452 Digital Signal Processors (DSPs) 11

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

TMX320C6201GJC-167

Texas Instruments

BALL

452

BGA

SQUARE

PLASTIC/EPOXY

YES

32

2.5,3.3

GRID ARRAY

BGA452,26X26,50

BOTTOM

16384

CMOS

Digital Signal Processors

1.27 mm

FIXED POINT

S-PBGA-B452

Not Qualified

TMX320C6201GJC

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

452

BGA

SQUARE

PLASTIC/EPOXY

YES

2.62 V

22

GRID ARRAY

2.38 V

90 Cel

0 Cel

BOTTOM

ALSO REQUIRES 3.3V SUPPLY

YES

32

SINGLE

CMOS

2.5 V

FIXED POINT

S-PBGA-B452

Not Qualified

YES

NO

TMX320C6701GJC-150

Texas Instruments

BALL

452

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3.3

GRID ARRAY

BGA452,26X26,50

BOTTOM

16384

CMOS

Digital Signal Processors

1.27 mm

FLOATING POINT

S-PBGA-B452

Not Qualified

TMX320C6201GJC-200

Texas Instruments

BALL

452

BGA

SQUARE

PLASTIC/EPOXY

YES

32

2.5,3.3

GRID ARRAY

BGA452,26X26,50

BOTTOM

16384

CMOS

Digital Signal Processors

1.27 mm

FIXED POINT

S-PBGA-B452

Not Qualified

TMX320C6701GJC-167

Texas Instruments

BALL

452

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3.3

GRID ARRAY

BGA452,26X26,50

BOTTOM

16384

CMOS

Digital Signal Processors

1.27 mm

FLOATING POINT

S-PBGA-B452

Not Qualified

AD14160LKB-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

452

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.25 V

32

32

3.3

GRID ARRAY

BGA452,36X36,50

4.75 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

5.08 mm

524288

46.995 mm

YES

48

40 MHz

MULTIPLE

46.995 mm

CMOS

2200 mA

5 V

Digital Signal Processors

1.27 mm

FLOATING POINT

S-CBGA-B452

Not Qualified

YES

YES

e0

AD14160LBB-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

452

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.25 V

32

32

3.3

GRID ARRAY

BGA452,36X36,50

4.75 V

100 Cel

-40 Cel

TIN LEAD

BOTTOM

5.08 mm

524288

46.995 mm

YES

48

40 MHz

MULTIPLE

46.995 mm

CMOS

2200 mA

5 V

Digital Signal Processors

1.27 mm

FLOATING POINT

S-CBGA-B452

Not Qualified

YES

YES

e0

AD14160KB-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

452

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.25 V

32

32

5

GRID ARRAY

BGA452,36X36,50

4.75 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

5.08 mm

524288

46.995 mm

YES

48

40 MHz

MULTIPLE

46.995 mm

CMOS

3400 mA

5 V

Digital Signal Processors

1.27 mm

FLOATING POINT

S-CBGA-B452

Not Qualified

YES

YES

e0

AD14160BB-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

452

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.25 V

32

32

5

GRID ARRAY

BGA452,36X36,50

4.75 V

100 Cel

-40 Cel

TIN LEAD

BOTTOM

5.08 mm

524288

46.995 mm

YES

48

40 MHz

MULTIPLE

46.995 mm

CMOS

3400 mA

5 V

Digital Signal Processors

1.27 mm

FLOATING POINT

S-CBGA-B452

Not Qualified

YES

YES

e0

5962-9800302HXA

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

MILITARY

BALL

452

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.25 V

MIL-PRF-38534 Class H

32

32

5

GRID ARRAY

BGA452,36X36,50

4.75 V

125 Cel

-55 Cel

TIN LEAD

BOTTOM

524288

YES

48

40 MHz

MULTIPLE

CMOS

2920 mA

5 V

Digital Signal Processors

1.27 mm

FIXED POINT

S-CBGA-B452

Not Qualified

NO

YES

e0

5962-9800302HXX

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

MILITARY

BALL

452

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.25 V

MIL-PRF-38534 Class H

32

GRID ARRAY

4.75 V

125 Cel

-55 Cel

BOTTOM

YES

48

40 MHz

MULTIPLE

CMOS

5 V

FIXED POINT

S-CBGA-B452

Not Qualified

NO

YES

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.