737 Digital Signal Processors (DSPs) 18

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TMS320C6472ECTZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	14	32	1.1,1.8,3.3	GRID ARRAY, FINE PITCH	BGA737,29X29,32	.95 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm	8192	24 mm		YES	32	50 MHz	30	245	MULTIPLE	24 mm	14	CMOS	1 V	64	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B737	4	Not Qualified	YES	NO	e1	8
TMX320C6472CZTZ6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.16 V		14	32	1.2,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA737,29X29,32	1.05 V	85 Cel	0 Cel		BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	YES	32	625 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24 mm		CMOS	1.1 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B737		Not Qualified	YES	NO
TMX320TCI6486BGTZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		0			GRID ARRAY, FINE PITCH		.95 V	85 Cel	0 Cel		BOTTOM	3.242 mm		24 mm		YES	0	50 MHz			MULTIPLE	24 mm		CMOS	1 V				.8 mm	FIXED POINT	S-PBGA-B737			YES	NO
TMX320C6472CZTZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		14	32	1.2,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA737,29X29,32	.95 V	85 Cel	0 Cel		BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	YES	32	500 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24 mm		CMOS	1 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B737		Not Qualified	YES	NO
TMX320C6472CZTZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	32	1.2,1.5/1.8,1.8,3.3	GRID ARRAY, FINE PITCH	BGA737,29X29,32	1.14 V	85 Cel	0 Cel		BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	YES	32	700 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B737		Not Qualified	YES	NO
TMX320TCI6486BZTZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		0			GRID ARRAY, FINE PITCH		.95 V	85 Cel	0 Cel		BOTTOM	3.242 mm		24 mm		YES	0	50 MHz			MULTIPLE	24 mm		CMOS	1 V				.8 mm	FIXED POINT	S-PBGA-B737			YES	NO
TMX320TCI6486CGTZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		0			GRID ARRAY, FINE PITCH		.95 V	85 Cel	0 Cel		BOTTOM	3.242 mm		24 mm		YES	0	50 MHz			MULTIPLE	24 mm		CMOS	1 V				.8 mm	FIXED POINT	S-PBGA-B737			YES	NO
TMS320C6472ECTZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		14			GRID ARRAY, FINE PITCH		.95 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm		24 mm		YES	32	50 MHz	30	245	MULTIPLE	24 mm		CMOS	1 V				.8 mm	FIXED POINT	S-PBGA-B737	4		YES	NO	e1
TMS320C6472ECTZ6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.16 V			32	1.1,1.8,3.3	GRID ARRAY, FINE PITCH	BGA737,29X29,32	1.05 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm	8192	24 mm		YES		50 MHz	30	245	MULTIPLE	24 mm		CMOS	1.1 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B737	4	Not Qualified	YES	NO	e1
TMS320C6472EZTZ	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		14	32	1,1.2,1.8,3.3	GRID ARRAY	BGA737,29X29,32	.95 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	YES	32	500 MHz	30	245	MULTIPLE	24 mm		CMOS	1 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B737	4	Not Qualified	YES	NO	e1
TMS320C6472EZTZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		14	32	1.2,1.8,3.3	GRID ARRAY	BGA737,29X29,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	YES	32	700 MHz	30	245	MULTIPLE	24 mm		CMOS	1.2 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B737	4	Not Qualified	YES	NO	e1
TMS320C6472EZTZ6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.16 V		14	32	1.1,1.8,3.3	GRID ARRAY	BGA737,29X29,32	1.05 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	YES	32	625 MHz	30	245	MULTIPLE	24 mm		CMOS	1.1 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B737	4	Not Qualified	YES	NO	e1
TMS3TCI6486BZTZ625	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.16 V		0	32	1,1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA737,29X29,32	1.05 V	85 Cel	0 Cel		BOTTOM	3.242 mm	8192	24 mm		YES	0	50 MHz			MULTIPLE	24 mm		CMOS	1.1 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B737		Not Qualified	YES	NO
TMS320C6472ECTZA6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.16 V	8	14	32	1.1,1.8,3.3	GRID ARRAY, FINE PITCH	BGA737,29X29,32	1.05 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm	8192	24 mm		YES	32	50 MHz	30	245	MULTIPLE	24 mm	14	CMOS	1.1 V	64	Digital Signal Processors	MROM	.8 mm	FIXED POINT	S-PBGA-B737	4	Not Qualified	YES	NO	e1	8
SM320C6472EGTZA6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.16 V	8	14	32	1.1	GRID ARRAY, FINE PITCH	BGA737,29X29,32	1.05 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.242 mm	8192	24 mm		YES	32		20	220	SINGLE	24 mm	14	CMOS	1.1 V	64	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B737	4	Not Qualified	YES	NO	e0	8
TMS320C6472ECTZA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			32	1,1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA737,29X29,32	.95 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm	8192	24 mm		YES		50 MHz	30	245	MULTIPLE	24 mm		CMOS	1 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B737	4	Not Qualified	YES	NO	e1
TMS320C6472EZTZA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		14	32	1,1.2,1.8,3.3	GRID ARRAY	BGA737,29X29,32	.95 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	YES	32	500 MHz	30	245	MULTIPLE	24 mm		CMOS	1 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B737	4	Not Qualified	YES	NO	e1
TMS320C6472EZTZA6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	737	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.16 V		14	32	1.1,1.8,3.3	GRID ARRAY	BGA737,29X29,32	1.05 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.242 mm	8192	24 mm	ALSO REQUIRES 3.3 V I/O SUPPLY	YES	32	625 MHz	30	245	MULTIPLE	24 mm		CMOS	1.1 V		Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B737	4	Not Qualified	YES	NO	e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.