316 Digital Signal Processors (DSPs) 22

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code
ADSP-BF538BBCZ-5F8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz	30	260	MULTIPLE	17 mm	CMOS	1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF538BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz	40	260	MULTIPLE	17 mm	CMOS	1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF538BBCZ-4F8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz	30	260	MULTIPLE	17 mm	CMOS	1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified	400 rpm	YES	YES	e1
ADBF539WBBCZ5XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	19			GRID ARRAY, LOW PROFILE, FINE PITCH		2.7 V	85 Cel	-40 Cel		BOTTOM	1.7 mm	17 mm		YES	16	50 MHz			MULTIPLE	17 mm	CMOS	3.3 V		.8 mm	FIXED POINT	S-PBGA-B316				YES	YES
ADBF539WBBCZ4XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	19			GRID ARRAY, LOW PROFILE, FINE PITCH		2.7 V	85 Cel	-40 Cel		BOTTOM	1.7 mm	17 mm		YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	CMOS	3.3 V		.8 mm	FIXED POINT	S-PBGA-B316				YES	YES
ADBF539WBBCZ5F8XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	19			GRID ARRAY, LOW PROFILE, FINE PITCH		2.7 V	85 Cel	-40 Cel		BOTTOM	1.7 mm	17 mm		YES	16	50 MHz			MULTIPLE	17 mm	CMOS	3.3 V		.8 mm	FIXED POINT	S-PBGA-B316				YES	YES
ADBF539WBBCZ4F8XX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	19			GRID ARRAY, LOW PROFILE, FINE PITCH		2.7 V	85 Cel	-40 Cel		BOTTOM	1.7 mm	17 mm		YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	CMOS	3.3 V		.8 mm	FIXED POINT	S-PBGA-B316				YES	YES
ADSP-BF539WBBCZ5F8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.37 V	20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.95 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz			MULTIPLE	17 mm	CMOS	1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B316		Not Qualified	500 rpm	YES	YES	e1
ADSP-BF539WYBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.95 V	105 Cel	-40 Cel		BOTTOM	1.7 mm	17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	CMOS	1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B316		Not Qualified	400 rpm	YES	YES
ADSP-BF538BBCZ-4F4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz		260	MULTIPLE	17 mm	CMOS	1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF539BBCZ-5F4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.37 V	20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.95 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz			MULTIPLE	17 mm	CMOS	1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B316		Not Qualified	533 rpm	YES	YES	e1
ADSP-BF539YBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.95 V	105 Cel	-40 Cel		BOTTOM	1.7 mm	17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	CMOS	1 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B316		Not Qualified	400 rpm	YES	YES
ADSP-BF539YBCZ-4F8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.95 V	105 Cel	-40 Cel		BOTTOM	1.7 mm	17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	CMOS	1 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B316		Not Qualified	400 rpm	YES	YES
ADSP-BF539WYBCZ4F4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.95 V	105 Cel	-40 Cel		BOTTOM	1.7 mm	17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz	40	250	MULTIPLE	17 mm	CMOS	1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B316		Not Qualified	400 rpm	YES	YES
ADSP-BF538BBCZ-5F4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.8 V	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.7 mm	17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz		260	MULTIPLE	17 mm	CMOS	1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF539WBBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.37 V	20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.95 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz			MULTIPLE	17 mm	CMOS	1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B316		Not Qualified	500 rpm	YES	YES	e1
ADSP-BF539WYBCZ4F8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.95 V	105 Cel	-40 Cel		BOTTOM	1.7 mm	17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	CMOS	1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B316		Not Qualified	400 rpm	YES	YES
ADSP-BF539YBCZ-4F4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.95 V	105 Cel	-40 Cel		BOTTOM	1.7 mm	17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm	CMOS	1 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B316		Not Qualified	400 rpm	YES	YES
ADSP-BF539BBCZ-5F8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.375 V	20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.95 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	533 MHz			MULTIPLE	17 mm	CMOS	1.25 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF538BBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.8 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz	30	260	MULTIPLE	17 mm	CMOS	1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF539BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.375 V	20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.95 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	533 MHz			MULTIPLE	17 mm	CMOS	1.25 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF539WBBCZ5F4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.37 V	20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.95 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz			MULTIPLE	17 mm	CMOS	1.2 V	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B316		Not Qualified	500 rpm	YES	YES	e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.