340 Digital Signal Processors (DSPs) 16

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code
TMX320C6204GLW	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	340	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.57 V	22			GRID ARRAY, FINE PITCH		1.43 V				BOTTOM	2.095 mm		18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz			MULTIPLE	18 mm	CMOS	1.5 V		.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6204GLWA-233	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel	-40 Cel		BOTTOM	2.095 mm		18 mm		YES	32	233 MHz			MULTIPLE	18 mm	CMOS	1.5 V		.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6204GLW200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	340	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.57 V	22	32	1.5,3.3	GRID ARRAY, FINE PITCH	BGA340,22X22,32	1.43 V			TIN LEAD	BOTTOM	2.095 mm	16384	18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	20	220	MULTIPLE	18 mm	CMOS	1.5 V	Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B340	4	Not Qualified	YES	NO	e0
TMS320C6204GLWA-200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel	-40 Cel		BOTTOM	2.095 mm		18 mm		YES	32	200 MHz			MULTIPLE	18 mm	CMOS	1.5 V		.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6204GLWA-150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel	-40 Cel		BOTTOM	2.095 mm		18 mm		YES	32	150 MHz			MULTIPLE	18 mm	CMOS	1.5 V		.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6204GLW	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	340	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.57 V	22			GRID ARRAY, FINE PITCH		1.43 V				BOTTOM	2.095 mm		18 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz			MULTIPLE	18 mm	CMOS	1.5 V		.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6204GLW-167	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel	0 Cel		BOTTOM	2.095 mm		18 mm		YES	32	167 MHz			MULTIPLE	18 mm	CMOS	1.5 V		.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6204GLWA-100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel	-40 Cel		BOTTOM	2.095 mm		18 mm		YES	32	100 MHz			MULTIPLE	18 mm	CMOS	1.5 V		.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6204GLW-233	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel	0 Cel		BOTTOM	2.095 mm		18 mm		YES	32	233 MHz			MULTIPLE	18 mm	CMOS	1.5 V		.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6204GLWA-300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel	-40 Cel		BOTTOM	2.095 mm		18 mm		YES	32	300 MHz			MULTIPLE	18 mm	CMOS	1.5 V		.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6204GLWA-167	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel	-40 Cel		BOTTOM	2.095 mm		18 mm		YES	32	167 MHz			MULTIPLE	18 mm	CMOS	1.5 V		.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6204GLW-100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel	0 Cel		BOTTOM	2.095 mm		18 mm		YES	32	100 MHz			MULTIPLE	18 mm	CMOS	1.5 V		.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6204GLW-150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel	0 Cel		BOTTOM	2.095 mm		18 mm		YES	32	150 MHz			MULTIPLE	18 mm	CMOS	1.5 V		.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6204GLW-250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel	0 Cel		BOTTOM	2.095 mm		18 mm		YES	32	250 MHz			MULTIPLE	18 mm	CMOS	1.5 V		.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6204GLW-300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	90 Cel	0 Cel		BOTTOM	2.095 mm		18 mm		YES	32	300 MHz			MULTIPLE	18 mm	CMOS	1.5 V		.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO
TMS320C6204GLWA-250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	340	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	22			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH		1.425 V	105 Cel	-40 Cel		BOTTOM	2.095 mm		18 mm		YES	32	250 MHz			MULTIPLE	18 mm	CMOS	1.5 V		.8 mm	FIXED POINT	S-PBGA-B340		Not Qualified	YES	NO

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.