Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Internal Bus Architecture | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Barrel Shifter | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
MILITARY |
PIN/PEG |
305 |
HIPGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
3.465 V |
8 |
MIL-PRF-38535 |
32 |
32 |
3.3 |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
HSPGA305,35X35MOD |
3.135 V |
125 Cel |
4 |
-55 Cel |
TIN LEAD |
PERPENDICULAR |
5.59 mm |
2.4G |
51200 |
47.245 mm |
YES |
64 |
50 MHz |
MULTIPLE |
47.245 mm |
3 |
CMOS |
2500 mA |
3.3 V |
1 |
Digital Signal Processors |
2.54 mm |
FLOATING POINT |
S-CPGA-P305 |
Not Qualified |
NO |
YES |
e0 |
||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.24 V |
23 |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.16 V |
BOTTOM |
3.3 mm |
262144 |
23 mm |
YES |
64 |
100 MHz |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
AUTOMOTIVE |
BALL |
376 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
24 |
32 |
1.2,1.8,3.3 |
GRID ARRAY |
BGA376,22X22,40 |
1.14 V |
125 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
2.48 mm |
20480 |
23 mm |
YES |
16 |
30 MHz |
20 |
220 |
SINGLE |
23 mm |
5 |
CMOS |
1.2 V |
72 |
Digital Signal Processors |
MROM |
1 mm |
FIXED POINT |
S-PBGA-B376 |
3 |
YES |
NO |
e0 |
||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
352 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.99 V |
22 |
32 |
1.9,3.3 |
GRID ARRAY |
BGA352,26X26,50 |
1.81 V |
90 Cel |
0 Cel |
BOTTOM |
3.5 mm |
65536 |
35 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
167 MHz |
MULTIPLE |
35 mm |
CMOS |
1.9 V |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B352 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, MIXED |
MILITARY |
J BEND |
44 |
QCCJ |
SQUARE |
CERAMIC |
YES |
38535Q/M;38534H;883B |
16 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
125 Cel |
-55 Cel |
QUAD |
144 |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
60 mA |
5 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
S-XQCC-J44 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
352 |
HLBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
32 |
GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE |
3.135 V |
85 Cel |
0 Cel |
BOTTOM |
1.7 mm |
35 mm |
YES |
64 |
100 MHz |
MULTIPLE |
35 mm |
CMOS |
3.3 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B352 |
Not Qualified |
NO |
YES |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
AUTOMOTIVE |
GULL WING |
32 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
3.3 |
FLATPACK |
QFP32,.35SQ,32 |
125 Cel |
-40 Cel |
QUAD |
544 |
CMOS |
96 mA |
3.3 V |
Digital Signal Processors |
.8 mm |
FLOATING POINT |
S-PQFP-G32 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
16 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
3 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
2592 |
20 mm |
YES |
16 |
20 MHz |
MULTIPLE |
20 mm |
CMOS |
100 mA |
3.3 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G144 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||||||||||||
Texas Instruments |
GULL WING |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
1.2,3.3 |
FLATPACK |
QFP144,.87SQ,20 |
QUAD |
131072 |
CMOS |
Digital Signal Processors |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
BALL |
452 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8,3.3 |
GRID ARRAY |
BGA452,26X26,50 |
BOTTOM |
16384 |
CMOS |
Digital Signal Processors |
1.27 mm |
FLOATING POINT |
S-PBGA-B452 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
MILITARY |
FLAT |
408 |
GQFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
31 |
FLATPACK, GUARD RING |
4.5 V |
125 Cel |
-55 Cel |
QUAD |
4.45 mm |
67.31 mm |
YES |
32 |
33 MHz |
67.31 mm |
CMOS |
5 V |
.65 mm |
FLOATING POINT |
S-CQFP-F408 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
288 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
22 |
GRID ARRAY |
1.14 V |
BOTTOM |
2.8 mm |
23 mm |
YES |
32 |
100 MHz |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
1 mm |
FIXED POINT |
S-PBGA-B288 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
304 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
24 |
FLATPACK |
4.75 V |
85 Cel |
0 Cel |
QUAD |
YES |
32 |
MULTIPLE |
CMOS |
5 V |
FIXED POINT |
S-PQFP-G304 |
Not Qualified |
NO |
YES |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, MIXED |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
CHIP CARRIER |
LDCC68,1.0SQ |
70 Cel |
0 Cel |
QUAD |
256 |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
90 mA |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OTHER |
NO LEAD |
44 |
QCCN |
SQUARE |
CERAMIC |
YES |
38535Q/M;38534H;883B |
16 |
5 |
CHIP CARRIER |
LCC44,.65SQ |
100 Cel |
-55 Cel |
QUAD |
144 |
MOS |
275 mA |
5 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
S-XQCC-N44 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, MIXED |
COMMERCIAL |
BALL |
515 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
26 |
1.1,1.8,3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA515,28X28,16 |
1.71 V |
70 Cel |
0 Cel |
BOTTOM |
1 mm |
14 mm |
YES |
16 |
38.4 MHz |
MULTIPLE |
14 mm |
CMOS |
1.8 V |
Graphics Processors |
.5 mm |
FLOATING POINT |
S-PBGA-B515 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
529 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
32 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA529,23X23,32 |
1.14 V |
BOTTOM |
3.1 mm |
8192 |
19 mm |
YES |
32 |
66 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
19 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B529 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
625 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1,1.5,1.8 |
GRID ARRAY, FINE PITCH |
BGA625,25X25,32 |
BOTTOM |
8192 |
CMOS |
Digital Signal Processors |
.8 mm |
FLOATING POINT |
S-PBGA-B625 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
21 |
16 |
1.05/1.3,1.8/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,25 |
.998 V |
70 Cel |
-10 Cel |
TIN SILVER COPPER |
BOTTOM |
1.3 mm |
163840 |
10 mm |
YES |
16 |
12 MHz |
SINGLE |
10 mm |
CMOS |
1.05 V |
Digital Signal Processors |
.65 mm |
FIXED POINT |
S-PBGA-B196 |
3 |
Not Qualified |
YES |
NO |
e1 |
||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
697 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
16 |
32 |
1.2,1.5/1.8,1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA697,29X29,32 |
1.71 V |
BOTTOM |
3.3 mm |
32768 |
24 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
64 |
66 MHz |
MULTIPLE |
24 mm |
CMOS |
1.8 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B697 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
CHIP CARRIER |
2.6 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
8.9662 mm |
NO |
0 |
NOT SPECIFIED |
NOT SPECIFIED |
SINGLE |
8.9662 mm |
CMOS |
3 V |
1.27 mm |
FIXED POINT |
S-PQCC-J20 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
532 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.44 V |
23 |
32 |
1.4,3.3 |
GRID ARRAY, FINE PITCH |
BGA532,26X26,32 |
1.36 V |
BOTTOM |
3.3 mm |
16384 |
23 mm |
YES |
64 |
75.18 MHz |
MULTIPLE |
23 mm |
CMOS |
1.4 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B532 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
22 |
GRID ARRAY |
1.71 V |
BOTTOM |
2.32 mm |
27 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
32 |
MULTIPLE |
27 mm |
CMOS |
1.8 V |
1.27 mm |
FIXED POINT |
S-PBGA-B256 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
20 |
GRID ARRAY |
1.71 V |
BOTTOM |
2.32 mm |
27 mm |
YES |
32 |
150 MHz |
MULTIPLE |
27 mm |
CMOS |
1.8 V |
1.27 mm |
FIXED POINT |
S-PBGA-B256 |
NO |
NO |
|||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
AUTOMOTIVE |
BALL |
376 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
32 |
32 |
1.8,3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA376,22X22,40 |
1.71 V |
125 Cel |
-40 Cel |
BOTTOM |
2.48 mm |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
27 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
23 mm |
CMOS |
1.8 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B376 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
70 Cel |
0 Cel |
QUAD |
544 |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
185 mA |
5 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
384 |
HFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
22 |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
1.71 V |
BOTTOM |
2.8 mm |
18 mm |
YES |
32 |
MULTIPLE |
18 mm |
CMOS |
1.8 V |
.8 mm |
FIXED POINT |
S-PBGA-B384 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
AUTOMOTIVE |
BALL |
100 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
0 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.71 V |
125 Cel |
-40 Cel |
BOTTOM |
1.4 mm |
10 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
0 |
20 MHz |
MULTIPLE |
10 mm |
CMOS |
1.8 V |
.8 mm |
FIXED POINT |
S-PBGA-B100 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
384 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.57 V |
22 |
GRID ARRAY, FINE PITCH |
1.43 V |
BOTTOM |
2.35 mm |
18 mm |
ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
32 |
300 MHz |
MULTIPLE |
18 mm |
CMOS |
1.5 V |
.8 mm |
FIXED POINT |
S-PBGA-B384 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OTHER |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC |
NO |
38535Q/M;38534H;883B |
16 |
GRID ARRAY |
PGA68,11X11 |
100 Cel |
-55 Cel |
PERPENDICULAR |
544 |
MOS |
400 mA |
Digital Signal Processors |
2.54 mm |
FIXED POINT |
S-XPGA-P68 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
85 Cel |
-40 Cel |
QUAD |
544 |
CMOS |
70 mA |
3.3 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G100 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
697 |
HFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.2875 V |
20 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
BGA697,29X29,32 |
1.2125 V |
90 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
3.1 mm |
32768 |
24 mm |
IT ALSO REQUIRES 3.3V I/O SUPPLY |
YES |
64 |
66.6 MHz |
20 |
220 |
MULTIPLE |
24 mm |
4 |
CMOS |
1.25 V |
64 |
Digital Signal Processors |
MROM |
.8 mm |
FIXED POINT |
S-PBGA-B697 |
4 |
Not Qualified |
YES |
NO |
e0 |
8 |
|||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
MILITARY |
NO LEAD |
203 |
DIE |
SQUARE |
UNSPECIFIED |
NO |
YES |
5.5 V |
32 |
38535Q/M;38534H;883B |
24 |
32 |
5 |
UNCASED CHIP |
TAB,244PIN |
4.5 V |
125 Cel |
4 |
-55 Cel |
UPPER |
1024 |
NO |
32 |
33.33 MHz |
MULTIPLE |
2 |
CMOS |
600 mA |
5 V |
1 |
2 |
Digital Signal Processors |
MROM |
FIXED POINT |
S-XUUC-N203 |
Not Qualified |
YES |
YES |
32 |
||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
BALL |
288 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
23 |
32 |
1.2,3.3 |
GRID ARRAY |
BGA288,22X22,20 |
1.14 V |
90 Cel |
0 Cel |
BOTTOM |
2.8 mm |
262144 |
23 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
100 MHz |
MULTIPLE |
23 mm |
CMOS |
1.2 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B288 |
Not Qualified |
YES |
NO |
|||||||||||||||||||||||||||||||||
Texas Instruments |
AUTOMOTIVE |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
125 Cel |
-40 Cel |
QUAD |
544 |
CMOS |
70 mA |
3.3 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G100 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
132 |
BQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
16 |
16 |
5 |
FLATPACK, BUMPER |
SQFP132,1.2SQ |
4.75 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
4.57 mm |
1056 |
24.13 mm |
YES |
16 |
66 MHz |
30 |
260 |
MULTIPLE |
24.13 mm |
CMOS |
225 mA |
5 V |
Digital Signal Processors |
.635 mm |
FIXED POINT |
S-PQFP-G132 |
4 |
Not Qualified |
YES |
NO |
e4 |
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Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
BALL |
352 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
22 |
32 |
1.2,3.3 |
GRID ARRAY |
BGA352,26X26,40 |
1.14 V |
BOTTOM |
524288 |
YES |
32 |
300 MHz |
MULTIPLE |
CMOS |
1.2 V |
Digital Signal Processors |
1 mm |
FIXED POINT |
S-PBGA-B352 |
Not Qualified |
YES |
NO |
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Texas Instruments |
COMMERCIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
16 |
3.3,5 |
FLATPACK |
QFP100,.63SQ,20 |
70 Cel |
0 Cel |
QUAD |
4640 |
CMOS |
Digital Signal Processors |
.5 mm |
FIXED POINT |
S-PQFP-G100 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
23 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
100 Cel |
-55 Cel |
QUAD |
1.6 mm |
20 mm |
YES |
16 |
66 MHz |
MULTIPLE |
20 mm |
CMOS |
3.3 V |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
MILITARY |
FLAT |
352 |
QFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
MIL-PRF-38535 Class Q |
31 |
FLATPACK |
4.5 V |
125 Cel |
-55 Cel |
GOLD |
QUAD |
YES |
32 |
33.33 MHz |
MULTIPLE |
CMOS |
5 V |
FLOATING POINT |
S-CQFP-F352 |
Not Qualified |
NO |
YES |
e4 |
||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
16 |
16 |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
4.75 V |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
4.5 mm |
544 |
24.23 mm |
NO |
16 |
51.2 MHz |
30 |
260 |
MULTIPLE |
24.23 mm |
CMOS |
185 mA |
5 V |
Digital Signal Processors |
1.27 mm |
FIXED POINT |
S-PQCC-J68 |
3 |
Not Qualified |
NO |
YES |
e4 |
|||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
BALL |
118 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.43 V |
0 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.24 V |
85 Cel |
-40 Cel |
BOTTOM |
1 mm |
7 mm |
YES |
0 |
MULTIPLE |
7 mm |
CMOS |
1.3 V |
.5 mm |
FIXED POINT |
S-PBGA-B118 |
YES |
NO |
|||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
16 |
12 |
CHIP CARRIER |
4.5 V |
85 Cel |
1 |
-40 Cel |
QUAD |
4.57 mm |
256 |
16.585 mm |
COPROCESSOR INTERFACE; ROM PROTECT |
NO |
16 |
35.1 MHz |
MULTIPLE |
16.585 mm |
0 |
CMOS |
75 mA |
5 V |
0 |
2 |
OTPROM |
1.27 mm |
FIXED POINT |
S-PQCC-J44 |
Not Qualified |
YES |
YES |
16 |
||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
GULL WING |
132 |
BQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
24 |
FLATPACK, BUMPER |
4.75 V |
QUAD |
4.57 mm |
24.13 mm |
NO |
32 |
MULTIPLE |
24.13 mm |
CMOS |
5 V |
.635 mm |
FLOATING POINT |
S-PQFP-G132 |
Not Qualified |
NO |
YES |
|||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
MILITARY |
FLAT |
132 |
GQFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
YES |
5.5 V |
32 |
24 |
32 |
5 |
FLATPACK, GUARD RING |
TPAK132,2.0SQ,25 |
4.5 V |
125 Cel |
4 |
-55 Cel |
QUAD |
2.92 mm |
1024 |
24.19 mm |
NO |
32 |
33.33 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
MULTIPLE |
24.19 mm |
2 |
CMOS |
325 mA |
5 V |
1 |
1 |
Digital Signal Processors |
.635 mm |
FIXED POINT |
S-CQFP-F132 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
OTHER |
GULL WING |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.25 V |
32 |
24 |
FLATPACK |
4.75 V |
85 Cel |
4 |
0 Cel |
QUAD |
4.1 mm |
512 |
28 mm |
NO |
32 |
40 MHz |
SINGLE |
28 mm |
2 |
CMOS |
5 V |
2 |
1 |
.65 mm |
FLOATING POINT |
S-PQFP-G144 |
Not Qualified |
YES |
NO |
||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 V |
16 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.7 V |
100 Cel |
-40 Cel |
QUAD |
1.6 mm |
14 mm |
YES |
16 |
MULTIPLE |
14 mm |
CMOS |
3 V |
.5 mm |
FIXED POINT |
S-PQFP-G100 |
Not Qualified |
YES |
YES |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
DIGITAL SIGNAL PROCESSOR, OTHER |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
16 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
3 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
544 |
14 mm |
YES |
16 |
20 MHz |
MULTIPLE |
14 mm |
CMOS |
70 mA |
3.3 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G100 |
Not Qualified |
YES |
YES |
Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.
DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.
DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.