697 Digital Signal Processors (DSPs) 116

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code
TMS320TCI6482BZTZ2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V	20	32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.2125 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz	30	260	MULTIPLE	24 mm		CMOS	1.25 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified	YES	NO	e1
TMS320TCI6482GTZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V	20			GRID ARRAY, FINE PITCH		1.2125 V				BOTTOM	3.242 mm		24 mm		YES	64	66.6 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24 mm		CMOS	1.25 V			.8 mm	FIXED POINT	S-PBGA-B697		Not Qualified	YES	NO
TMS320TCI6482DZTZ2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V	20	32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.2125 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz	30	260	MULTIPLE	24 mm		CMOS	1.25 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified	YES	NO	e1
TMS320TCI6482BCTZ8	Texas Instruments		OTHER	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES			32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32		90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		8192						30	245				CMOS			Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified			e1
TMS320C6455BGTZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2875 V	20	32	1.2	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.2125 V	90 Cel	0 Cel	TIN LEAD	BOTTOM	3.242 mm	32768	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz	20	220	MULTIPLE	24 mm	4	CMOS	1.25 V	64	Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified	YES	NO	e0
TMS320C6455BGTZ8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.236 V	20	32	1.2	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.164 V	90 Cel	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.242 mm	32768	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz	NOT SPECIFIED	220	MULTIPLE	24 mm	4	CMOS	1.2 V	64	Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified	YES	NO	e0
TMS320C6455BZTZ8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.236 V	20	32	1.2	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.164 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm	32768	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz	30	260	MULTIPLE	24 mm		CMOS	1.2 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified	YES	NO	e1
TMS320TCI6482CTZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V	20			GRID ARRAY, FINE PITCH		1.2125 V				BOTTOM	3.242 mm		24 mm		YES	64	66.6 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24 mm		CMOS	1.25 V			.8 mm	FIXED POINT	S-PBGA-B697		Not Qualified	YES	NO
TMS320TCI6482GTZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V	20	32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.2125 V				BOTTOM	3.242 mm	65536	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24 mm		CMOS	1.25 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B697		Not Qualified	YES	NO
TMS320TCI6482BGTZA2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V	20	32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.2125 V	105 Cel	-40 Cel		BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz			MULTIPLE	24 mm		CMOS	1.25 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B697		Not Qualified	YES	NO
TMS320TCI6482GTZ8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	697	HFBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V	20	32	1.2,1.5/1.8,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA697,29X29,32	1.17 V				BOTTOM	3.1 mm	65536	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz			MULTIPLE	24 mm		CMOS	1.2 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B697		Not Qualified	YES	NO
TMS320TCI6482DCTZA	Texas Instruments		INDUSTRIAL	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES			32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32		105 Cel	-40 Cel		BOTTOM		8192						NOT SPECIFIED	NOT SPECIFIED				CMOS			Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B697		Not Qualified
TMS320C6454BZTZA7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V	16	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.2125 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm	8192	24 mm		YES	64		30	260	MULTIPLE	24 mm		CMOS	1.25 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified	YES	NO	e1
TMS320C6454BZTZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V	20	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.71 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	32768	24 mm		YES	64	66.6 MHz	30	260	MULTIPLE	24 mm		CMOS	1.8 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified	NO	YES	e1
TMS320C6455BGTZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.236 V	20	32	1.2	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.164 V	90 Cel	0 Cel	TIN LEAD	BOTTOM	3.242 mm	32768	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz	20	220	MULTIPLE	24 mm		CMOS	1.2 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified	YES	NO	e0
TMS320TCI6482ZTZ8	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.236 V	20	32	1.2,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.164 V			TIN SILVER COPPER	BOTTOM	3.242 mm	65536	24 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66.6 MHz			MULTIPLE	24 mm		CMOS	1.2 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B697		Not Qualified	YES	NO	e1
TMS320TCI6482GTZ2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V	20	32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.2125 V				BOTTOM	3.242 mm	8192	24 mm		YES	64	66.6 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24 mm		CMOS	1.25 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B697		Not Qualified	YES	NO
TMS320TCI6482DCTZ2	Texas Instruments		OTHER	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES			32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32		90 Cel	0 Cel		BOTTOM		8192						NOT SPECIFIED	NOT SPECIFIED				CMOS			Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B697		Not Qualified
TMS320TCI6482GTZA2	Texas Instruments			BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES			32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32					BOTTOM		8192											CMOS			Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B697		Not Qualified
TMS320C6454BGTZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	697	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.2875 V	32	32	1.25,1.8,3.3	GRID ARRAY, FINE PITCH	BGA697,29X29,32	1.2125 V	90 Cel	0 Cel	TIN LEAD	BOTTOM	3.242 mm	262144	24 mm		YES	32	50 MHz	20	220	MULTIPLE	24 mm		CMOS	1.25 V		Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified	YES	NO	e0

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.