SQUARE Digital Signal Processors (DSPs) 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-2105KP-55	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16		14	16	5	CHIP CARRIER	LDCC68,1.0SQ	4.5 V	70 Cel	1	0 Cel	TIN LEAD	QUAD	4.45 mm	512	24.18 mm	20 MIPS; SINGLE CYCLE INSTRUCTION EXECUTION	NO	24	13.824 MHz			MULTIPLE	24.18 mm	1	CMOS	24 mA	5 V	0	1	Digital Signal Processors		1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified		YES	YES	e0
ADSP-21060KS-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	1		32	32	5	FLATPACK, HEAT SINK/SLUG, FINE PITCH	QFP240,1.3SQ,20	4.75 V	85 Cel	3	0 Cel	TIN LEAD	QUAD	4.1 mm	4M	32 mm	40 MIPS; 16/32 BIT PARALLEL HOST INTERFACE PORT; 120 MFLOPS PEAK; 80 MFLOPS SUSTAINED	YES	48	40 MHz		225	MULTIPLE	32 mm	1	CMOS	850 mA	5 V	10	2	Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G240	3	Not Qualified		YES	YES	e0
ADSP-21062LCS-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER		GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY		YES	3.45 V			32	32	3.3	FLATPACK, HEAT SINK/SLUG, FINE PITCH	QFP240,1.3SQ,20	3.15 V				TIN LEAD	QUAD	4.1 mm	65536	32 mm		YES	48	40 MHz		225	MULTIPLE	32 mm		CMOS	600 mA	3.3 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G240	3	Not Qualified		YES	YES	e0
ADSP-21065LKS-240	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V			24	32	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	3.13 V	85 Cel		0 Cel	TIN LEAD	QUAD	4.1 mm	16384	28 mm		YES	32	30 MHz		240	MULTIPLE	28 mm		CMOS	470 mA	3.3 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G208	3	Not Qualified		NO	YES	e0
ADSP-21160MKBZ-80	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	400	BGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V			32	32	2.5,3.3	GRID ARRAY	BGA400,20X20,50	2.37 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.49 mm	131072	27 mm		YES	64	80 MHz		260	MULTIPLE	27 mm		CMOS		2.5 V			Digital Signal Processors		1.27 mm	FLOATING POINT	S-PBGA-B400	3	Not Qualified		YES	YES	e1
ADSP-21262SBBC-150	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	85 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	1.7 mm	65536	12 mm		YES	16	50 MHz		240	MULTIPLE	12 mm		CMOS		1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e0
ADSP-21262SKBC-200	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.26 V	32		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	1.7 mm	65536	12 mm		YES	16	200 MHz		240	MULTIPLE	12 mm	3	CMOS		1.2 V	22		Digital Signal Processors	MROM	.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e0	32
ADSP-21363YSWZ-2AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.05 V			16	32	1,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	.95 V	105 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	33.33 MHz		260	MULTIPLE	20 mm		CMOS		1 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-21375KSWZ-2B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V			24	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.14 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm	16384	28 mm		YES	32	16.67 MHz		260	MULTIPLE	28 mm		CMOS		1.2 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G208	3	Not Qualified		NO	YES	e3
ADSP-21565KSWZ8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	GULL WING	120	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		16	32		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP120,.63SQ,16	.95 V	110 Cel		0 Cel		DUAL	1.6 mm	163840	14 mm		YES	16		30	260	MULTIPLE	14 mm	6	CMOS		1 V				FLASH	.4 mm	FLOATING POINT	S-PQFP-G120	3			YES	YES
ADSP-2181KSZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	128	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16		14	16	5	FLATPACK	QFP128,1.2SQ,32	4.5 V	70 Cel	4	0 Cel	Matte Tin (Sn) - annealed	QUAD	4.07 mm	8192	28 mm		NO	24	20 MHz		260	MULTIPLE	28 mm	1	CMOS		5 V	2	2	Digital Signal Processors		.8 mm	FIXED POINT	S-PQFP-G128	3	Not Qualified		YES	YES	e3
ADSP-2186MBSTZ-266	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.75 V			14			FLATPACK, LOW PROFILE, FINE PITCH		2.25 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm		14 mm		NO	24	33 MHz	30	260	MULTIPLE	14 mm		CMOS		2.5 V					.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-2187LBSTZ-210	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16		14			FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	3 V	85 Cel	6	-40 Cel	MATTE TIN	QUAD	1.6 mm	16384	14 mm		NO	24		30	260	MULTIPLE	14 mm		CMOS		3.3 V				FLASH	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3	24
ADSP-2187NBSTZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V			14	16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm	32768	14 mm		NO	24	40 MHz	30	260	MULTIPLE	14 mm		CMOS		1.8 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-2189NBST-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V			14	16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	TIN LEAD	QUAD	1.6 mm	49152	14 mm		NO	24	40 MHz			MULTIPLE	14 mm		CMOS		1.8 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e0
ADSP-2191MBCAZ-140	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V			22	16	2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	2.37 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	32768	10 mm		YES	16	100 MHz		260	MULTIPLE	10 mm		CMOS		2.5 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B144	3	Not Qualified		YES	YES	e1
ADSP-BF506BSWZ-3F	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	120	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V			0	32	1.3,1.8/3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP120,.63SQ,16	2.7 V	85 Cel		-40 Cel		QUAD	1.6 mm		14 mm		NO	0	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	14 mm		CMOS		3 V			Microprocessors		.4 mm	FIXED POINT	S-PQFP-G120		Not Qualified	300 rpm	YES	YES
ADSP-BF512BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V			19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm		YES	16	300 MHz	30	260	MULTIPLE	12 mm		CMOS		1.225 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF512BSWZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.47 V			19	32	1.3,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.164 V	85 Cel		-40 Cel		QUAD	1.6 mm		24 mm		YES	16	300 MHz	30	260	MULTIPLE	24 mm		CMOS		1.225 V			Microprocessors		.5 mm	FIXED POINT	S-PQFP-G176	3	Not Qualified	300 rpm	YES	YES
ADSP-BF518BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V			19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm		YES	16	400 MHz			MULTIPLE	12 mm		CMOS		1.4 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF525BBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz		260	MULTIPLE	17 mm		CMOS		1.8 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF531SBBCZ400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz		260	MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF533SBBCZ400	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz	30	260	MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF536BBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	400 MHz		260	MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-BF536BBCZ3BRL	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V			19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	300 MHz	30	260	MULTIPLE	17 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-BF537KBCZ-6BV	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	208	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			19	32	1.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA208,20X20,32	.8 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	600 MHz		260	MULTIPLE	17 mm		CMOS		1.3 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF547KBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V			22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.3 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm		YES	16	50 MHz			MULTIPLE	17 mm		CMOS					Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF561SBB600	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	297	BGA	SQUARE	PLASTIC/EPOXY		YES	1.4185 V			23	32	1.2,2.5/3.3	GRID ARRAY	BGA297,26X26,40	.8 V	85 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.43 mm		27 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	600 MHz		225	MULTIPLE	27 mm		CMOS		1.35 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B297	3	Not Qualified	600 rpm	YES	YES	e0
ADSP-BF561SBBZ500	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	297	BGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V			23	32	1.2,2.5/3.3	GRID ARRAY	BGA297,26X26,40	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.43 mm		27 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	500 MHz		260	MULTIPLE	27 mm		CMOS		1.25 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B297	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-BF561SKBCZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V			23	32	1.2,2.5/3.3	GRID ARRAY	BGA256,16X16,25	.8 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.9 mm		17 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	500 MHz		260	MULTIPLE	17 mm		CMOS		1.25 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-TS101SAB2Z100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			32	32		GRID ARRAY, FINE PITCH		1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.5 mm		19 mm		YES	64			260	SINGLE	19 mm		CMOS		1.2 V					.8 mm	FLOATING POINT	S-PBGA-B484	3			YES	YES	e1
DSP56001AFC27	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	132	BQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	24		16	24		FLATPACK, BUMPER	SQFP132,1.1SQ	4.5 V	105 Cel	2	-40 Cel		QUAD	4.572 mm	512	24.13 mm		NO	24	27 MHz			MULTIPLE	24.13 mm		CMOS		5 V		1		MROM	.635 mm	FLOATING POINT	S-PQFP-G132				YES	NO		24
DSP56001FC27	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		GULL WING	132	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V			16			FLATPACK, LOW PROFILE, FINE PITCH		4.5 V				Tin/Lead (Sn/Pb)	QUAD	1.6 mm		20 mm		NO	24	27 MHz			MULTIPLE	20 mm		HCMOS		5 V					.5 mm	FIXED POINT	S-PQFP-G132		Not Qualified		YES	NO	e0
DSP56303AG100	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V			18			FLATPACK, LOW PROFILE, FINE PITCH		3 V				TIN	QUAD	1.6 mm		20 mm		YES	24	100 MHz	40	260	MULTIPLE	20 mm		CMOS		3.3 V					.5 mm	FIXED POINT	S-PQFP-G144	3	Not Qualified		YES	YES	e3
DSP56F826BU80E	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.75 V			16			FLATPACK, LOW PROFILE, FINE PITCH		2.25 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm		14 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	80 MHz	40	260	MULTIPLE	14 mm		CMOS		2.5 V					.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
DSPB56362AG120	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	3.46 V			18			FLATPACK, LOW PROFILE, FINE PITCH		3.14 V				TIN	QUAD	1.6 mm		20 mm		YES	24	120 MHz	40	260	MULTIPLE	20 mm		CMOS		3.3 V					.5 mm	FIXED POINT	S-PQFP-G144	3	Not Qualified		YES	YES	e3
DSPIC30F2020-30I/MM	Microchip Technology		INDUSTRIAL	NO LEAD	28	QCCN	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8	TS 16949	24	16	3.3/5	CHIP CARRIER	LCC28,.24SQ,25	3 V	85 Cel	3	-40 Cel	MATTE TIN	QUAD	1 mm	512	6 mm		NO	16				MULTIPLE	6 mm	5	CMOS	273 mA	3.3 V		2	Digital Signal Processors	FLASH	.65 mm	FIXED POINT	S-PQCC-N28		Not Qualified		YES	YES	e3	24
DSPIC30F3011T-30I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	44	TQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V			0	16	3/5	FLATPACK, THIN PROFILE	TQFP44,.39SQ,31	4.5 V	85 Cel		-40 Cel	Matte Tin (Sn)	QUAD	1.2 mm		10 mm	ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 10 MHZ		0	40 MHz	40	260		10 mm		CMOS		5 V			Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PQFP-G44	3	Not Qualified				e3	24
DSPIC30F3013-30I/ML	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	44	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	5.5 V			0	16	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.31SQ,25	4.5 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1 mm		8 mm	ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 10MHZ		0	40 MHz	40	260		8 mm		CMOS		5 V			Digital Signal Processors	FLASH	.65 mm	FIXED POINT	S-PQCC-N44	1	Not Qualified				e3	24
DSPIC30F3013T-30I/ML	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	44	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	5.5 V			0	16	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.31SQ,25	4.5 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1 mm		8 mm	ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 10MHZ		0	40 MHz	40	260		8 mm		CMOS		5 V			Digital Signal Processors	FLASH	.65 mm	FIXED POINT	S-PQCC-N44	1	Not Qualified				e3	24
DSPIC30F3014-20E/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	GULL WING	44	TQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V			0	16	3/5	FLATPACK, THIN PROFILE	TQFP44,.39SQ,31	4.5 V	125 Cel		-40 Cel	Matte Tin (Sn)	QUAD	1.2 mm		10 mm	ALSO OPERATES AT 3V MINIMUM SUPPLY AT 10 MHZ		0	40 MHz	40	260		10 mm		CMOS		5 V			Digital Signal Processors	FLASH	.8 mm	FIXED POINT	S-PQFP-G44	3	Not Qualified				e3	24
DSPIC30F5011T-20I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V			0	16	3/5	FLATPACK, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	4.75 V	85 Cel		-40 Cel	Matte Tin (Sn)	QUAD	1.2 mm		10 mm	ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 7.5 MHZ		0	40 MHz	40	260		10 mm		CMOS		5 V			Digital Signal Processors	FLASH	.5 mm	FIXED POINT	S-PQFP-G64	3	Not Qualified				e3	24
DSPIC30F5013-20I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	80	TQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V			0	16	3/5	FLATPACK, THIN PROFILE	TQFP80,.55SQ	4.75 V	85 Cel		-40 Cel	Matte Tin (Sn)	QUAD	1.2 mm		12 mm	ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 7.5 MHZ		0	40 MHz	40	260		12 mm		CMOS		5 V			Digital Signal Processors	FLASH	.5 mm	FIXED POINT	S-PQFP-G80	3	Not Qualified				e3	24
DSPIC30F6013A-20E/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	GULL WING	80	TQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V			0	16	3/5	FLATPACK, THIN PROFILE	TQFP80,.55SQ	4.5 V	125 Cel		-40 Cel	MATTE TIN	QUAD	1.2 mm		12 mm	ALSO OPERATES AT 3V MINIMUM SUPPLY AT 15 MHZ		0	40 MHz	40	260		12 mm		CMOS	180 mA	5 V			Digital Signal Processors	FLASH	.5 mm	FIXED POINT	S-PQFP-G80	3	Not Qualified				e3	24
DSPIC33CH128MP206T-I/MR	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0	16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	85 Cel	4	-40 Cel		QUAD	1 mm	16384	9 mm	4K BYTES INTERNAL DATA RAM IN SLAVE CORE AVAILABLE	YES	0	64 MHz			MULTIPLE	9 mm	4	CMOS	63.6 mA	3.3 V	8	2		FLASH	.5 mm	FIXED POINT	S-PQCC-N64				YES	YES		24
DSPIC33CH128MP505T-I/M4	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0	16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	3 V	85 Cel	4	-40 Cel		QUAD	.6 mm	16384	6 mm	4K BYTES INTERNAL DATA RAM IN SLAVE CORE AVAILABLE	YES	0	64 MHz			MULTIPLE	6 mm	4	CMOS	63.6 mA	3.3 V	8	2		FLASH	.4 mm	FIXED POINT	S-PQCC-N48				YES	YES		24
DSPIC33CH128MP505T-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0	16		FLATPACK, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	3 V	85 Cel	4	-40 Cel		QUAD	1.2 mm	16384	7 mm	4K BYTES INTERNAL DATA RAM IN SLAVE CORE AVAILABLE	YES	0	64 MHz			MULTIPLE	7 mm	4	CMOS	63.6 mA	3.3 V	8	2		FLASH	.5 mm	FIXED POINT	S-PQFP-G48				YES	YES		24
DSPIC33CH256MP506-I/MR	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0	16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	85 Cel	3	-40 Cel		QUAD	1 mm	32768	9 mm		YES	0	64 MHz			MULTIPLE	9 mm	5	CMOS	98 mA	3.3 V	8	2		FLASH	.5 mm	FIXED POINT	S-PQCC-N64				YES	YES		24

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.