HIPGA Digital Signal Processors (DSPs) 9

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

TMX320C80GF60

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

PIN/PEG

305

HIPGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

3.465 V

32

GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH

3.135 V

85 Cel

0 Cel

PERPENDICULAR

5.59 mm

47.245 mm

YES

64

120 MHz

MULTIPLE

47.245 mm

CMOS

3.3 V

2.54 mm

FLOATING POINT

S-CPGA-P305

Not Qualified

NO

YES

TMX320C80GF50

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

PIN/PEG

305

HIPGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

3.465 V

32

GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH

3.135 V

85 Cel

0 Cel

PERPENDICULAR

5.59 mm

47.245 mm

YES

64

100 MHz

MULTIPLE

47.245 mm

CMOS

3.3 V

2.54 mm

FLOATING POINT

S-CPGA-P305

Not Qualified

NO

YES

SMJ320C80GFM50

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

MILITARY

PIN/PEG

305

HIPGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

NO

3.465 V

8

MIL-PRF-38535

32

32

3.3

GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH

HSPGA305,35X35MOD

3.135 V

125 Cel

4

-55 Cel

TIN LEAD

PERPENDICULAR

5.59 mm

2.4G

51200

47.245 mm

YES

64

50 MHz

MULTIPLE

47.245 mm

3

CMOS

2500 mA

3.3 V

1

Digital Signal Processors

2.54 mm

FLOATING POINT

S-CPGA-P305

Not Qualified

NO

YES

e0

TMS320C80GF

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

PIN/PEG

305

HIPGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

3.465 V

32

32

3.3

GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH

HSPGA305,35X35MOD

3.135 V

85 Cel

0 Cel

PERPENDICULAR

5.59 mm

51200

47.245 mm

YES

64

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

47.245 mm

CMOS

1900 mA

3.3 V

Digital Signal Processors

2.54 mm

FLOATING POINT

S-CPGA-P305

Not Qualified

NO

YES

SM320C80GFM50

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

MILITARY

PIN/PEG

305

HIPGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

NO

3.465 V

8

32

32

3.3

GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH

HSPGA305,35X35MOD

3.135 V

125 Cel

4

-55 Cel

PERPENDICULAR

5.59 mm

2.4G

51200

47.245 mm

YES

64

50 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

47.245 mm

3

CMOS

2500 mA

3.3 V

1

Digital Signal Processors

2.54 mm

FLOATING POINT

S-CPGA-P305

Not Qualified

NO

YES

TMS320C80GF50

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

PIN/PEG

305

HIPGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

NO

3.465 V

8

32

32

3.3

GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH

HSPGA305,35X35MOD

3.135 V

85 Cel

4

0 Cel

PERPENDICULAR

5.59 mm

25600

47.245 mm

YES

64

100 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

47.245 mm

1

CMOS

2300 mA

3.3 V

0

0

Digital Signal Processors

2.54 mm

FLOATING POINT

S-CPGA-P305

Not Qualified

NO

YES

TMS320C80GF60

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

PIN/PEG

305

HIPGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

3.465 V

32

32

3.3

GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH

HSPGA305,35X35MOD

3.135 V

85 Cel

0 Cel

PERPENDICULAR

5.59 mm

51200

47.245 mm

YES

64

120 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

47.245 mm

CMOS

2500 mA

3.3 V

Digital Signal Processors

2.54 mm

FLOATING POINT

S-CPGA-P305

Not Qualified

NO

YES

TMS320C80GF40

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

PIN/PEG

305

HIPGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

NO

3.465 V

8

32

GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH

3.135 V

85 Cel

4

0 Cel

PERPENDICULAR

5.59 mm

25600

47.25 mm

YES

64

80 MHz

MULTIPLE

47.25 mm

1

CMOS

3.3 V

0

0

2.54 mm

FLOATING POINT

S-CPGA-P305

Not Qualified

YES

YES

SM320C80GFA50

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

PIN/PEG

305

HIPGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

3.465 V

32

32

3.3

GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH

HSPGA305,35X35MOD

3.135 V

85 Cel

-40 Cel

PERPENDICULAR

51200

47.245 mm

YES

64

50 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

47.245 mm

CMOS

2500 mA

3.3 V

Digital Signal Processors

2.54 mm

FLOATING POINT

S-CPGA-P305

Not Qualified

NO

YES

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.