Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Internal Bus Architecture | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Barrel Shifter | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
22 |
32 |
1.3,3.3 |
GRID ARRAY |
BGA272,20X20,50 |
1.2 V |
105 Cel |
4 |
-55 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
2.57 mm |
65536 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
200 MHz |
NOT SPECIFIED |
220 |
MULTIPLE |
27 mm |
2 |
CMOS |
1.26 V |
16 |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B272 |
3 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
376 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
24 |
GRID ARRAY |
1.14 V |
90 Cel |
0 Cel |
BOTTOM |
2.48 mm |
23 mm |
YES |
8 |
27 MHz |
SINGLE |
23 mm |
CMOS |
1.2 V |
1 mm |
FIXED POINT |
S-PBGA-B376 |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
1.2,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
BOTTOM |
16384 |
CMOS |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
BALL |
452 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
2.5,3.3 |
GRID ARRAY |
BGA452,26X26,50 |
BOTTOM |
16384 |
CMOS |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
S-PBGA-B452 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
22 |
32 |
1.3,3.3 |
GRID ARRAY |
BGA272,20X20,50 |
1.14 V |
105 Cel |
4 |
-40 Cel |
TIN LEAD |
BOTTOM |
2.57 mm |
65536 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
16 |
166 MHz |
20 |
220 |
MULTIPLE |
27 mm |
2 |
CMOS |
1.2 V |
16 |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B272 |
3 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
176 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.995 V |
20 |
32 |
1.9,3.3 |
GRID ARRAY |
BGA176,14X14,40 |
1.805 V |
85 Cel |
-40 Cel |
BOTTOM |
2.05 mm |
34816 |
15 mm |
ALSO OPERATES AT 3.3V SUPPLY |
YES |
32 |
150 MHz |
MULTIPLE |
15 mm |
CMOS |
1.9 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B176 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
22 |
32 |
1.2,3.3 |
GRID ARRAY |
BGA272,20X20,50 |
1.14 V |
105 Cel |
4 |
-40 Cel |
BOTTOM |
2.57 mm |
4096 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
166.67 MHz |
MULTIPLE |
27 mm |
2 |
CMOS |
1.2 V |
16 |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B272 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
32 |
32 |
1.2,3.3 |
GRID ARRAY |
BGA256,16X16,50 |
1.14 V |
90 Cel |
0 Cel |
BOTTOM |
2.02 mm |
262144 |
17 mm |
32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
17 mm |
CMOS |
1.2 V |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
Not Qualified |
NO |
NO |
|||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
22 |
32 |
1.8,3.3 |
GRID ARRAY |
BGA256,20X20,50 |
1.71 V |
90 Cel |
0 Cel |
BOTTOM |
2.32 mm |
65536 |
27 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
32 |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
27 mm |
CMOS |
1.8 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
S-PBGA-B256 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
429 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1.89 V |
MIL-PRF-38535 |
22 |
32 |
1.8,3.3 |
GRID ARRAY |
BGA429,21X21,50 |
1.71 V |
90 Cel |
-40 Cel |
BOTTOM |
3.3 mm |
65536 |
27 mm |
-40 TO 90 OPERATING CASE TEMPERATURE |
YES |
32 |
150 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
27 mm |
CMOS |
1.8 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
S-CBGA-B429 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
22 |
32 |
1.25,3.3 |
GRID ARRAY |
BGA272,20X20,50 |
1.2 V |
105 Cel |
4 |
-40 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
2.57 mm |
4096 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
200 MHz |
NOT SPECIFIED |
220 |
MULTIPLE |
27 mm |
2 |
CMOS |
560 mA |
1.26 V |
16 |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B272 |
3 |
Not Qualified |
YES |
NO |
e0 |
|||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
429 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1.99 V |
MIL-PRF-38535 |
22 |
GRID ARRAY |
1.81 V |
BOTTOM |
3.3 mm |
27 mm |
-55 TO 115 OPERATING CASE TEMPERATURE |
YES |
32 |
166.66 MHz |
MULTIPLE |
27 mm |
CMOS |
1.9 V |
1.27 mm |
FLOATING POINT |
S-CBGA-B429 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
376 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
22 |
GRID ARRAY |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.48 mm |
23 mm |
YES |
8 |
30 MHz |
30 |
260 |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
1 mm |
FIXED POINT |
S-PBGA-B376 |
3 |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
697 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
32 |
GRID ARRAY |
1.71 V |
BOTTOM |
YES |
32 |
66 MHz |
MULTIPLE |
CMOS |
1.8 V |
FIXED POINT |
S-PBGA-B697 |
Not Qualified |
NO |
NO |
||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
429 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.99 V |
MIL-PRF-38535 |
22 |
32 |
1.9,3.3 |
GRID ARRAY |
BGA429,21X21,50 |
1.81 V |
115 Cel |
4 |
-55 Cel |
TIN LEAD |
BOTTOM |
3.3 mm |
16384 |
27 mm |
-55 TO 115 OPERATING CASE TEMPERATURE |
YES |
32 |
140.84 MHz |
MULTIPLE |
27 mm |
2 |
CMOS |
1.9 V |
4 |
Digital Signal Processors |
FLASH |
1.27 mm |
FLOATING POINT |
S-CBGA-B429 |
Not Qualified |
YES |
NO |
e0 |
|||||||||||||||||||||||||
Texas Instruments |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.3,3.3 |
GRID ARRAY |
BGA272,20X20,50 |
BOTTOM |
65536 |
CMOS |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B272 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
22 |
GRID ARRAY |
1.71 V |
BOTTOM |
2.32 mm |
27 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
32 |
MULTIPLE |
27 mm |
CMOS |
1.8 V |
1.27 mm |
FIXED POINT |
S-PBGA-B256 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.2,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
TIN LEAD |
BOTTOM |
65536 |
20 |
220 |
CMOS |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
3 |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
376 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
13 |
GRID ARRAY |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.48 mm |
23 mm |
EMIF 22 ADDRESS AND 8 DATA BUS AVAILABLE |
YES |
32 |
27 MHz |
30 |
260 |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
1 mm |
FIXED POINT |
S-PBGA-B376 |
3 |
YES |
NO |
e1 |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2,1.8/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
70 Cel |
0 Cel |
BOTTOM |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
Other Microprocessor ICs |
1 mm |
S-PBGA-B256 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
MILITARY |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
13 |
GRID ARRAY |
1.14 V |
125 Cel |
-55 Cel |
TIN LEAD |
BOTTOM |
2.02 mm |
17 mm |
YES |
32 |
25 MHz |
20 |
220 |
MULTIPLE |
17 mm |
CMOS |
1.2 V |
1 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
NO |
NO |
e0 |
|||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
548 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
23 |
GRID ARRAY |
1.14 V |
85 Cel |
-40 Cel |
BOTTOM |
2.8 mm |
25 mm |
YES |
64 |
75.19 MHz |
MULTIPLE |
25 mm |
CMOS |
1.2 V |
1 mm |
FIXED POINT |
S-PBGA-B548 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
22 |
GRID ARRAY |
1.14 V |
BOTTOM |
2.57 mm |
27 mm |
ALSO OPERATES AT 3.3V SUPPLY |
YES |
32 |
MULTIPLE |
27 mm |
CMOS |
1.2 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B272 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
548 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
23 |
GRID ARRAY |
1.14 V |
BOTTOM |
2.8 mm |
27 mm |
YES |
32 |
75.19 MHz |
MULTIPLE |
27 mm |
CMOS |
1.2 V |
1 mm |
FIXED POINT |
S-PBGA-B548 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
384 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
22 |
32 |
1.2,3.3 |
GRID ARRAY |
BGA384,22X22,32 |
1.14 V |
BOTTOM |
524288 |
YES |
32 |
300 MHz |
MULTIPLE |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B384 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
429 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1.99 V |
MIL-PRF-38535 |
22 |
GRID ARRAY |
1.81 V |
BOTTOM |
3.3 mm |
27 mm |
-40 TO 90 OPERATING CASE TEMPERATURE |
YES |
32 |
140.84 MHz |
MULTIPLE |
27 mm |
CMOS |
1.9 V |
1.27 mm |
FLOATING POINT |
S-CBGA-B429 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
548 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.44 V |
23 |
GRID ARRAY |
1.36 V |
85 Cel |
-40 Cel |
BOTTOM |
2.8 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75.19 MHz |
MULTIPLE |
27 mm |
CMOS |
1.4 V |
1 mm |
FIXED POINT |
S-PBGA-B548 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
429 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
YES |
1.89 V |
MIL-PRF-38535 |
20 |
32 |
1.8,3.3 |
GRID ARRAY |
BGA429,21X21,50 |
1.71 V |
115 Cel |
4 |
-55 Cel |
TIN LEAD |
BOTTOM |
3.3 mm |
16384 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
150 MHz |
MULTIPLE |
27 mm |
2 |
CMOS |
1.8 V |
4 |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
S-CBGA-B429 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
352 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
22 |
32 |
1.8,3.3 |
GRID ARRAY |
BGA352,26X26,40 |
1.71 V |
105 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
3.8 mm |
131072 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
62.5 MHz |
20 |
220 |
MULTIPLE |
27 mm |
CMOS |
1.8 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B352 |
4 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||||||
|
Texas Instruments |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
1.2,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
BOTTOM |
16384 |
CMOS |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
BALL |
429 |
BGA |
SQUARE |
CERAMIC |
YES |
38535Q/M;38534H;883B |
32 |
1.8,3.3 |
GRID ARRAY |
BGA429,21X21,50 |
BOTTOM |
16384 |
CMOS |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
S-XBGA-B429 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
22 |
32 |
1.2,3.3 |
GRID ARRAY |
BGA272,20X20,50 |
BOTTOM |
2.32 mm |
65536 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
27 mm |
CMOS |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B272 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.2,1.8,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
70 Cel |
0 Cel |
BOTTOM |
8192 |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
13 |
32 |
1.2,1.8,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
1.14 V |
70 Cel |
0 Cel |
BOTTOM |
2.05 mm |
8192 |
17 mm |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
YES |
16 |
50 MHz |
MULTIPLE |
17 mm |
CMOS |
1.2 V |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||
Texas Instruments |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.25,3.3 |
GRID ARRAY |
BGA272,20X20,50 |
BOTTOM |
65536 |
CMOS |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B272 |
Not Qualified |
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Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
MILITARY |
BALL |
429 |
BGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1.99 V |
MIL-PRF-38535 Class V |
22 |
GRID ARRAY |
1.81 V |
125 Cel |
-55 Cel |
TIN LEAD |
BOTTOM |
3.3 mm |
27 mm |
YES |
32 |
140 MHz |
MULTIPLE |
27 mm |
CMOS |
1.9 V |
1.27 mm |
FLOATING POINT |
S-CBGA-B429 |
YES |
NO |
e0 |
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Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
548 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.44 V |
23 |
32 |
1.4,3.3 |
GRID ARRAY |
BGA548,26X26,40 |
1.36 V |
BOTTOM |
2.8 mm |
16384 |
27 mm |
YES |
64 |
75 MHz |
MULTIPLE |
27 mm |
CMOS |
1.4 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B548 |
Not Qualified |
YES |
NO |
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|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
AUTOMOTIVE |
BALL |
376 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
0 |
32 |
1.8,3.3 |
GRID ARRAY |
BGA376,22X22,40 |
1.71 V |
125 Cel |
-40 Cel |
BOTTOM |
2.48 mm |
20480 |
23 mm |
YES |
0 |
27 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
23 mm |
CMOS |
1.8 V |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B376 |
Not Qualified |
NO |
NO |
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|
Texas Instruments |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
1.2,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
BOTTOM |
16384 |
CMOS |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B256 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
22 |
GRID ARRAY |
1.14 V |
BOTTOM |
2.57 mm |
27 mm |
ALSO OPERATES AT 3.3V SUPPLY |
YES |
16 |
MULTIPLE |
27 mm |
CMOS |
1.2 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B272 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
22 |
GRID ARRAY |
1.71 V |
BOTTOM |
2.32 mm |
27 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
32 |
150 MHz |
MULTIPLE |
27 mm |
CMOS |
1.8 V |
1.27 mm |
FIXED POINT |
S-PBGA-B256 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
352 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
22 |
GRID ARRAY |
1.71 V |
BOTTOM |
3.8 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
MULTIPLE |
27 mm |
CMOS |
1.8 V |
1 mm |
FIXED POINT |
S-PBGA-B352 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
376 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
22 |
GRID ARRAY |
1.14 V |
85 Cel |
-40 Cel |
BOTTOM |
2.48 mm |
23 mm |
ALSO OPERATES AT 1.05V NOMINAL SUPPLY AT400MHZ |
YES |
8 |
500 MHz |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
1 mm |
FIXED POINT |
S-PBGA-B376 |
NO |
NO |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
376 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
22 |
GRID ARRAY |
70 Cel |
0 Cel |
BOTTOM |
2.48 mm |
23 mm |
YES |
8 |
MULTIPLE |
23 mm |
CMOS |
1 mm |
FIXED POINT |
S-PBGA-B376 |
NO |
NO |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
176 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
20 |
32 |
1.9,3.3 |
GRID ARRAY |
BGA176,14X14,40 |
1.71 V |
85 Cel |
-40 Cel |
BOTTOM |
2.05 mm |
26624 |
15 mm |
ALSO OPERATES AT 3.3V SUPPLY |
YES |
32 |
100 MHz |
MULTIPLE |
15 mm |
CMOS |
1.8 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B176 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
376 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
22 |
GRID ARRAY |
70 Cel |
0 Cel |
BOTTOM |
2.48 mm |
23 mm |
YES |
8 |
MULTIPLE |
23 mm |
CMOS |
1 mm |
FIXED POINT |
S-PBGA-B376 |
NO |
NO |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
22 |
GRID ARRAY |
1.71 V |
BOTTOM |
2.32 mm |
27 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
32 |
167 MHz |
MULTIPLE |
27 mm |
CMOS |
1.8 V |
1.27 mm |
FIXED POINT |
S-PBGA-B256 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
376 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
24 |
GRID ARRAY |
1.14 V |
90 Cel |
0 Cel |
BOTTOM |
2.48 mm |
23 mm |
YES |
16 |
30 MHz |
SINGLE |
23 mm |
CMOS |
1.2 V |
1 mm |
FIXED POINT |
S-PBGA-B376 |
YES |
NO |
Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.
DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.
DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.