HLFQFP Digital Signal Processors (DSPs) 201

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

ADSP-SC571KSWZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

70 Cel

0 Cel

MATTE TIN

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

3

YES

YES

e3

ADSP-21364KSQZ-1AX

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

GULL WING

144

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.26 V

16

32

1.2,3.3

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP144,.87SQ,20

1.14 V

70 Cel

0 Cel

MATTE TIN

QUAD

1.6 mm

98304

20 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

55.55 MHz

MULTIPLE

20 mm

CMOS

500 mA

1.2 V

Digital Signal Processors

.5 mm

FLOATING POINT

S-PQFP-G144

Not Qualified

NO

YES

e3

ADSP-21364WBSWZ-1A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

144

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.26 V

16

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.14 V

85 Cel

-40 Cel

TIN

QUAD

1.6 mm

20 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

55.55 MHz

MULTIPLE

20 mm

CMOS

1.2 V

.5 mm

FLOATING POINT

S-PQFP-G144

Not Qualified

NO

YES

e3

ADSP-21366KSQZ-1AX

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

GULL WING

144

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.26 V

16

32

1.2,3.3

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP144,.87SQ,20

1.14 V

70 Cel

0 Cel

MATTE TIN

QUAD

1.6 mm

98304

20 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

55.55 MHz

MULTIPLE

20 mm

CMOS

1.2 V

Digital Signal Processors

.5 mm

FLOATING POINT

S-PQFP-G144

Not Qualified

NO

YES

e3

ADSP-21371KSWZ-2A

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

GULL WING

208

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.26 V

24

32

1.2,3.3

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP208,1.2SQ,20

1.14 V

70 Cel

0 Cel

MATTE TIN

QUAD

1.6 mm

32768

28 mm

YES

32

16.67 MHz

260

MULTIPLE

28 mm

CMOS

1.2 V

Digital Signal Processors

.5 mm

FLOATING POINT

S-PQFP-G208

3

Not Qualified

NO

YES

e3

ADSP-21362WSQZ-2AA

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

GULL WING

144

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.05 V

16

32

1,3.3

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP144,.87SQ,20

.95 V

105 Cel

-40 Cel

MATTE TIN

QUAD

1.6 mm

98304

20 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

MULTIPLE

20 mm

CMOS

1 V

Digital Signal Processors

.5 mm

FLOATING POINT

S-PQFP-G144

Not Qualified

NO

YES

e3

ADSP-CM408FBSWZENG

Analog Devices

DIGITAL SIGNAL PROCESSOR, MIXED

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

3.47 V

24

16

3.3

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP176,1.0SQ,20

3.13 V

105 Cel

-40 Cel

QUAD

1.6 mm

196608

24 mm

YES

15

60 MHz

SINGLE

24 mm

CMOS

3.3 V

Digital Signal Processors

.5 mm

FLOATING POINT

S-PQFP-G176

Not Qualified

YES

NO

ADSP-21366SKSQ-ENG

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

GULL WING

144

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.26 V

16

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.14 V

70 Cel

0 Cel

TIN LEAD

QUAD

1.6 mm

20 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

55.55 MHz

MULTIPLE

20 mm

CMOS

1.2 V

.5 mm

FLOATING POINT

S-PQFP-G144

Not Qualified

NO

YES

e0

ADSP-21571KSWZ-4

Analog Devices

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.15 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.05 V

70 Cel

0 Cel

QUAD

1.6 mm

24 mm

YES

30

260

MULTIPLE

24 mm

CMOS

1.1 V

.5 mm

FIXED POINT

S-PQFP-G176

YES

YES

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.