIPLE	15 mm	4	CMOS	239 mA	1.26 V	6		MROM	.8 mm	FIXED POINT	S-PBGA-B201	3		YES	NO	e0	16
TMS320VC5502GZZ300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	201	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	16	20	16	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA201,17X17,32	1.2 V	85 Cel	4	-40 Cel	TIN LEAD	BOTTOM	1.4 mm	32768	15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	50 MHz	20	220	MULTIPLE	15 mm	4	CMOS	239 mA	1.26 V	6	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B201	3	Not Qualified	YES	NO	e0	16
TMS320VC5502GBE300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	201	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	16	20	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA201,17X17,32	1.2 V	85 Cel	4	-40 Cel	TIN LEAD	BOTTOM	1.4 mm	32768	15 mm		YES	32	20 MHz	20	220	MULTIPLE	15 mm	4	CMOS	239 mA	1.26 V	6		MROM	.8 mm	FIXED POINT	S-PBGA-B201	3		YES	NO	e0	16
TMS320VC5501ZZZ300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	201	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	16	22	16	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA201,17X17,32	1.2 V	85 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16384	15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	50 MHz	30	260	MULTIPLE	15 mm	4	CMOS	239 mA	1.26 V	6	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B201	3	Not Qualified	YES	NO	e1	16
TMS320VC5501GZZ300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	201	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	16	22	16	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA201,17X17,32	1.2 V	85 Cel	4	-40 Cel	TIN LEAD	BOTTOM	1.4 mm	16384	15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	50 MHz	20	220	MULTIPLE	15 mm	4	CMOS	239 mA	1.26 V	6	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B201	3	Not Qualified	YES	NO	e0	16
TMS320VC5502ZAV300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	201	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	16	20	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA201,17X17,32	1.2 V	85 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	32768	15 mm		YES	32	20 MHz	30	260	MULTIPLE	15 mm	4	CMOS	239 mA	1.26 V	6		MROM	.8 mm	FIXED POINT	S-PBGA-B201	3		YES	NO	e1	16
TMS320VC5502GBE200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	201	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	16	20	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA201,17X17,32	1.2 V	85 Cel	4	-40 Cel	TIN LEAD	BOTTOM	1.4 mm	32768	15 mm		YES	32	20 MHz	20	220	MULTIPLE	15 mm	4	CMOS	239 mA	1.26 V	6		MROM	.8 mm	FIXED POINT	S-PBGA-B201	3		YES	NO	e0	16
TMS320VC5501ZAV300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	201	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	16	22	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA201,17X17,32	1.2 V	85 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16384	15 mm		YES	32	20 MHz	30	260	MULTIPLE	15 mm	4	CMOS	239 mA	1.26 V	6		MROM	.8 mm	FIXED POINT	S-PBGA-B201	3		YES	NO	e1	16
TMS320VC5502GZZ200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	201	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	16	20	16	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA201,17X17,32	1.2 V	85 Cel	4	-40 Cel	TIN LEAD	BOTTOM	1.4 mm	32768	15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	50 MHz	20	220	MULTIPLE	15 mm	4	CMOS	239 mA	1.26 V	6	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B201	3	Not Qualified	YES	NO	e0	16
TMS320C5502ZAVR300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	201	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	16	20	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA201,17X17,32	1.2 V	85 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	32768	15 mm		YES	32	20 MHz	30	260	MULTIPLE	15 mm	4	CMOS	239 mA	1.26 V	6		MROM	.8 mm	FIXED POINT	S-PBGA-B201	3		YES	NO	e1	16
TMS320VC5502ZZZ200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	201	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	16	20	16	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA201,17X17,32	1.2 V	85 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	32768	15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	50 MHz	30	260	MULTIPLE	15 mm	4	CMOS	239 mA	1.26 V	6	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B201	3	Not Qualified	YES	NO	e1	16
TMS320VC5502ZZZ300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	201	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	16	20	16	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA201,17X17,32	1.2 V	85 Cel	4	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	32768	15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	50 MHz	30	260	MULTIPLE	15 mm	4	CMOS	239 mA	1.26 V	6	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B201	3	Not Qualified	YES	NO	e1	16

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.