INDUSTRIAL Digital Signal Processors (DSPs) 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width
ADSP-BF526BBCZ-4AX	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V		19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel		-40 Cel		BOTTOM	1.75 mm		17 mm	ALSO OPERATES AT 2.5 AND 3.3 V TYP	YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm		CMOS		1.8 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208		Not Qualified	400 rpm	YES	YES
ADSP-BF592BCPZ-2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V			32	1.3,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.7 V	85 Cel		-40 Cel		QUAD	1 mm		9 mm	ALSO OPERATES AT 2.5 AND 3.3 V TYP	YES		50 MHz	30	260	MULTIPLE	9 mm		CMOS		1.8 V			Microprocessors		.5 mm	FIXED POINT	S-XQCC-N64	3	Not Qualified	200 rpm	YES	YES
ADSP-BF539YBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.95 V	105 Cel		-40 Cel		BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm		CMOS		1 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B316		Not Qualified	400 rpm	YES	YES
ADSP-2101BS-100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16	14	16	5	FLATPACK	QFP80,.7SQ	4.5 V	85 Cel	1	-40 Cel	TIN LEAD	QUAD	2.45 mm	512	14 mm		NO	24	25 MHz			MULTIPLE	14 mm	1	CMOS	38 mA	5 V	0	2	Digital Signal Processors		.65 mm	FIXED POINT	S-PQFP-G80	3	Not Qualified		YES	YES	e0
ADSP-BF534BBC-5A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	85 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	500 MHz		240	MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182	3	Not Qualified	500 rpm	YES	YES	e0
ADSP-TS202SABP-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		32	32	1.05,1.5,2.5	GRID ARRAY	BGA576,24X24,40	.95 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	3.1 mm	393216	25 mm	ALSO REQUIRES 2.5V SUPPLY	YES	64	125 MHz			MULTIPLE	25 mm		CMOS		1 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B576		Not Qualified		NO	YES	e0
ADSP-21363SCSQZENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.05 V		16			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		.95 V	105 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm		20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	20 mm		CMOS		1 V					.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified		NO	YES	e3
ADSP-BF531WBBZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	169	BGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	32	1.2,2.5/3.3	GRID ARRAY	BGA169,17X17,40	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.5 mm		19 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz			MULTIPLE	19 mm		CMOS		1.2 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B169		Not Qualified	400 rpm	YES	YES	e1
ADSP-2181BST-133	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	16	14	16	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	4.5 V	85 Cel	4	-40 Cel	TIN LEAD	QUAD	1.6 mm	8192	14 mm	33 MIPS SUSTAINED; SINGLE CYCLE INSTRUCTION EXECUTION	NO	24	16.67 MHz			MULTIPLE	20 mm	1	CMOS	100 mA	5 V	2	2	Digital Signal Processors		.5 mm	FIXED POINT	R-PQFP-G128	3	Not Qualified		YES	YES	e0
ADSP2103BP52	Analog Devices		INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES				16	3.3	CHIP CARRIER	LDCC68,1.0SQ		85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	QUAD		1024											CMOS	24 mA	3.3 V			Digital Signal Processors		1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified				e0
ADSP-2115BP-40	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16	14	16	5	CHIP CARRIER	LDCC68,1.0SQ	4.5 V	85 Cel	3	-40 Cel	TIN LEAD	QUAD	4.45 mm	512	23.875 mm	COMPANDING HARDWARE WITH SERIAL PORTS; INTERNAL WIDTH PMA=14; DMA=14; PMD=24; DMD=16	NO	24	10.24 MHz			MULTIPLE	23.875 mm	1	CMOS	55 mA	5 V	0	2	Digital Signal Processors		1.27 mm	FIXED POINT	S-PQCC-J68		Not Qualified		YES	YES	e0
ADSP-TS201SABP-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	576	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V		32	32	1.05,1.5,2.5	GRID ARRAY	BGA576,24X24,40	.95 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	3.1 mm	786432	25 mm		YES	64				MULTIPLE	25 mm		CMOS		1 V			Digital Signal Processors		1 mm	FLOATING POINT	S-PBGA-B576		Not Qualified			YES	e0
ADSP-21060CWZ-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	240	HFQFP	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.25 V		32			FLATPACK, HEAT SINK/SLUG, FINE PITCH		4.75 V	100 Cel		-40 Cel	GOLD OVER NICKEL	QUAD	4.2 mm		32 mm		YES	48	40 MHz			MULTIPLE	32 mm		CMOS		5 V					.5 mm	FLOATING POINT	S-CQFP-G240		Not Qualified		YES	YES	e4
ADSP-BF512BBCZ-4F4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	85 Cel		-40 Cel		BOTTOM	1.7 mm		12 mm		YES	16	400 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS		1.4 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168		Not Qualified	400 rpm	YES	YES
ADSP-21020BG-100	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	PIN/PEG	223	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.5 V	0	24	32	5	GRID ARRAY	PGA223,18X18	4.5 V	85 Cel	4	-40 Cel	TIN LEAD	PERPENDICULAR		0		SINGLE CYCLE INSTR EXECUTION; 100 MFLOPS PEAK; 66 MFLOPS SUSTAINED; ADDRESSING OF PAGE MODE DRAM	YES	48	25 MHz			MULTIPLE		1	CMOS	420 mA	5 V	0	0	Digital Signal Processors		2.54 mm	FLOATING POINT	S-CPGA-P223		Not Qualified		YES	YES	e0
ADSP-2185BSTZ-115	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V		24			FLATPACK, LOW PROFILE, FINE PITCH		4.5 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm		14 mm		NO	16	16.67 MHz		260	MULTIPLE	14 mm		CMOS		5 V					.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e3
ADSP-BF549BBCZ-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V		26			GRID ARRAY, LOW PROFILE, FINE PITCH		.9 V	85 Cel		-40 Cel		BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	50 MHz			MULTIPLE	17 mm		CMOS		1.25 V					.8 mm	FIXED POINT	S-PBGA-B400		Not Qualified		YES	YES
ADSP-2186BST-115	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16	14	16	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	4.5 V	85 Cel	4	-40 Cel	TIN LEAD OVER SILVER	QUAD	1.6 mm	4096	14 mm		NO	24	14.4 MHz			MULTIPLE	14 mm	1	CMOS	100 mA	5 V	2	2	Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100		Not Qualified		YES	YES	e0
ADSP-2101BG-66	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	PIN/PEG	68	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.5 V	16	14	16	5	GRID ARRAY	PGA68,11X11	4.5 V	85 Cel	1	-40 Cel	TIN LEAD	PERPENDICULAR	4.17 mm	512	27.885 mm	20 MIPS; SINGLE CYCLE INSTRUCTION EXECUTION	NO	24	16.67 MHz			MULTIPLE	27.885 mm	1	CMOS	51 mA	5 V	0	2	Digital Signal Processors		2.54 mm	FIXED POINT	S-CPGA-P68		Not Qualified		YES	YES	e0
ADSP-SC572CBCZ-42	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		30	260	MULTIPLE	17 mm		CMOS		1.1 V					.8 mm	FIXED POINT	S-PBGA-B400	3			YES	YES	e1
ADSP-21366WSQZ-2AA	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.05 V		16	32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	.95 V	105 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm	98304	20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16				MULTIPLE	20 mm		CMOS		1 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-PQFP-G144		Not Qualified		NO	YES	e3
ADSP-BF547BBCZ-5X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.43 V		26	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.9 V	85 Cel		-40 Cel	MATTE TIN	BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	50 MHz			MULTIPLE	17 mm		CMOS		1.25 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	1	Not Qualified	600 rpm	YES	YES	e3
ADSP-2188NBST-320	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.89 V		14	16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	TIN LEAD	QUAD	1.6 mm	57344	14 mm		NO	24	40 MHz			MULTIPLE	14 mm		CMOS		1.8 V			Digital Signal Processors		.5 mm	FIXED POINT	S-PQFP-G100	3	Not Qualified		YES	YES	e0
ADSP-BF533SBBCZ-5V	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	160	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.45 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA160,14X14,32	.8 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3V OR 3.3V SUPPLY	YES	16	40 MHz	30	260	MULTIPLE	12 mm		CMOS		1.25 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B160	3	Not Qualified	533 rpm	YES	YES	e1
ADSP-BF534SBBC1500	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz			MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182		Not Qualified	500 rpm	YES	YES	e0
ADSP-2172BST-133	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	128	QFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	16	14			FLATPACK		4.5 V	85 Cel	1	-40 Cel	TIN LEAD	QUAD		1024		8/16 BIT PARALLEL HOST INTERFACE PORT	NO	24	16.67 MHz			MULTIPLE		1	CMOS	75 mA	5 V	0	2		MROM		FIXED POINT	R-PQFP-G128		Not Qualified		YES	YES	e0	24
ADSP-21364WBBCZ-1A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA136,14X14,32	1.14 V	85 Cel		-40 Cel	MATTE TIN	BOTTOM	1.7 mm	98304	12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V			Digital Signal Processors		.8 mm	FLOATING POINT	S-PBGA-B136	1	Not Qualified		NO	YES	e3
ADSP-21363SBBC-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	136	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 3.3V SUPPLY	YES	16	55.55 MHz			MULTIPLE	12 mm		CMOS		1.2 V					.8 mm	FLOATING POINT	S-PBGA-B136		Not Qualified		NO	YES	e0
ADSP-BF536SBBC1300	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	40 MHz			MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182		Not Qualified	300 rpm	YES	YES	e0
ADSP-BF539YBCZ-4F8	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA316,20X20,32	.95 V	105 Cel		-40 Cel		BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	17 mm		CMOS		1 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B316		Not Qualified	400 rpm	YES	YES
ADSP-2186LBST-160	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16	14			FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	3 V	85 Cel	6	-40 Cel	TIN LEAD OVER SILVER	QUAD	1.6 mm	4096	14 mm		NO	24				MULTIPLE	14 mm		CMOS		3.3 V				FLASH	.5 mm	FLOATING POINT	S-PQFP-G100		Not Qualified		YES	YES	e0	24
ADSP-SC570CSWZ-42	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	105 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm		CMOS		1.1 V					.5 mm	FIXED POINT	S-PQFP-G176	3			YES	YES	e3
ADSP-BF534YBCZ-4B	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		19	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA208,20X20,32	.8 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm	ALSO REQUIRES 2.5V OR 3V SUPPLY	YES	16	400 MHz			MULTIPLE	17 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-2181BS-115	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	128	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16	14	16	5	FLATPACK	QFP128,1.2SQ,32	4.5 V	85 Cel	4	-40 Cel	TIN LEAD	QUAD	4.07 mm	8192	28 mm	33 MIPS SUSTAINED; SINGLE CYCLE INSTRUCTION EXECUTION	NO	24	14.4 MHz			MULTIPLE	28 mm	1	CMOS	100 mA	5 V	2	2	Digital Signal Processors		.8 mm	FIXED POINT	S-PQFP-G128	3	Not Qualified		YES	YES	e0
ADSP-BF537SBBC1500	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	182	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.32 V		20	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA182,14X14,32	.8 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	1.7 mm		12 mm	ALSO REQUIRES 2.5V OR 3.3V SUPPLY	YES	16	40 MHz			MULTIPLE	12 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B182		Not Qualified	500 rpm	YES	YES	e0
ADSP-2171BST-133	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V	16	14	16	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.68X.85,20	4.5 V	85 Cel	1	-40 Cel	TIN LEAD	QUAD	1.6 mm	1024	14 mm	8/16 BIT PARALLEL HOST INTERFACE PORT	NO	24	16.67 MHz			MULTIPLE	20 mm	1	CMOS	75 mA	5 V	0	2	Digital Signal Processors	MROM	.5 mm	FIXED POINT	R-PQFP-G128	3	Not Qualified		YES	YES	e0
ADSP-SC570CSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	105 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm		CMOS		1.1 V					.5 mm	FIXED POINT	S-PQFP-G176	3			YES	YES	e3
ADSP-BF547YBCZ-4A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.38 V		22	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		17 mm		YES	16	50 MHz			MULTIPLE	17 mm		CMOS		1.2 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B400	3	Not Qualified	400 rpm	YES	YES	e1
ADSP-2195MBCA-140X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY		YES	2.63 V		22	16	2.5,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	2.37 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	1.7 mm	16384	10 mm		YES	16	160 MHz			MULTIPLE	10 mm		CMOS		2.5 V			Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B144		Not Qualified		YES	YES	e0
ADSP-21060CW-133	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	240	HFQFP	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.25 V		32	32	5	FLATPACK, HEAT SINK/SLUG, FINE PITCH	HQFP240,1.37SQ,20	4.75 V	100 Cel		-40 Cel	GOLD	QUAD	4.2 mm	131072	32 mm		YES	48	33.3 MHz			MULTIPLE	32 mm		CMOS	745 mA	5 V			Digital Signal Processors		.5 mm	FLOATING POINT	S-CQFP-G240		Not Qualified		YES	YES	e4
ADSP-BF524BBCZ-3A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V		19	32	1.2,2.5/3.3	GRID ARRAY, FINE PITCH	BGA208,20X20,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.75 mm		17 mm		YES	16	50 MHz	30	260	MULTIPLE	17 mm		CMOS		1.8 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B208	3	Not Qualified	300 rpm	YES	YES	e1
ADSP-2166BS-52	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V		14	16	3.3	FLATPACK	QFP80,.7SQ	3 V	85 Cel		-40 Cel	TIN LEAD	QUAD	3.4 mm	2048	14 mm		NO	24	13 MHz			MULTIPLE	14 mm		CMOS	16 mA	3.3 V			Digital Signal Processors		.65 mm	FIXED POINT	S-PQFP-G80		Not Qualified		YES	YES	e0
ADSP-2103BS-40	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16	14	16	3.3	FLATPACK	QFP80,.7SQ	3 V	85 Cel	1	-40 Cel	TIN LEAD	QUAD	2.45 mm	512	14 mm	20 MIPS; SINGLE CYCLE INSTRUCTION EXECUTION	NO	24	10.24 MHz			MULTIPLE	14 mm	1	CMOS	20 mA	3.3 V	0	2	Digital Signal Processors		.65 mm	FIXED POINT	S-PQFP-G80		Not Qualified		YES	YES	e0
ADSP-2191MBST-140X	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	2.63 V		22			FLATPACK, LOW PROFILE, FINE PITCH		2.37 V	85 Cel		-40 Cel		QUAD	1.6 mm		20 mm		YES	16	140 MHz			MULTIPLE	20 mm		CMOS		2.5 V					.5 mm	FIXED POINT	S-PQFP-G144		Not Qualified		YES	YES
ADSP-21571BSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V					FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	85 Cel		-40 Cel		QUAD	1.6 mm		24 mm		YES			30	260	MULTIPLE	24 mm		CMOS		1.1 V					.5 mm	FIXED POINT	S-PQFP-G176				YES	YES
ADSP-2101BS-40	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	16	14	16	5	FLATPACK	QFP80,.7SQ	4.5 V	85 Cel	3	-40 Cel	TIN LEAD	QUAD		512		COMPANDING HARDWARE WITH SERIAL PORTS; INTERNAL WIDTH PMA=14; DMA=14; PMD=24; DMD=16	NO	24	10.24 MHz			MULTIPLE		1	CMOS	55 mA	5 V	0	2	Digital Signal Processors		.635 mm	FIXED POINT	S-PQFP-G80		Not Qualified		YES	YES	e0
ADSP-BF516BBCZ-4F4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	168	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.47 V		19	32	1.3,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA168,14X14,32	1.164 V	85 Cel		-40 Cel		BOTTOM	1.7 mm		12 mm		YES	16	400 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS		1.4 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B168		Not Qualified	400 rpm	YES	YES
ADSPBF504FBCPZ-ENG	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V		3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel		-40 Cel		QUAD	.85 mm		12 mm	ALSO OPERATES AT 2.5 AND 3.3 V TYP	YES		50 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	12 mm		CMOS		1.8 V					.5 mm	FIXED POINT	S-XQCC-N88		Not Qualified		YES	YES

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.