HLBGA Digital Signal Processors (DSPs) 11

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code
TMX320C80GGP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HLBGA	SQUARE	PLASTIC/EPOXY		YES	3.465 V		32			GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE		3.135 V	85 Cel			BOTTOM	1.7 mm		35 mm		YES	64				MULTIPLE	35 mm		CMOS		3.3 V				1.27 mm	FLOATING POINT	S-PBGA-B352		Not Qualified	NO	YES
TMX320C80GGP60	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HLBGA	SQUARE	PLASTIC/EPOXY		YES	3.465 V		32			GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE		3.135 V	85 Cel			BOTTOM	1.7 mm		35 mm		YES	64	120 MHz			MULTIPLE	35 mm		CMOS		3.3 V				1.27 mm	FLOATING POINT	S-PBGA-B352		Not Qualified	NO	YES
TMX320C80GGP50	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HLBGA	SQUARE	PLASTIC/EPOXY		YES	3.465 V		32			GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE		3.135 V	85 Cel			BOTTOM	1.7 mm		35 mm		YES	64	100 MHz			MULTIPLE	35 mm		CMOS		3.3 V				1.27 mm	FLOATING POINT	S-PBGA-B352		Not Qualified	NO	YES
TMS320C80GGP50	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HLBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.465 V	8	32	32	3.3	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE	BGA352,26X26,50	3.135 V	85 Cel	4		BOTTOM	1.7 mm	25600	35 mm		YES	64	100 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	35 mm	1	CMOS	2300 mA	3.3 V	0	0	Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B352		Not Qualified	NO	YES
TMS320C80GGP60	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	HLBGA	SQUARE	PLASTIC/EPOXY		YES	3.465 V		32			GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE		3.135 V	85 Cel		TIN LEAD	BOTTOM	1.7 mm		35 mm		YES	64	120 MHz	20	220	MULTIPLE	35 mm		CMOS		3.3 V				1.27 mm	FLOATING POINT	S-PBGA-B352	4	Not Qualified	NO	YES	e0
ADSP-21369KBPZ-X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	HLBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE	BGA256,20X20,50	1.235 V	70 Cel			BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.55 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS		1.3 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified	NO	YES
ADSP-21368KBP-X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	HLBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE	BGA256,20X20,50	1.235 V	70 Cel			BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.55 MHz	40	260	MULTIPLE	27 mm		CMOS		1.3 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified	NO	YES
ADSP-21369KBP-X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	HLBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24	32	1.2,3.3	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE	BGA256,20X20,50	1.235 V	70 Cel			BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.55 MHz	30	240	MULTIPLE	27 mm		CMOS		1.3 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified	NO	YES
ADSP-21367KBP-X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	HLBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24	32	1.3,3.3	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE	BGA256,20X20,50	1.235 V	70 Cel			BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.55 MHz	30	240	MULTIPLE	27 mm		CMOS		1.3 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified	NO	YES
ADSP-21367KBPZ-X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	HLBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24	32	1.3,3.3	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE	BGA256,20X20,50	1.235 V	70 Cel			BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.55 MHz	40	260	MULTIPLE	27 mm		CMOS		1.3 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified	NO	YES
ADSP-21368KBPZ-X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	HLBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24			GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE		1.235 V	70 Cel			BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.55 MHz	40	260	MULTIPLE	27 mm		CMOS		1.3 V				1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified	NO	YES

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.