272 Digital Signal Processors (DSPs) 60

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code
TMS320C6713GDPX225	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V	22	32	1.2,3.3	GRID ARRAY	BGA272,20X20,50	1.2 V					BOTTOM	2.57 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	227.27 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS	1.26 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B272		Not Qualified	YES	NO
TMS320C6712DZDP150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	22	32	1.2,3.3	GRID ARRAY	BGA272,20X20,50	1.14 V	90 Cel	4	0 Cel	TIN SILVER COPPER	BOTTOM	2.57 mm	65536	27 mm	ALSO OPERATES AT 3.3V SUPPLY	YES	16	149.25 MHz	30	260	MULTIPLE	27 mm	2	CMOS	1.2 V	16	Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	YES	NO	e1
SM32C6713BGDPS20EP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	22	32	1.3,3.3	GRID ARRAY	BGA272,20X20,50	1.2 V	105 Cel	4	-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.57 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	NOT SPECIFIED	220	MULTIPLE	27 mm	2	CMOS	1.26 V	16	Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	YES	NO	e0
TMS320C6711DGDP200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	22	32	1.2,3.3	GRID ARRAY	BGA272,20X20,50	1.14 V	90 Cel	4	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.57 mm	17408	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	NOT SPECIFIED	220	MULTIPLE	27 mm	2	CMOS	1.2 V	16	Digital Signal Processors	FLASH	1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	YES	NO	e0
TMS32C6711CGDPA167	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V	22	32	1.2,3.3	GRID ARRAY	BGA272,20X20,50	1.14 V					BOTTOM	2.57 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	166.67 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS	1.2 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B272		Not Qualified	YES	NO
TMS320C6711CZDP200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V	22			GRID ARRAY		1.14 V					BOTTOM	2.57 mm		27 mm		YES	32	167 MHz			MULTIPLE	27 mm		CMOS	1.2 V				1.27 mm	FLOATING POINT	S-PBGA-B272		Not Qualified	YES	NO
SM32C6711DGDPI20EP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	22	32	1.2,3.3	GRID ARRAY	BGA272,20X20,50	1.14 V	85 Cel	4	-40 Cel	TIN LEAD	BOTTOM	2.57 mm	4096	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	20	220	MULTIPLE	27 mm	2	CMOS	1.2 V	16	Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	YES	NO	e0
TMS320C6713BGDPA200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V	20			GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	2.57 mm		27 mm	4 ALU AVAILABLE	YES	32				MULTIPLE	27 mm		CMOS	1.2 V				1.27 mm	FIXED POINT	S-PBGA-B272			YES	NO
SM320C6713BGDPA20EP	Texas Instruments			BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.3,3.3	GRID ARRAY	BGA272,20X20,50						BOTTOM		65536											CMOS			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B272
TMS320C6713GDP225	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V	22	32	1.25,3.3	GRID ARRAY	BGA272,20X20,50	1.2 V					BOTTOM	2.57 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	225 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS	1.26 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B272		Not Qualified	YES	NO
TMS320C6711DZDP250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V	22	32	1.4,3.3	GRID ARRAY	BGA272,20X20,50	1.33 V	90 Cel	4	0 Cel	TIN SILVER COPPER	BOTTOM	2.57 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	250 MHz	30	260	MULTIPLE	27 mm	2	CMOS	1.4 V	16	Digital Signal Processors	FLASH	1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	YES	NO	e1
TMS32C6711CGDPA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	272	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V	22			GRID ARRAY		1.2 V					BOTTOM	2.57 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32				MULTIPLE	27 mm		CMOS	1.26 V				1.27 mm	FLOATING POINT	S-PBGA-B272		Not Qualified	YES	NO

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.