HTSSOP Digital Signal Processors (DSPs) 9

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Package Style (Meter)	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Nominal Supply Voltage	No. of DMA Channels	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code
TAS3108DCPR	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3.6 V	0	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	3 V	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm	3072	4.4 mm	NO	0	20 MHz	30	260	MULTIPLE	9.7 mm	0	CMOS	3.3 V	0	.5 mm	FIXED POINT	R-PDSO-G38	3	Not Qualified	YES	NO	e4
TAS3108DCPRG4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	0	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	3 V	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm		4.4 mm	NO	0	20 MHz	30	260	MULTIPLE	9.7 mm		CMOS	3.3 V		.5 mm	FIXED POINT	R-PDSO-G38	3	Not Qualified	YES	NO	e4
TAS3108IADCPG4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3.6 V	0	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	3 V	105 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1.2 mm	3072	4.4 mm	NO	0	20 MHz	NOT SPECIFIED	260	MULTIPLE	9.7 mm	0	CMOS	3.3 V	0	.5 mm	FIXED POINT	R-PDSO-G38	3	Not Qualified	YES	NO	e4
TAS3108IADCP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3.6 V	0	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	3 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm	3072	4.4 mm	NO	0	20 MHz	30	260	MULTIPLE	9.7 mm	0	CMOS	3.3 V	0	.5 mm	FIXED POINT	R-PDSO-G38	3	Not Qualified	YES	NO	e4
TAS3108DCPG4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3.6 V	0	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	3 V	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm		4.4 mm	NO	0	20 MHz	30	260	MULTIPLE	9.7 mm	0	CMOS	3.3 V	0	.5 mm	FIXED POINT	R-PDSO-G38	3	Not Qualified	YES	NO	e4
TAS3108IADCPR	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3.6 V	0	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	3 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm	3072	4.4 mm	NO	0	20 MHz	30	260	MULTIPLE	9.7 mm	0	CMOS	3.3 V	0	.5 mm	FIXED POINT	R-PDSO-G38	3	Not Qualified	YES	NO	e4
TAS3108DCP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3.6 V	0	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	3 V	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm	3072	4.4 mm	NO	0	20 MHz	30	260	MULTIPLE	9.7 mm	0	CMOS	3.3 V	0	.5 mm	FIXED POINT	R-PDSO-G38	3	Not Qualified	YES	NO	e4
TAS3103IDCP	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY		YES			SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH					DUAL	1.2 mm		4.4 mm							9.7 mm		CMOS			.5 mm		R-PDSO-G38		Not Qualified
TAS3108IADCPRG4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3.6 V	0	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	3 V	105 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1.2 mm	3072	4.4 mm	NO	0	20 MHz	NOT SPECIFIED	260	MULTIPLE	9.7 mm	0	CMOS	3.3 V	0	.5 mm	FIXED POINT	R-PDSO-G38	3	Not Qualified	YES	NO	e4

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.