HBGA Digital Signal Processors (DSPs) 119

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TMS320DM8168SCYG2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS		1 V	72	Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
TMS320C6202GJL250X	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA352,26X26,40	1.71 V				TIN LEAD	BOTTOM	3.8 mm	32768	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	250 MHz	20	220	MULTIPLE	27 mm		CMOS		1.8 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0
TMS320C6203GJL-200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG		1.425 V	90 Cel		0 Cel		BOTTOM	3.8 mm		27 mm		YES	32	200 MHz			MULTIPLE	27 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C6203GJLA-233	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG		1.425 V	105 Cel		-40 Cel		BOTTOM	3.8 mm		27 mm		YES	32	233 MHz			MULTIPLE	27 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C6424ZDU5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	376	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	32	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA376,22X22,40	1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	20480	23 mm		YES	32	30 MHz	30	260	MULTIPLE	23 mm	5	CMOS		1.2 V	64	Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified	YES	NO	e1	8
TMS320C6203GJLA-200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG		1.425 V	105 Cel		-40 Cel		BOTTOM	3.8 mm		27 mm		YES	32	200 MHz			MULTIPLE	27 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C6202GJLA-100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22			GRID ARRAY, HEAT SINK/SLUG		1.71 V	105 Cel		-40 Cel		BOTTOM	3.8 mm		27 mm		YES	32	100 MHz			MULTIPLE	27 mm		CMOS		1.8 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C6203GJLA-150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG		1.425 V	105 Cel		-40 Cel		BOTTOM	3.8 mm		27 mm		YES	32	150 MHz			MULTIPLE	27 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C6701GJC120	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	3.46 V		32			GRID ARRAY, HEAT SINK/SLUG		3.14 V					BOTTOM	3.5 mm		35 mm		YES	32	120 MHz			MULTIPLE	35 mm		CMOS		3.3 V				1.27 mm	FLOATING POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320DM8168SCYG	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS		1 V	72	Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
TMS320C6424ZDU6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	376	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	32	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA376,22X22,40	1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	20480	23 mm		YES	32	30 MHz	30	260	MULTIPLE	23 mm	5	CMOS		1.2 V	64	Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified	YES	NO	e1	8
TMS320DM8168SCYGA2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS		1 V	72	Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
TMS320C6701GJCA167	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	3.46 V		32			GRID ARRAY, HEAT SINK/SLUG		3.14 V					BOTTOM	3.5 mm		35 mm		YES	32	167 MHz			MULTIPLE	35 mm		CMOS		3.3 V				1.27 mm	FLOATING POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320DM6433ZDU7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	376	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	32	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA376,22X22,40	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	20480	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	27 MHz	30	260	MULTIPLE	23 mm	5	CMOS		1.2 V	72	Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified	YES	NO	e1	8
TMS320C6201BGJLA-233	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22			GRID ARRAY, HEAT SINK/SLUG		1.71 V	105 Cel		-40 Cel		BOTTOM	3.8 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	233 MHz			SINGLE	27 mm		CMOS		1.8 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	NO	NO
TMS320C6202GJL200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	8	22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA352,26X26,40	1.71 V	90 Cel	4	0 Cel	TIN LEAD	BOTTOM	3.8 mm	32768	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	20	220	MULTIPLE	27 mm	2	CMOS		1.8 V	4	Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0	8
TMS320C6203GJLA250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.57 V		22			GRID ARRAY, HEAT SINK/SLUG		1.43 V					BOTTOM	3.8 mm		27 mm	-40 TO 105 OPERATING CASE TEMPERATURE	YES	32	250 MHz			MULTIPLE	27 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320TCI6482BCTZ2	Texas Instruments		OTHER	BALL	697	HBGA	SQUARE	PLASTIC/EPOXY		YES				32	1.25,1.5/1.8,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA697,29X29,32		90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		8192						30	245				CMOS				Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B697	4	Not Qualified			e1
TMS320C6203GJL-233	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG		1.425 V	90 Cel		0 Cel		BOTTOM	3.8 mm		27 mm		YES	32	233 MHz			MULTIPLE	27 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C6202GJLA-150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22			GRID ARRAY, HEAT SINK/SLUG		1.71 V	105 Cel		-40 Cel		BOTTOM	3.8 mm		27 mm		YES	32	150 MHz			MULTIPLE	27 mm		CMOS		1.8 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C6202GJL	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	3.46 V		32			GRID ARRAY, HEAT SINK/SLUG		3.14 V					BOTTOM	3.8 mm		27 mm		YES	32	250 MHz			MULTIPLE	27 mm		CMOS		3.3 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C82GGP50	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	3.465 V		32	32	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA352,26X26,50	3.165 V	85 Cel		0 Cel		BOTTOM	1.7 mm	4096	35 mm		YES	64	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	35 mm		CMOS	2100 mA	3.3 V		Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B352		Not Qualified	NO	YES
TMS320C6201BGJL-200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA352,26X26,40	1.71 V	90 Cel		0 Cel		BOTTOM	3.8 mm	16384	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	NOT SPECIFIED	NOT SPECIFIED	SINGLE	27 mm		CMOS		1.8 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	NO	NO
TMS320C6201BGJC-200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA352,26X26,50	1.71 V	90 Cel		0 Cel		BOTTOM	3.5 mm	16384	35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz			SINGLE	35 mm		CMOS		1.8 V		Digital Signal Processors		1.27 mm	FIXED POINT	S-PBGA-B352		Not Qualified	NO	NO
TMS320DM6435ZDU7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	376	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	13	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA376,22X22,40	1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		20480			YES	32		30	260	MULTIPLE		5	CMOS		1.2 V	72	Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified	NO	NO	e1	8
TMS320C6202BGJL-200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG		1.425 V	90 Cel		0 Cel		BOTTOM	3.8 mm		27 mm		YES	32	200 MHz			MULTIPLE	27 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C6202GJLA-250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22			GRID ARRAY, HEAT SINK/SLUG		1.71 V	105 Cel		-40 Cel		BOTTOM	3.8 mm		27 mm		YES	32	250 MHz			MULTIPLE	27 mm		CMOS		1.8 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C6201BGJCA-200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22			GRID ARRAY, HEAT SINK/SLUG		1.71 V	105 Cel		-40 Cel		BOTTOM	3.5 mm		35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz			SINGLE	35 mm		CMOS		1.8 V				1.27 mm	FIXED POINT	S-PBGA-B352		Not Qualified	NO	NO
TMS320C6202BGJLA-100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG		1.425 V	105 Cel		-40 Cel		BOTTOM	3.8 mm		27 mm		YES	32	100 MHz			MULTIPLE	27 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C6202GJLA233	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	8	22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA352,26X26,40	1.71 V	105 Cel	4	-40 Cel	TIN LEAD	BOTTOM	3.8 mm	32768	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	233 MHz	20	220	MULTIPLE	27 mm	2	CMOS		1.8 V	4	Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0	8
TMS320C6701GJC150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V		22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA352,26X26,50	1.71 V	90 Cel	4	0 Cel	TIN LEAD	BOTTOM	3.5 mm	16384	35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	149.25 MHz	20	220	MULTIPLE	35 mm	2	CMOS		1.8 V	4	Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B352	4	Not Qualified	YES	NO	e0
TMS320DM6435ZDU6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	376	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	13	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA376,22X22,40	1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		20480			YES	32		30	260	MULTIPLE		5	CMOS		1.2 V	72	Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified	NO	NO	e1	8
TMS320C6201BGJL-167	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA352,26X26,40	1.71 V	90 Cel		0 Cel		BOTTOM	3.8 mm	16384	27 mm		YES	32	167 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS		1.8 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C6202GJLA-300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22			GRID ARRAY, HEAT SINK/SLUG		1.71 V	105 Cel		-40 Cel		BOTTOM	3.8 mm		27 mm		YES	32	300 MHz			MULTIPLE	27 mm		CMOS		1.8 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C6202BGJLA-200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG		1.425 V	105 Cel		-40 Cel		BOTTOM	3.8 mm		27 mm		YES	32	200 MHz			MULTIPLE	27 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C6202BGJL-300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG		1.425 V	90 Cel		0 Cel		BOTTOM	3.8 mm		27 mm		YES	32	300 MHz			MULTIPLE	27 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C6203GJL-150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG		1.425 V	90 Cel		0 Cel		BOTTOM	3.8 mm		27 mm		YES	32	150 MHz			MULTIPLE	27 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C6202BGJL-100	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG		1.425 V	90 Cel		0 Cel		BOTTOM	3.8 mm		27 mm		YES	32	100 MHz			MULTIPLE	27 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C6203GJL300	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.57 V		22	32	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA352,26X26,40	1.43 V				TIN LEAD	BOTTOM	3.8 mm	98304	27 mm	0 TO 90 OPERATING CASE TEMPERATURE	YES	32	300 MHz			MULTIPLE	27 mm		CMOS		1.5 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO	e0
TMS320DM8165SCYG2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS		1 V	72	Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	YES	NO	e1
TMS320C6201BGJC-233	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA352,26X26,50	1.71 V	90 Cel		0 Cel		BOTTOM	3.5 mm	16384	35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	233 MHz	NOT SPECIFIED	NOT SPECIFIED	SINGLE	35 mm		CMOS		1.8 V		Digital Signal Processors		1.27 mm	FIXED POINT	S-PBGA-B352		Not Qualified	NO	NO
TMS320C6201BGJL-233	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22	32	1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA352,26X26,40	1.71 V	90 Cel		0 Cel		BOTTOM	3.8 mm	16384	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	233 MHz	NOT SPECIFIED	NOT SPECIFIED	SINGLE	27 mm		CMOS		1.8 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	NO	NO
TMS320C6424ZDUQ5	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	376	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	32	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA376,22X22,40	1.14 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	20480	23 mm		YES	32	30 MHz	30	260	MULTIPLE	23 mm	5	CMOS		1.2 V	64	Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified	YES	NO	e1	8
TMS320DM6435ZDUQ6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	BALL	376	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	13	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA376,22X22,40	1.14 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		20480			YES	32		30	260	MULTIPLE		5	CMOS		1.2 V	72	Digital Signal Processors	MROM	1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified	NO	NO	e1	8
TMS320C6201GGPA-167	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	2.62 V		22			GRID ARRAY, HEAT SINK/SLUG		2.38 V	105 Cel		-40 Cel		BOTTOM	1.7 mm		35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	167 MHz			SINGLE	35 mm		CMOS		2.5 V				1.27 mm	FIXED POINT	S-PBGA-B352		Not Qualified	NO	NO
TMS320C6202GJL-150	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22			GRID ARRAY, HEAT SINK/SLUG		1.71 V	90 Cel		0 Cel		BOTTOM	3.8 mm		27 mm		YES	32	150 MHz			MULTIPLE	27 mm		CMOS		1.8 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320DM6433ZDUL	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	376	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		32	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA376,22X22,40	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	20480	23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	27 MHz	30	260	MULTIPLE	23 mm		CMOS		1.2 V		Digital Signal Processors		1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified	YES	NO	e1
TMS320C6202BGJLA-167	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	352	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		22			GRID ARRAY, HEAT SINK/SLUG		1.425 V	105 Cel		-40 Cel		BOTTOM	3.8 mm		27 mm		YES	32	167 MHz			MULTIPLE	27 mm		CMOS		1.5 V				1 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.