257 Digital Signal Processors (DSPs) 12

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

TNETV1002IDZHK

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

BALL

257

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.95 V

23

16

1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA257,19X19,32

1.71 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

32768

16 mm

ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY

YES

32

100 MHz

30

260

MULTIPLE

16 mm

CMOS

1.8 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B257

3

Not Qualified

YES

NO

e1

TMS320VC5470ZHKA

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

BALL

257

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.95 V

23

16

1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA257,19X19,32

1.71 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

8192

16 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

50 MHz

30

260

MULTIPLE

16 mm

CMOS

1.8 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B257

3

Not Qualified

YES

NO

e1

TMS320VC5471ZHK

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

OTHER

BALL

257

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.95 V

23

16

1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA257,19X19,32

1.71 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY

YES

32

100 MHz

30

260

MULTIPLE

16 mm

CMOS

1.8 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B257

3

Not Qualified

YES

NO

e1

TMS320VC5470GHK

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

OTHER

BALL

257

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.95 V

23

16

1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA257,19X19,32

1.71 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

1.4 mm

16384

16 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

50 MHz

20

220

MULTIPLE

16 mm

CMOS

1.8 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B257

3

Not Qualified

YES

NO

e0

TMS320VC5470GHKA

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

BALL

257

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.95 V

23

16

1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA257,19X19,32

1.71 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

1.4 mm

16384

16 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

50 MHz

20

220

MULTIPLE

16 mm

CMOS

1.8 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B257

3

Not Qualified

YES

NO

e0

TMS320VC5471GHK

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

OTHER

BALL

257

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.95 V

23

16

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA257,19X19,32

1.71 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

1.4 mm

16384

16 mm

ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY

YES

32

100 MHz

20

220

MULTIPLE

16 mm

CMOS

1.8 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B257

3

Not Qualified

YES

NO

e0

TMS320SPVC5470GHK

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

OTHER

BALL

257

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.95 V

23

16

1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA257,19X19,32

1.71 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

1.4 mm

8192

16 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

50 MHz

20

220

MULTIPLE

16 mm

CMOS

1.8 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B257

3

Not Qualified

YES

NO

e0

TMS320VC5471GHKA

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

BALL

257

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.95 V

23

16

1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA257,19X19,32

1.71 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

1.4 mm

16384

16 mm

ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY

YES

32

100 MHz

20

220

MULTIPLE

16 mm

CMOS

1.8 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B257

3

Not Qualified

YES

NO

e0

TMS320VC5471ZHKA

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

BALL

257

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.95 V

23

16

1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA257,19X19,32

1.71 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY

YES

32

100 MHz

30

260

MULTIPLE

16 mm

CMOS

1.8 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B257

3

Not Qualified

YES

NO

e1

TMS320VC5470ZHK

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

OTHER

BALL

257

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.95 V

23

16

1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA257,19X19,32

1.71 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

50 MHz

30

260

MULTIPLE

16 mm

CMOS

1.8 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B257

3

Not Qualified

YES

NO

e1

TMS320C54VOIP-P1

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

BALL

257

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.95 V

23

16

1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA257,19X19,32

1.71 V

TIN LEAD

BOTTOM

1.4 mm

16384

16 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

50 MHz

MULTIPLE

16 mm

CMOS

1.8 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B257

3

Not Qualified

YES

NO

e0

OMAPL137BHKGD1

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

MILITARY

NO LEAD

257

DIE

UNSPECIFIED

UNSPECIFIED

YES

YES

1.32 V

8

13

UNCASED CHIP

1.14 V

175 Cel

-55 Cel

UPPER

499712

YES

8

30 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

4

CMOS

1.2 V

40

MROM

FLOATING POINT

X-XUUC-N257

300 rpm

YES

NO

8

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.