Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Internal Bus Architecture | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Barrel Shifter | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, CONTROLLER |
AUTOMOTIVE |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
16 |
0 |
16 |
3.3 |
FLATPACK, THIN PROFILE |
TQFP44,.39SQ,31 |
3 V |
150 Cel |
3 |
-40 Cel |
MATTE TIN |
QUAD |
1.2 mm |
10 mm |
YES |
0 |
40 |
260 |
10 mm |
5 |
CMOS |
76 mA |
3.3 V |
8 |
2 |
Digital Signal Processors |
FLASH |
.8 mm |
FLOATING POINT |
S-PQFP-G44 |
3 |
Not Qualified |
YES |
e3 |
24 |
|||||||||||||||||||||||
|
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, CONTROLLER |
AUTOMOTIVE |
NO LEAD |
28 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
16 |
0 |
16 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.32SQ,25 |
3 V |
150 Cel |
3 |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
8 mm |
YES |
0 |
40 |
260 |
8 mm |
5 |
CMOS |
76 mA |
3.3 V |
8 |
2 |
Digital Signal Processors |
FLASH |
.65 mm |
FLOATING POINT |
S-PQCC-N44 |
1 |
Not Qualified |
YES |
e3 |
24 |
|||||||||||||||||||||||
|
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
NO LEAD |
44 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
TS 16949 |
0 |
NO |
16 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC44,.31SQ,25 |
3 V |
85 Cel |
3 |
-40 Cel |
MATTE TIN |
YES |
QUAD |
NO |
1 mm |
2048 |
8 mm |
YES |
0 |
40 MHz |
40 |
260 |
MULTIPLE |
8 mm |
5 |
CMOS |
80 mA |
3.3 V |
YES |
1 |
Digital Signal Processors |
FLASH |
.65 mm |
FIXED POINT |
S-PQCC-N44 |
1 |
Not Qualified |
40 rpm |
YES |
YES |
e3 |
24 |
35 |
|||||||||||||
|
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, CONTROLLER |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
16 |
0 |
16 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC28,.24SQ,25 |
3 V |
85 Cel |
3 |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
6 mm |
YES |
0 |
40 |
260 |
6 mm |
5 |
CMOS |
76 mA |
3.3 V |
8 |
2 |
Digital Signal Processors |
FLASH |
.65 mm |
FLOATING POINT |
S-PQCC-N28 |
1 |
Not Qualified |
YES |
e3 |
24 |
|||||||||||||||||||||||
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
160 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
2.75 V |
24 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.25 V |
105 Cel |
-40 Cel |
QUAD |
1.6 mm |
24 mm |
YES |
16 |
120 MHz |
40 |
260 |
MULTIPLE |
24 mm |
CMOS |
2.5 V |
.5 mm |
FIXED POINT |
S-PQFP-G160 |
YES |
YES |
||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
2.75 V |
17 |
16 |
2.5,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
2.25 V |
105 Cel |
56800E |
-40 Cel |
TIN |
QUAD |
1.6 mm |
262144 |
20 mm |
ALSO REQUIRES 3.3 V SUPPLY |
YES |
16 |
120 MHz |
40 |
260 |
MULTIPLE |
20 mm |
20480 |
CMOS |
2.5 V |
Microcontrollers |
FLASH |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
3 |
Not Qualified |
60 rpm |
YES |
NO |
e3 |
|||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
0 |
16 |
1.2,2.5,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA400,20X20,32 |
1.14 V |
-40 Cel |
Tin/Lead/Silver (Sn/Pb/Ag) |
BOTTOM |
1.6 mm |
262144 |
17 mm |
YES |
0 |
300 MHz |
40 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B400 |
3 |
Not Qualified |
NO |
NO |
e0 |
||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, MIXED |
INDUSTRIAL |
BALL |
289 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.675 V |
25 |
16 |
1.6,1.8/2.75/3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA289,21X21,20 |
1.525 V |
85 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
163840 |
12 mm |
ALSO REQUIRES 2.75V OR 3.3V SUPPLY |
YES |
16 |
13 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
12 mm |
CMOS |
1.6 V |
Digital Signal Processors |
.5 mm |
FIXED POINT |
S-PBGA-B289 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, MIXED |
INDUSTRIAL |
BALL |
289 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.675 V |
25 |
16 |
1.6,1.8/2.75/3.3 |
GRID ARRAY |
BGA289,17X17,40 |
1.525 V |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
2.32 mm |
163840 |
19 mm |
ALSO REQUIRES 2.75V OR 3.3V SUPPLY |
YES |
16 |
13 MHz |
NOT SPECIFIED |
220 |
MULTIPLE |
19 mm |
8 |
CMOS |
1.6 V |
6 |
Digital Signal Processors |
MROM |
1 mm |
FIXED POINT |
S-PBGA-B289 |
3 |
Not Qualified |
192 rpm |
YES |
NO |
e0 |
16 |
||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, MIXED |
INDUSTRIAL |
BALL |
289 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.675 V |
25 |
16 |
1.6,1.8/2.75/3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA289,21X21,20 |
1.525 V |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
1.2 mm |
163840 |
12 mm |
ALSO REQUIRES 2.75V OR 3.3V SUPPLY |
YES |
16 |
13 MHz |
20 |
220 |
MULTIPLE |
12 mm |
8 |
CMOS |
1.6 V |
6 |
Digital Signal Processors |
MROM |
.5 mm |
FIXED POINT |
S-PBGA-B289 |
4 |
Not Qualified |
YES |
NO |
e0 |
16 |
|||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
32 |
24 |
32 |
5 |
FLATPACK |
QFP144,1.2SQ |
4.75 V |
85 Cel |
4 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
4.1 mm |
512 |
28 mm |
NO |
32 |
40 MHz |
30 |
245 |
MULTIPLE |
28 mm |
2 |
CMOS |
390 mA |
5 V |
2 |
1 |
Digital Signal Processors |
.65 mm |
FLOATING POINT |
S-PQFP-G144 |
4 |
Not Qualified |
YES |
YES |
e4 |
|||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
132 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
16 |
16 |
16 |
5 |
FLATPACK |
SPQFP132,1.1SQ |
4.75 V |
85 Cel |
5 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
4.57 mm |
1056 |
24.13 mm |
9K WORDS DATA/PROG RAM |
YES |
16 |
57.14 MHz |
30 |
260 |
MULTIPLE |
24.13 mm |
1 |
CMOS |
112 mA |
5 V |
0 |
1 |
Digital Signal Processors |
MROM |
.635 mm |
FIXED POINT |
S-PQFP-G132 |
4 |
Not Qualified |
YES |
YES |
e4 |
16 |
||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
548 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.44 V |
23 |
32 |
1.4,3.3 |
GRID ARRAY, FINE PITCH |
BGA548,26X26,32 |
1.36 V |
90 Cel |
4 |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
2.8 mm |
262144 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75.19 MHz |
NOT SPECIFIED |
220 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.4 V |
64 |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B548 |
4 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
548 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.44 V |
23 |
32 |
1.4,3.3 |
GRID ARRAY, FINE PITCH |
BGA548,26X26,32 |
1.36 V |
105 Cel |
4 |
-40 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
2.8 mm |
262144 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75.19 MHz |
NOT SPECIFIED |
220 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.4 V |
64 |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B548 |
4 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
548 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.44 V |
23 |
32 |
1.4,3.3 |
GRID ARRAY |
BGA548,26X26,40 |
1.36 V |
105 Cel |
4 |
-40 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
2.8 mm |
262144 |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75.19 MHz |
NOT SPECIFIED |
220 |
MULTIPLE |
27 mm |
3 |
CMOS |
1.4 V |
64 |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B548 |
4 |
Not Qualified |
YES |
NO |
e0 |
||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
548 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.44 V |
23 |
32 |
1.4,3.3 |
GRID ARRAY, FINE PITCH |
BGA548,26X26,32 |
1.36 V |
90 Cel |
4 |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
2.8 mm |
262144 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75.19 MHz |
NOT SPECIFIED |
260 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.4 V |
64 |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B548 |
4 |
Not Qualified |
YES |
NO |
e1 |
||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
548 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.44 V |
23 |
32 |
1.4,3.3 |
GRID ARRAY, FINE PITCH |
BGA548,26X26,32 |
1.36 V |
90 Cel |
4 |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
2.8 mm |
262144 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75.19 MHz |
NOT SPECIFIED |
260 |
MULTIPLE |
23 mm |
3 |
CMOS |
1.4 V |
64 |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B548 |
4 |
Not Qualified |
YES |
NO |
e1 |
||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.16 V |
23 |
32 |
1.1,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.05 V |
105 Cel |
-40 Cel |
BOTTOM |
3.25 mm |
16384 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
75 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
23 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
8 |
32 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA361,19X19,32 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
81920 |
16 mm |
YES |
32 |
30 MHz |
30 |
260 |
MULTIPLE |
16 mm |
5 |
CMOS |
1.2 V |
64 |
Digital Signal Processors |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
3 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
697 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2875 V |
20 |
32 |
1.2 |
GRID ARRAY, FINE PITCH |
BGA697,29X29,32 |
1.2125 V |
105 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
3.242 mm |
32768 |
24 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
66.6 MHz |
NOT SPECIFIED |
220 |
MULTIPLE |
24 mm |
4 |
CMOS |
1.25 V |
64 |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B697 |
4 |
Not Qualified |
YES |
NO |
e0 |
|||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
841 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
24 |
32 |
1,1.5,1.8 |
GRID ARRAY, FINE PITCH |
BGA841,29X29,32 |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.39 mm |
8192 |
24 mm |
YES |
16 |
30 |
245 |
MULTIPLE |
24 mm |
16 |
CMOS |
80 |
Digital Signal Processors |
.8 mm |
FLOATING POINT |
S-PBGA-B841 |
4 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
841 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
24 |
32 |
1,1.5,1.8 |
GRID ARRAY, FINE PITCH |
BGA841,29X29,32 |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.39 mm |
8192 |
24 mm |
YES |
16 |
30 |
245 |
MULTIPLE |
24 mm |
16 |
CMOS |
80 |
Digital Signal Processors |
.8 mm |
FLOATING POINT |
S-PBGA-B841 |
4 |
Not Qualified |
YES |
NO |
e1 |
|||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
144 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
32 |
32 |
1.2,3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP144,.9SQ |
1.14 V |
90 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.2 mm |
131072 |
20 mm |
32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY |
YES |
32 |
25 MHz |
30 |
260 |
MULTIPLE |
20 mm |
CMOS |
1.2 V |
16 |
Digital Signal Processors |
MROM |
.5 mm |
FLOATING POINT |
S-PQFP-G144 |
4 |
Not Qualified |
NO |
NO |
e4 |
8 |
||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
8 |
13 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA361,19X19,32 |
1.14 V |
90 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
20480 |
YES |
32 |
30 |
260 |
MULTIPLE |
5 |
CMOS |
1.2 V |
72 |
Digital Signal Processors |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
3 |
Not Qualified |
YES |
NO |
e1 |
8 |
||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, MIXED |
COMMERCIAL |
BALL |
1031 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
15 |
32 |
1 |
GRID ARRAY, HEAT SINK/SLUG |
BGA1031,37X37,25 |
.95 V |
95 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
3.31 mm |
16384 |
25 mm |
YES |
32 |
NOT SPECIFIED |
245 |
MULTIPLE |
25 mm |
8 |
CMOS |
1 V |
72 |
Digital Signal Processors |
.65 mm |
FLOATING POINT |
S-PBGA-B1031 |
4 |
Not Qualified |
YES |
NO |
e1 |
||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
179 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
2 V |
16 |
19 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA179,14X14,32 |
1.81 V |
85 Cel |
C28X |
3 |
-40 Cel |
TIN LEAD |
YES |
BOTTOM |
1.4 mm |
18432 |
12 mm |
ALSO OPERATES AT 1.8 SUPPLY AT 135MHZ |
YES |
16 |
150 MHz |
20 |
220 |
MULTIPLE |
12 mm |
7 |
36864 |
CMOS |
230 mA |
1.9 V |
0 |
YES |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B179 |
3 |
YES |
NO |
e0 |
16 |
|||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
16 |
20 |
16 |
1.2,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
1.2 V |
85 Cel |
4 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1.6 mm |
32768 |
24 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
50 MHz |
NOT SPECIFIED |
260 |
MULTIPLE |
24 mm |
4 |
CMOS |
239 mA |
1.26 V |
6 |
Digital Signal Processors |
MROM |
.5 mm |
FIXED POINT |
S-PQFP-G176 |
4 |
Not Qualified |
YES |
NO |
e4 |
16 |
|||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
179 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.65 V |
16 |
8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA179,14X14,32 |
1.55 V |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
1.4 mm |
128K |
12 mm |
YES |
16 |
20 MHz |
20 |
220 |
MULTIPLE |
12 mm |
2 |
CMOS |
1.6 V |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B179 |
3 |
YES |
NO |
e0 |
16 |
||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
1 |
32 |
32 |
5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
QFP240,1.3SQ,20 |
4.75 V |
85 Cel |
3 |
0 Cel |
MATTE TIN |
QUAD |
4.1 mm |
4M |
32 mm |
40 MIPS; 16/32 BIT PARALLEL HOST INTERFACE PORT; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED |
YES |
48 |
40 MHz |
260 |
MULTIPLE |
32 mm |
1 |
CMOS |
850 mA |
5 V |
10 |
2 |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G240 |
3 |
Not Qualified |
YES |
YES |
e3 |
|||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
225 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
24 |
32 |
1.8,3.3 |
GRID ARRAY |
BGA225,15X15,40 |
1.71 V |
85 Cel |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
1.85 mm |
32768 |
17 mm |
YES |
48 |
27.5 MHz |
240 |
MULTIPLE |
17 mm |
CMOS |
1.8 V |
Digital Signal Processors |
1 mm |
FLOATING POINT |
S-PBGA-B225 |
3 |
Not Qualified |
NO |
YES |
e0 |
||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
136 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
16 |
32 |
1.2,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA136,14X14,32 |
1.14 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.7 mm |
98304 |
12 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
16 |
55.55 MHz |
30 |
260 |
MULTIPLE |
12 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FLOATING POINT |
S-PBGA-B136 |
3 |
Not Qualified |
NO |
YES |
e1 |
|||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
136 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
16 |
32 |
1.2,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA136,14X14,32 |
1.14 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.7 mm |
98304 |
12 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
16 |
55.55 MHz |
260 |
MULTIPLE |
12 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FLOATING POINT |
S-PBGA-B136 |
3 |
Not Qualified |
NO |
YES |
e1 |
||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, MIXED |
COMMERCIAL |
GULL WING |
100 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
8 |
24 |
40 |
1.2,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
1.14 V |
70 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1.6 mm |
5242880 |
14 mm |
YES |
16 |
16.67 MHz |
30 |
260 |
MULTIPLE |
14 mm |
1 |
CMOS |
1.2 V |
65 |
1 |
Digital Signal Processors |
FLASH |
.5 mm |
FLOATING POINT |
S-PQFP-G100 |
3 |
Not Qualified |
YES |
YES |
e3 |
8 |
|||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
2.63 V |
14 |
16 |
2.5,2.5/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
2.37 V |
70 Cel |
0 Cel |
Tin/Lead (Sn85Pb15) - with Silver (Ag) barrier |
QUAD |
1.6 mm |
16384 |
14 mm |
NO |
24 |
37.5 MHz |
30 |
240 |
MULTIPLE |
14 mm |
CMOS |
2.5 V |
Digital Signal Processors |
.5 mm |
FIXED POINT |
S-PQFP-G100 |
3 |
Not Qualified |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
14 |
16 |
2.5/3.3 |
FLATPACK |
QFP100,.63SQ,20 |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
16384 |
ALSO REQUIRES 3.3V SUPPLY |
NO |
24 |
75 MHz |
MULTIPLE |
CMOS |
2.5 V |
Digital Signal Processors |
.5 mm |
FIXED POINT |
S-PQFP-G100 |
Not Qualified |
YES |
YES |
e0 |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
2.63 V |
14 |
16 |
2.5,2.5/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
2.37 V |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
1.6 mm |
8192 |
14 mm |
NO |
24 |
37.5 MHz |
30 |
260 |
MULTIPLE |
14 mm |
CMOS |
2.5 V |
Digital Signal Processors |
.5 mm |
FIXED POINT |
S-PQFP-G100 |
3 |
Not Qualified |
YES |
YES |
e3 |
||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
14 |
16 |
2/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
57344 |
14 mm |
NO |
24 |
40 MHz |
30 |
260 |
MULTIPLE |
14 mm |
CMOS |
1.8 V |
Digital Signal Processors |
.5 mm |
FIXED POINT |
S-PQFP-G100 |
3 |
Not Qualified |
YES |
YES |
e3 |
||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
208 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.9 V |
19 |
32 |
1.2,2.5/3.3 |
GRID ARRAY, FINE PITCH |
BGA208,20X20,32 |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.75 mm |
17 mm |
YES |
16 |
50 MHz |
30 |
260 |
MULTIPLE |
17 mm |
CMOS |
1.8 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B208 |
3 |
Not Qualified |
300 rpm |
YES |
YES |
e1 |
||||||||||||||||||||||||||||
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
297 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.375 V |
23 |
32 |
1.2,2.5/3.3 |
GRID ARRAY |
BGA297,26X26,40 |
.8 V |
70 Cel |
0 Cel |
TIN LEAD SILVER |
BOTTOM |
2.43 mm |
27 mm |
ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY |
YES |
32 |
500 MHz |
225 |
MULTIPLE |
27 mm |
CMOS |
1.25 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B297 |
3 |
Not Qualified |
500 rpm |
YES |
YES |
e0 |
|||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.4185 V |
23 |
32 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA256,16X16,25 |
.8 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.7 mm |
12 mm |
ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY |
YES |
32 |
600 MHz |
260 |
MULTIPLE |
12 mm |
CMOS |
1.35 V |
Microprocessors |
.65 mm |
FIXED POINT |
S-PBGA-B256 |
3 |
Not Qualified |
600 rpm |
YES |
YES |
e1 |
||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
297 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.4185 V |
23 |
32 |
1.2,2.5/3.3 |
GRID ARRAY |
BGA297,26X26,40 |
.8 V |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.43 mm |
27 mm |
ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY |
YES |
32 |
600 MHz |
260 |
MULTIPLE |
27 mm |
CMOS |
1.35 V |
Microprocessors |
1 mm |
FIXED POINT |
S-PBGA-B297 |
3 |
Not Qualified |
600 rpm |
YES |
YES |
e1 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
16 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
3 V |
85 Cel |
-40 Cel |
TIN |
QUAD |
1.6 mm |
1024 |
7 mm |
YES |
0 |
80 MHz |
40 |
260 |
MULTIPLE |
7 mm |
CMOS |
130 mA |
3.3 V |
Digital Signal Processors |
.5 mm |
FIXED POINT |
S-PQFP-G48 |
3 |
Not Qualified |
YES |
YES |
e3 |
|||||||||||||||||||||||||||
|
Microchip Technology |
AUTOMOTIVE |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
3/5 |
FLATPACK |
TQFP64,.47SQ |
125 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
2048 |
CMOS |
Digital Signal Processors |
.5 mm |
FIXED POINT |
S-PQFP-G64 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, CONTROLLER |
AUTOMOTIVE |
GULL WING |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100 |
0 |
16 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
4.75 V |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1.2 mm |
10 mm |
ALSO OPERATES AT 3V MINIMUM SUPPLY AT 10 MHZ |
0 |
40 MHz |
10 mm |
CMOS |
5 V |
FLASH |
.5 mm |
S-PQFP-G64 |
e3 |
24 |
||||||||||||||||||||||||||||||||||||
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, CONTROLLER |
AUTOMOTIVE |
GULL WING |
80 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
AEC-Q100; TS 16949 |
0 |
16 |
FLATPACK, THIN PROFILE |
TQFP80,.55SQ |
3 V |
125 Cel |
3 |
-40 Cel |
QUAD |
1.2 mm |
32768 |
12 mm |
YES |
0 |
64 MHz |
MULTIPLE |
12 mm |
5 |
CMOS |
98 mA |
3.3 V |
8 |
2 |
FLASH |
.5 mm |
FIXED POINT |
S-PQFP-G80 |
YES |
YES |
24 |
|||||||||||||||||||||||||||
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, OTHER |
AUTOMOTIVE |
GULL WING |
80 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
AEC-Q100; TS 16949 |
0 |
16 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP80,.55SQ |
3 V |
125 Cel |
3 |
-40 Cel |
QUAD |
1.2 mm |
49152 |
12 mm |
YES |
0 |
64 MHz |
MULTIPLE |
12 mm |
5 |
CMOS |
98 mA |
3.3 V |
8 |
2 |
FLASH |
.5 mm |
FIXED POINT |
S-PQFP-G80 |
YES |
YES |
24 |
|||||||||||||||||||||||||||
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
0 |
16 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
3 V |
85 Cel |
3 |
-40 Cel |
QUAD |
.6 mm |
49152 |
6 mm |
16kbytes slave core Ram available |
YES |
0 |
64 MHz |
MULTIPLE |
6 mm |
6 |
CMOS |
98 mA |
3.3 V |
8 |
2 |
FLASH |
.4 mm |
FIXED POINT |
S-PQCC-N48 |
YES |
YES |
24 |
|||||||||||||||||||||||||||
|
Microchip Technology |
DIGITAL SIGNAL PROCESSOR, CONTROLLER |
AUTOMOTIVE |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
AEC-Q100 |
16 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.2SQ,16 |
3 V |
125 Cel |
4 |
-40 Cel |
Matte Tin (Sn) |
QUAD |
.6 mm |
16384 |
5 mm |
YES |
64 MHz |
MULTIPLE |
5 mm |
2 |
CMOS |
42.5 mA |
3.3 V |
4 |
4 |
FLASH |
.4 mm |
FIXED POINT |
S-PQCC-N36 |
YES |
YES |
e3 |
24 |
Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.
DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.
DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.