COMMERCIAL Digital Signal Processors (DSPs) 1,242

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
TMS320C25FNL	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	16	16	16	5	CHIP CARRIER	LDCC68,1.0SQ	4.75 V	70 Cel	3	0 Cel	NICKEL PALLADIUM GOLD	QUAD	4.57 mm	544	24.23 mm	PID CONTROL; 256 WORDS DATA/PROG RAM	NO	16	40.96 MHz	30	260	MULTIPLE	24.23 mm	1	CMOS	185 mA	5 V	0	1	Digital Signal Processors	MROM	1.27 mm	FIXED POINT	S-PQCC-J68	3	Not Qualified		YES	NO	e4	16
TMS320DM8168CCYG2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS		1 V	72		Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified		YES	NO	e1
TMS320C5535AZAY10	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.43 V	16	0	16		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,14X14,32	1.24 V	70 Cel	2	-10 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	163840	12 mm	IT ALSO OPERATES AT 1.05 V AT 50 MHZ	YES	0	12 MHz	30	260	MULTIPLE	12 mm	4	CMOS		1.3 V	16			MROM	.8 mm	FIXED POINT	S-PBGA-B144	3			YES	NO	e1	8
DSPB56725AF	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		0			FLATPACK, LOW PROFILE		1.14 V	70 Cel		0 Cel	TIN	QUAD	1.6 mm		14 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	0	200 MHz	40	260	MULTIPLE	14 mm		CMOS		1.2 V					.65 mm	FIXED POINT	S-PQFP-G80	3	Not Qualified		NO	NO	e3
ADSP-21469KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V		24	32	1.1,1.8,3.3	GRID ARRAY	BGA324,18X18,40	1.05 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.8 mm	163840	19 mm		YES	8	75.41 MHz	30	260	MULTIPLE	19 mm		CMOS	10 mA	1.1 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B324	3	Not Qualified		NO	YES	e1
TMS320DM8168CCYG4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS		1 V	72		Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified		YES	NO	e1
ADSP-BF533SKBCZ-6V	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz	30	260	MULTIPLE	12 mm		CMOS		1.3 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-21479KBCZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	24	40	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	5242880	12 mm		YES	16	16.67 MHz	30	260	MULTIPLE	12 mm	1	CMOS		1.2 V	65	1	Digital Signal Processors	FLASH	.8 mm	FLOATING POINT	S-PBGA-B196	3	Not Qualified		YES	YES	e1	8
TAS3108DCPR	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	3.6 V		0			SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH		3 V	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm	3072	4.4 mm		NO	0	20 MHz	30	260	MULTIPLE	9.7 mm	0	CMOS		3.3 V	0				.5 mm	FIXED POINT	R-PDSO-G38	3	Not Qualified		YES	NO	e4
TAS3108DCPRG4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V		0			SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH		3 V	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm		4.4 mm		NO	0	20 MHz	30	260	MULTIPLE	9.7 mm		CMOS		3.3 V					.5 mm	FIXED POINT	R-PDSO-G38	3	Not Qualified		YES	NO	e4
ADSP-21363KSWZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz		260	MULTIPLE	20 mm		CMOS		1.2 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-21469KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES	1.1 V		24	32	1.05,1.8,3.3	GRID ARRAY	BGA324,18X18,40	1 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.8 mm	163840	19 mm		YES	8	66.66 MHz	30	260	MULTIPLE	19 mm		CMOS	10 mA	1.05 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B324	3	Not Qualified		NO	YES	e1
TMS320LBC57PBK57	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY		YES	3.47 V		16	16	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.64SQ,16	3.13 V	70 Cel		0 Cel		QUAD	1.6 mm	512	14 mm	6K WORDS DATA/PROG RAM	YES	16	57.14 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	14 mm		CMOS		3.3 V			Digital Signal Processors		.4 mm	FIXED POINT	S-PQFP-G128		Not Qualified		YES	YES
TMS320C5517AZCH20	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.15 V	16	21			GRID ARRAY, LOW PROFILE, FINE PITCH		.998 V	70 Cel	2	-10 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	163840	10 mm		YES	16		30	260	MULTIPLE	10 mm	3	CMOS		1.05 V	16			MROM	.65 mm	FIXED POINT	S-PBGA-B196	3			YES	NO	e1	16
ADSP-21371KSWZ-2B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.14 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm	32768	28 mm		YES	32	16.67 MHz		260	MULTIPLE	28 mm		CMOS		1.2 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G208	3	Not Qualified		NO	YES	e3
ADSP-2191MKSTZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.63 V		22	16	2.5,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	2.37 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm	32768	20 mm		YES	16	100 MHz		260	MULTIPLE	20 mm		CMOS		2.5 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G144	3	Not Qualified		YES	YES	e3
ADSP-BF703KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm		CMOS		1.8 V					.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
ADSP-2185MKSTZ-300	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.63 V		14			FLATPACK, LOW PROFILE, FINE PITCH		2.37 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm		14 mm		NO	24	37.5 MHz	30	260	MULTIPLE	14 mm		CMOS		2.5 V					.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-21262SKBCZ200	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.26 V	32	16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	65536	12 mm		YES	16	200 MHz		260	MULTIPLE	12 mm	3	CMOS		1.2 V	22		Digital Signal Processors	MROM	.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e1	32
ADSP21262SKBCZ200R	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	65536	12 mm		YES	16	66.67 MHz		260	MULTIPLE	12 mm		CMOS		1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e1
ADSP-BF706KCPZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V		0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	70 Cel		0 Cel	MATTE TIN	QUAD	.9 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	400 MHz		260	MULTIPLE	12 mm		CMOS		1.8 V					.5 mm	FIXED POINT	S-XQCC-N88	3			YES	YES	e3
ADSP-21262SKSTZ200	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.14 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm	65536	20 mm		YES	16	66.67 MHz	40	260	MULTIPLE	20 mm		CMOS		1.2 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144	3	Not Qualified		NO	YES	e3
ADSP-21479KSWZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	24	40	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.14 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	5242880	14 mm		YES	16	16.67 MHz	30	260	MULTIPLE	14 mm	1	CMOS		1.2 V	65	1	Digital Signal Processors	FLASH	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3	8
ADSP-BF561SKBZ500	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	297	BGA	SQUARE	PLASTIC/EPOXY		YES	1.375 V		23	32	1.2,2.5/3.3	GRID ARRAY	BGA297,26X26,40	.8 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.43 mm		27 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	500 MHz		260	MULTIPLE	27 mm		CMOS		1.25 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B297	3	Not Qualified	500 rpm	YES	YES	e1
ADSP-BF592KCPZ-2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V			32	1.3,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.7 V	70 Cel		0 Cel		QUAD	1 mm		9 mm	ALSO OPERATES AT 2.5 AND 3.3 V TYP	YES		50 MHz	30	260	MULTIPLE	9 mm		CMOS		1.8 V			Microprocessors		.5 mm	FIXED POINT	S-XQCC-N64	3	Not Qualified	200 rpm	YES	YES
DSPB56724AG	NXP Semiconductors	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.26 V		24			FLATPACK, LOW PROFILE, FINE PITCH		1.14 V	70 Cel		0 Cel	TIN	QUAD	1.6 mm		20 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	24	200 MHz	40	260	MULTIPLE	20 mm		CMOS		1.2 V					.5 mm	FIXED POINT	S-PQFP-G144	3	Not Qualified		NO	NO	e3
TMS320C30GELSD	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	PIN/PEG	181	PGA	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED		NO	5.25 V		24			GRID ARRAY		4.75 V	70 Cel		0 Cel		PERPENDICULAR					NO	32		NOT SPECIFIED	NOT SPECIFIED	MULTIPLE			CMOS		5 V						FLOATING POINT	X-CPGA-P181				NO	YES
ADSP-2191MKST-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.63 V		22	16	2.5,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	2.37 V	70 Cel		0 Cel	TIN LEAD	QUAD	1.6 mm	32768	20 mm		YES	16	100 MHz			MULTIPLE	20 mm		CMOS		2.5 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G144	3	Not Qualified		YES	YES	e0
TMS320C6747DZKB3	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		15	32	1.2,1.8,3.3	GRID ARRAY	BGA256,16X16,40	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm	8192	17 mm		YES	16	30 MHz	30	260	SINGLE	17 mm	4	CMOS		1.2 V	40		Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		YES	NO	e1
ADSP-21479KBCZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	24	40	1.1,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	5242880	12 mm		YES	16	16.67 MHz			MULTIPLE	12 mm	1	CMOS		1.2 V	65	1	Digital Signal Processors	FLASH	.8 mm	FLOATING POINT	S-PBGA-B196	3	Not Qualified		YES	YES	e1	8
ADSP-2186MKSTZ300R	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.63 V		14			FLATPACK, LOW PROFILE, FINE PITCH		2.37 V	70 Cel		0 Cel		QUAD	1.6 mm		14 mm		NO	24		30	260	MULTIPLE	14 mm		CMOS		2.5 V					.5 mm	FIXED POINT	S-PQFP-G100	3			YES	YES
ADSP-21369KSWZ-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.35 V		24	32	1.3,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.25 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm	65536	28 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	61.01 MHz	30	260	MULTIPLE	28 mm		CMOS		1.3 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G208	3	Not Qualified		NO	YES	e3
ADSP-2185MKST-300R	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.63 V		14			FLATPACK, LOW PROFILE, FINE PITCH		2.37 V	70 Cel		0 Cel		QUAD	1.6 mm		14 mm		NO	24	37.5 MHz			MULTIPLE	14 mm		CMOS		2.5 V					.5 mm	FIXED POINT	S-PQFP-G100	1	Not Qualified		YES	YES
ADSP-2186NKSTZ-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V		14	16	1.8,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	70 Cel		0 Cel	MATTE TIN	QUAD	1.6 mm	8192	14 mm		NO	24	40 MHz	30	260	MULTIPLE	14 mm		CMOS		1.8 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-BF561SKB600	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	297	BGA	SQUARE	PLASTIC/EPOXY		YES	1.4185 V		23	32	1.2,2.5/3.3	GRID ARRAY	BGA297,26X26,40	.8 V	70 Cel		0 Cel	TIN LEAD SILVER	BOTTOM	2.43 mm		27 mm	ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY	YES	32	600 MHz		225	MULTIPLE	27 mm		CMOS		1.35 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B297	3	Not Qualified	600 rpm	YES	YES	e0
ADSP-BF703KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		0			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES	0	300 MHz		260	MULTIPLE	12 mm		CMOS		1.8 V					.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
TMS320DM8168CCYG	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS		1 V	72		Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified		YES	NO	e1
ADSP-BF527KBCZ-6A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm		CMOS		1.8 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-21479KCPZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	YES	1.26 V	8	24	40	1.2,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.47SQ,20	1.14 V	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	.9 mm	5242880	12 mm		YES	16	16.67 MHz			MULTIPLE	12 mm	1	CMOS		1.2 V	65	1	Digital Signal Processors	FLASH	.5 mm	FLOATING POINT	S-XQCC-N88	3	Not Qualified		YES	YES	e3	8
ADSP-2186LKST-115	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16	14			FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	3 V	70 Cel	6	0 Cel	TIN LEAD OVER SILVER	QUAD	1.6 mm	4096	14 mm		NO	24				MULTIPLE	14 mm		CMOS		3.3 V				FLASH	.5 mm	FLOATING POINT	S-PQFP-G100		Not Qualified		YES	YES	e0	24
ADSP-BF527KBCZ-6	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.7 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		12 mm		YES	16	50 MHz	30	260	MULTIPLE	12 mm		CMOS		1.8 V			Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	600 rpm	YES	YES	e1
ADSP-BF527KBCZ-6AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		0	32	1,1.8/3.3,3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1 V	70 Cel		0 Cel		BOTTOM	1.75 mm		17 mm		YES	0	133 MHz			MULTIPLE	17 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208		Not Qualified	600 rpm	NO	YES
ADSP-BF527KBCZ-6C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel		0 Cel		BOTTOM	1.4 mm		12 mm		YES			NOT SPECIFIED	NOT SPECIFIED	SINGLE	12 mm		CMOS		3.3 V			Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289		Not Qualified	600 rpm	YES	NO
ADSP-BF527KBCZ-6X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		0	32	1,1.8/3.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1 V	70 Cel		0 Cel		BOTTOM	1.4 mm		12 mm		YES	0	133 MHz			MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289		Not Qualified	600 rpm	NO	YES
ADSP-BF527KBCZ6C1X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V			32	2/3.3	GRID ARRAY	BGA289,23X23,20	1.8 V	70 Cel		0 Cel		BOTTOM				ALSO OPERATES AT 3.3 V TYP I/O SUPPLY	YES		12.288 MHz			SINGLE			CMOS		2.5 V			Microprocessors		.5 mm	FIXED POINT	S-PBGA-B289		Not Qualified	600 rpm	YES	NO
CS47048C-CQZ	Cirrus Logic	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	1.89 V	32		32		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	70 Cel		0 Cel		QUAD	1.6 mm	32768	14 mm		NO		24.576 MHz		260	MULTIPLE	14 mm	1	CMOS		1.8 V	8	1		FLASH	.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	NO
TMS320DM8167SCYG2	Texas Instruments	DIGITAL SIGNAL PROCESSOR, MIXED	COMMERCIAL	BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15	32	1	GRID ARRAY, HEAT SINK/SLUG	BGA1031,37X37,25	.95 V	95 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.31 mm	16384	25 mm		YES	32		NOT SPECIFIED	245	MULTIPLE	25 mm	8	CMOS		1 V	72		Digital Signal Processors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified		YES	NO	e1
ADSP-21363KBCZ-1AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz		260	MULTIPLE	12 mm		CMOS		1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	3	Not Qualified		NO	YES	e1

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.