352 Digital Signal Processors (DSPs) 160

Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

TMS320C6203GJL250

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

352

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.57 V

22

32

1.5,3.3

GRID ARRAY, HEAT SINK/SLUG

BGA352,26X26,40

1.43 V

TIN LEAD

BOTTOM

3.8 mm

98304

27 mm

0 TO 90 OPERATING CASE TEMPERATURE

YES

32

250 MHz

MULTIPLE

27 mm

CMOS

1.5 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B352

Not Qualified

YES

NO

e0

TMS320C6202GJL-233

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

352

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.89 V

22

32

1.8,3.3

GRID ARRAY, HEAT SINK/SLUG

BGA352,26X26,40

1.71 V

90 Cel

0 Cel

BOTTOM

3.8 mm

32768

27 mm

YES

32

233 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

27 mm

CMOS

1.8 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B352

Not Qualified

YES

NO

5962-9753602QXX

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

MILITARY

FLAT

352

GQFF

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.25 V

MIL-PRF-38535 Class Q

32

FLATPACK, GUARD RING

4.75 V

125 Cel

-55 Cel

GOLD

QUAD

4.55 mm

48 mm

YES

32

50 MHz

SINGLE

48 mm

CMOS

5 V

.5 mm

FIXED POINT

S-CQFP-F352

Not Qualified

NO

NO

e4

TMS320C6203GJL-167

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

352

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.575 V

22

GRID ARRAY, HEAT SINK/SLUG

1.425 V

90 Cel

0 Cel

BOTTOM

3.8 mm

27 mm

YES

32

167 MHz

MULTIPLE

27 mm

CMOS

1.5 V

1 mm

FIXED POINT

S-PBGA-B352

Not Qualified

YES

NO

5962-9466902QYX

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

MILITARY

FLAT

352

QFF

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

YES

5.25 V

MIL-PRF-38535 Class Q

31

32

FLATPACK

4.75 V

125 Cel

-55 Cel

QUAD

YES

32

40 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

CMOS

850 mA

5 V

FLOATING POINT

R-CQFP-F352

Qualified

YES

YES

TMS320C6202GJL-100

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

352

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.89 V

22

GRID ARRAY, HEAT SINK/SLUG

1.71 V

90 Cel

0 Cel

BOTTOM

3.8 mm

27 mm

YES

32

100 MHz

MULTIPLE

27 mm

CMOS

1.8 V

1 mm

FIXED POINT

S-PBGA-B352

Not Qualified

YES

NO

TMS320C6701GJCA150

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

352

HBGA

SQUARE

PLASTIC/EPOXY

YES

3.46 V

32

GRID ARRAY, HEAT SINK/SLUG

3.14 V

BOTTOM

3.5 mm

35 mm

YES

32

150 MHz

MULTIPLE

35 mm

CMOS

3.3 V

1.27 mm

FLOATING POINT

S-PBGA-B352

Not Qualified

YES

NO

TMS320C6203CGNZ250

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

OTHER

BALL

352

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2,3.3

GRID ARRAY

BGA352,26X26,40

90 Cel

0 Cel

BOTTOM

524288

CMOS

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B352

Not Qualified

TMS320C6203CGNZA300

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

352

BGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

22

32

1.2,3.3

GRID ARRAY

BGA352,26X26,40

1.14 V

90 Cel

0 Cel

BOTTOM

524288

YES

32

300 MHz

MULTIPLE

CMOS

1.2 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B352

Not Qualified

YES

NO

TMS320C6203GJLA300

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

352

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.57 V

22

GRID ARRAY, HEAT SINK/SLUG

1.43 V

BOTTOM

3.8 mm

27 mm

-40 TO 105 OPERATING CASE TEMPERATURE

YES

32

300 MHz

MULTIPLE

27 mm

CMOS

1.5 V

1 mm

FIXED POINT

S-PBGA-B352

Not Qualified

YES

NO

TMS320C6201GGP-233

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

352

HBGA

SQUARE

PLASTIC/EPOXY

YES

2.62 V

22

GRID ARRAY, HEAT SINK/SLUG

2.38 V

90 Cel

0 Cel

BOTTOM

1.7 mm

35 mm

YES

32

233 MHz

MULTIPLE

35 mm

CMOS

2.5 V

1.27 mm

FIXED POINT

S-PBGA-B352

Not Qualified

YES

NO

TMS320C6201BGJC-167

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

352

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.89 V

22

32

1.8,3.3

GRID ARRAY, HEAT SINK/SLUG

BGA352,26X26,50

1.71 V

90 Cel

0 Cel

BOTTOM

3.5 mm

16384

35 mm

YES

32

167 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

35 mm

CMOS

1.8 V

Digital Signal Processors

1.27 mm

FIXED POINT

S-PBGA-B352

Not Qualified

YES

NO

5962-9466903QYC

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

MILITARY

FLAT

352

GQFF

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

YES

5.25 V

32

MIL-PRF-38535 Class Q

31

32

5

FLATPACK, GUARD RING

TPAK352,3.0SQ

4.75 V

125 Cel

5

-55 Cel

QUAD

3.34 mm

4G

2K

48 mm

YES

32

50 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

48 mm

2

CMOS

850 mA

5 V

6

0

Digital Signal Processors

.5 mm

FLOATING POINT

S-CQFP-F352

Qualified

YES

YES

0

SM320MCM41DHFHL40

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

FLAT

352

GQFF

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.25 V

32

32

5

FLATPACK, GUARD RING

TPAK352,3.0SQ

4.75 V

70 Cel

0 Cel

QUAD

3.34 mm

131072

48 mm

YES

32

40 MHz

NOT SPECIFIED

NOT SPECIFIED

SINGLE

48 mm

CMOS

600 mA

5 V

Digital Signal Processors

.5 mm

FIXED POINT

S-CQFP-F352

Not Qualified

NO

NO

TMS320C6701GJCA120

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

352

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.89 V

22

32

1.8,3.3

GRID ARRAY, HEAT SINK/SLUG

BGA352,26X26,50

1.71 V

105 Cel

4

-40 Cel

TIN LEAD

BOTTOM

3.5 mm

16384

35 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

120.48 MHz

20

220

MULTIPLE

35 mm

2

CMOS

1.8 V

4

Digital Signal Processors

1.27 mm

FLOATING POINT

S-PBGA-B352

4

Not Qualified

YES

NO

e0

TMS320C80GGP60

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

352

HLBGA

SQUARE

PLASTIC/EPOXY

YES

3.465 V

32

GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE

3.135 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

1.7 mm

35 mm

YES

64

120 MHz

20

220

MULTIPLE

35 mm

CMOS

3.3 V

1.27 mm

FLOATING POINT

S-PBGA-B352

4

Not Qualified

NO

YES

e0

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.