LBGA Digital Signal Processors (DSPs) 50

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	Barrel Shifter	JESD-609 Code
DSP56321VL275	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.7 V		18			GRID ARRAY, LOW PROFILE		1.5 V				TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	24	275 MHz	40	260	MULTIPLE	15 mm		CMOS	1.6 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	YES	YES	e1
DSP56311VL150	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		18			GRID ARRAY, LOW PROFILE		1.7 V				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	24	150 MHz	40	260	MULTIPLE	15 mm		CMOS	1.8 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	YES	YES	e1
DSP56311VF150	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		18			GRID ARRAY, LOW PROFILE		1.7 V				TIN LEAD SILVER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	24	150 MHz	30	220	MULTIPLE	15 mm		CMOS	1.8 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	YES	YES	e0
DSP56311VL150R2	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		18			GRID ARRAY, LOW PROFILE		1.7 V				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	24	150 MHz	40	260	MULTIPLE	15 mm		CMOS	1.8 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	YES	YES	e1
DSP56321VL200	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.7 V		18			GRID ARRAY, LOW PROFILE		1.5 V				TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	24	200 MHz	40	260	MULTIPLE	15 mm		CMOS	1.6 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	YES	YES	e1
DSP56311VL150B1	Freescale Semiconductor	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		18			GRID ARRAY, LOW PROFILE		1.7 V				TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	24	150 MHz	40	260	MULTIPLE	15 mm		CMOS	1.8 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	YES	YES	e1
DSP56321VL200R2	Freescale Semiconductor	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.7 V		18			GRID ARRAY, LOW PROFILE		1.5 V				TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	24	200 MHz	40	260	MULTIPLE	15 mm		CMOS	1.6 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	YES	YES	e1
DSP56311VF150R2	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		18			GRID ARRAY, LOW PROFILE		1.7 V				TIN LEAD SILVER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	24	150 MHz	30	220	MULTIPLE	15 mm		CMOS	1.8 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	YES	YES	e0
ADSP-21369BBPZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		260	MULTIPLE	27 mm		CMOS	1.2 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	NO	YES	e1
ADSP-21369KBPZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.25 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.67 MHz			MULTIPLE	27 mm		CMOS	1.3 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	NO	YES	e1
DSP56303VL100	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V		18			GRID ARRAY, LOW PROFILE		3 V				TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm		YES	24	100 MHz	40	260	MULTIPLE	15 mm		CMOS	3.3 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	YES	YES	e1
DSP56321VF275	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.7 V		18			GRID ARRAY, LOW PROFILE		1.5 V				TIN LEAD SILVER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	24	275 MHz	30	220	MULTIPLE	15 mm		CMOS	1.6 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	YES	YES	e0
DSP56321VL240	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.7 V		18			GRID ARRAY, LOW PROFILE		1.5 V				TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	24	240 MHz	40	260	MULTIPLE	15 mm		CMOS	1.6 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	YES	YES	e1
DSP56321VL220	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.7 V		18			GRID ARRAY, LOW PROFILE		1.5 V				TIN SILVER COPPER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	24	220 MHz	40	260	MULTIPLE	15 mm		CMOS	1.6 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	YES	YES	e1
DSP56303VF100	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V		18			GRID ARRAY, LOW PROFILE		3 V				TIN LEAD	BOTTOM	1.6 mm		15 mm		YES	24	100 MHz	30	220	MULTIPLE	15 mm		CMOS	3.3 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	YES	YES	e0
XC56309VF100A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V		18			GRID ARRAY, LOW PROFILE		3 V	100 Cel		-40 Cel		BOTTOM	1.6 mm		15 mm	ALSO HAVING 16-BIT ALU	YES	24	100 MHz			MULTIPLE	15 mm		CMOS	3.3 V				1 mm	FIXED POINT	S-PBGA-B196			YES	YES
XC56L307VF160	Motorola	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		18			GRID ARRAY, LOW PROFILE		1.7 V					BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	24	160 MHz			MULTIPLE	15 mm		CMOS	1.8 V				1 mm	FIXED POINT	S-PBGA-B196		Not Qualified	YES	YES
TMS320C6201BGA	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	NO	YES	3.46 V	32	23			GRID ARRAY, LOW PROFILE		2.38 V	90 Cel	5	0 Cel		BOTTOM	1.7 mm	8192	35 mm		YES	32	200 MHz			MULTIPLE	35 mm	0	CMOS	3.3 V	2	0		1.27 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C6201GGP167	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	352	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22	32	2.5,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.71 V					BOTTOM	1.7 mm	16384	35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	167 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	35 mm		CMOS	1.8 V			Digital Signal Processors	1.27 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
TMS320C6201GGP200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	352	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.89 V		22	32	2.5,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.71 V					BOTTOM	1.7 mm	16384	35 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	200 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	35 mm		CMOS	1.8 V			Digital Signal Processors	1.27 mm	FIXED POINT	S-PBGA-B352		Not Qualified	YES	NO
ADSP-21368SKBPZENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24			GRID ARRAY, LOW PROFILE		1.235 V	70 Cel		0 Cel		BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS	1.3 V				1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified	NO	YES
ADSP-21367BBP-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		225	MULTIPLE	27 mm		CMOS	1.2 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	NO	YES	e0
ADSP-21367KBPZ-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24			GRID ARRAY, LOW PROFILE		1.235 V	70 Cel		0 Cel		BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS	1.3 V				1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified	NO	YES
ADSP-21368KBPZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		260	MULTIPLE	27 mm		CMOS	1.2 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	NO	YES	e1
ADSP-21368BBP-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		225	MULTIPLE	27 mm		CMOS	1.2 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	NO	YES	e0
ADSP-21368BBPZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		260	MULTIPLE	27 mm		CMOS	1.2 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	NO	YES	e1
ADSP-21368KBPZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.25 V	70 Cel		0 Cel		BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.67 MHz	40	260	MULTIPLE	27 mm		CMOS	1.3 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified	NO	YES
ADSP-21535PKCA-300	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V		32	32	1.5,3.3	GRID ARRAY, LOW PROFILE	BGA256(UNSPEC)	.86 V	85 Cel		0 Cel	TIN LEAD	BOTTOM	1.7 mm	8192	27 mm		YES	32	300 MHz			SINGLE	27 mm		CMOS	1.5 V			Digital Signal Processors	1.27 mm	FIXED POINT	S-PBGA-B256		Not Qualified	YES	YES	e0
ADSP-21367KBP-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24			GRID ARRAY, LOW PROFILE		1.235 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz			MULTIPLE	27 mm		CMOS	1.3 V				1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified	NO	YES	e0
ADSP-21369BBP-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		225	MULTIPLE	27 mm		CMOS	1.2 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	NO	YES	e0
ADSP-21369KBP-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		225	MULTIPLE	27 mm		CMOS	1.2 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	NO	YES	e0
ADSP-21369KBPZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz	30	260	MULTIPLE	27 mm		CMOS	1.2 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	NO	YES	e1
ADSP-21367KBPZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.25 V	70 Cel		0 Cel		BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.67 MHz	40	260	MULTIPLE	27 mm		CMOS	1.3 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified	NO	YES
ADSP-21367KBPZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		260	MULTIPLE	27 mm		CMOS	1.2 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	NO	YES	e1
ADSP-21369KBPZ-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24			GRID ARRAY, LOW PROFILE		1.235 V	70 Cel		0 Cel		BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS	1.3 V				1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified	NO	YES
ADSP-21368SKBP-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24			GRID ARRAY, LOW PROFILE		1.235 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz			MULTIPLE	27 mm		CMOS	1.3 V				1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified	NO	YES	e0
ADSP-21368KBP-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		225	MULTIPLE	27 mm		CMOS	1.2 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	NO	YES	e0
ADSP-21367BBPZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	85 Cel		-40 Cel		BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		260	MULTIPLE	27 mm		CMOS	1.2 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	NO	YES
ADSP-21368KBPZ-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24			GRID ARRAY, LOW PROFILE		1.235 V	70 Cel		0 Cel		BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	27 mm		CMOS	1.3 V				1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified	NO	YES
ADSP-21367KBP-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	1.7 mm	65536	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	55.56 MHz		225	MULTIPLE	27 mm		CMOS	1.2 V			Digital Signal Processors	1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified	NO	YES	e0
ADSP-21368KBP-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24			GRID ARRAY, LOW PROFILE		1.235 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz			MULTIPLE	27 mm		CMOS	1.3 V				1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified	NO	YES	e0
ADSP-21369KBP-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V		24			GRID ARRAY, LOW PROFILE		1.235 V	70 Cel		0 Cel	TIN LEAD	BOTTOM	1.7 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66.66 MHz			MULTIPLE	27 mm		CMOS	1.3 V				1.27 mm	FLOATING POINT	S-PBGA-B256		Not Qualified	NO	YES	e0
ADSP-CM409FCBCZENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	INDUSTRIAL	BALL	212	LBGA	SQUARE	PLASTIC/EPOXY		YES	3.47 V		24			GRID ARRAY, LOW PROFILE		3.13 V	105 Cel		-40 Cel		BOTTOM	1.7 mm		19 mm		YES	15	60 MHz			SINGLE	19 mm		CMOS	3.3 V				1 mm	FLOATING POINT	S-PBGA-B212			YES	NO
SPAKXC309VF100A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V		18			GRID ARRAY, LOW PROFILE		3 V					BOTTOM	1.6 mm		15 mm		YES	24	100 MHz			MULTIPLE	15 mm		CMOS	3.3 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	YES	YES
XC56309VL100A	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V		18			GRID ARRAY, LOW PROFILE		3 V	100 Cel		-40 Cel		BOTTOM	1.6 mm		15 mm	ALSO HAVING 16-BIT ALU	YES	24	100 MHz	40	260	MULTIPLE	15 mm		CMOS	3.3 V				1 mm	FIXED POINT	S-PBGA-B196			YES	YES
DSP56321VF240	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.7 V		18			GRID ARRAY, LOW PROFILE		1.5 V				TIN LEAD	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	24	240 MHz	30	220	MULTIPLE	15 mm		CMOS	1.6 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	YES	YES	e0
DSP56303VF100R2	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V		18			GRID ARRAY, LOW PROFILE		3 V				TIN LEAD	BOTTOM	1.6 mm		15 mm		YES	24	100 MHz	30	220	MULTIPLE	15 mm		CMOS	3.3 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	YES	YES	e0
DSP56321VF220	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		BALL	196	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.7 V		18			GRID ARRAY, LOW PROFILE		1.5 V				TIN LEAD SILVER	BOTTOM	1.6 mm		15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	24	220 MHz	30	220	MULTIPLE	15 mm		CMOS	1.6 V				1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	YES	YES	e0

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.