376 Digital Signal Processors (DSPs) 58

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TMS320DM6435ZDUL	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	376	BGA	SQUARE	PLASTIC/EPOXY		YES				32	1.2,1.8,3.3	GRID ARRAY	BGA376,22X22,40		70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		20480						30	260				CMOS			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified			e1
TMS320C6424ZDU600	Texas Instruments		COMMERCIAL	BALL	376	BGA	SQUARE	PLASTIC/EPOXY		YES				32	1.2,1.8,3.3	GRID ARRAY	BGA376,22X22,40		70 Cel	0 Cel		BOTTOM		61440											CMOS			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B376		Not Qualified
TMS320C6424ZDUQ6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	376	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	32	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA376,22X22,40	1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	20480	23 mm		YES	32	30 MHz	30	260	MULTIPLE	23 mm	5	CMOS	1.2 V	64	Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified	YES	NO	e1	8
TMS320C6424ZDUA400	Texas Instruments		INDUSTRIAL	BALL	376	BGA	SQUARE	PLASTIC/EPOXY		YES				32	1.05/1.2,1.8,3.3	GRID ARRAY	BGA376,22X22,40		85 Cel	-40 Cel		BOTTOM		61440											CMOS			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B376		Not Qualified
TMS320DM6433ZDUQ6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	376	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		32	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA376,22X22,40	1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	20480	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	27 MHz	30	260	MULTIPLE	23 mm		CMOS	1.2 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified	YES	NO	e1
TMS320DM6437ZDUQ6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	376	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	32	32	1.2,1.8,3.3	GRID ARRAY	BGA376,22X22,40	1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	61440	23 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	27 MHz	30	260	MULTIPLE	23 mm	5	CMOS	1.2 V	72	Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified	YES	NO	e1	8
TMS320C6424AZDU400	Texas Instruments		COMMERCIAL	BALL	376	BGA	SQUARE	PLASTIC/EPOXY		YES				32	1.1,1.8,3.3	GRID ARRAY	BGA376,22X22,40		70 Cel	0 Cel		BOTTOM		20480											CMOS			Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B376		Not Qualified
TMS320C6424ZDU7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	376	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	32	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA376,22X22,40	1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	20480	23 mm		YES	32	30 MHz	30	260	MULTIPLE	23 mm	5	CMOS	1.2 V	64	Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified	YES	NO	e1	8
TMS320C6421ZDUQ6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	376	BGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		22	32	1.2,1.8,3.3	GRID ARRAY	BGA376,22X22,40	1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	12288	23 mm	LOW-POWER DEVICE	YES	8	600 MHz	30	260	MULTIPLE	23 mm		CMOS	1.2 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified	NO	NO	e1
TMS320C6421ZDUL	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	376	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	22	32	1.2,1.8,3.3	GRID ARRAY	BGA376,22X22,40	1 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	12288	23 mm	LOW-POWER DEVICE	YES	8	400 MHz	30	260	MULTIPLE	23 mm	5	CMOS	1.05 V	72	Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified	NO	NO	e1	8

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.