BALL Digital Signal Processors (DSPs) 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Digital To Analog Convertors Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Internal Bus Architecture Length Total Dose (V) No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Barrel Shifter JESD-609 Code On Chip Program ROM Width No. of I/O Lines

TMS320VC5510AGBCA1

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

240

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.65 V

16

22

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA240,17X17,32

1.55 V

85 Cel

6

-40 Cel

TIN LEAD

BOTTOM

1.4 mm

163840

15 mm

YES

32

50 MHz

20

220

MULTIPLE

15 mm

2

CMOS

1.6 V

6

MROM

.8 mm

FIXED POINT

S-PBGA-B240

3

YES

NO

e0

16

TMS320C6211BGFN150

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.89 V

22

32

1.8,3.3

GRID ARRAY

BGA256,20X20,50

1.71 V

90 Cel

4

0 Cel

TIN LEAD

BOTTOM

2.32 mm

4096

27 mm

ALSO REQUIRES 3.3V I/O SUPPLY

YES

32

150 MHz

20

220

MULTIPLE

27 mm

2

CMOS

1.8 V

16

Digital Signal Processors

1.27 mm

FIXED POINT

S-PBGA-B256

4

Not Qualified

YES

NO

e0

TMS320DM6437ZDUQ6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

376

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

8

32

32

1.2,1.8,3.3

GRID ARRAY

BGA376,22X22,40

1.14 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.48 mm

61440

23 mm

ALSO REQUIRES 3.3V I/O SUPPLY

YES

32

27 MHz

30

260

MULTIPLE

23 mm

5

CMOS

1.2 V

72

Digital Signal Processors

MROM

1 mm

FIXED POINT

S-PBGA-B376

3

Not Qualified

YES

NO

e1

8

TMS320DM642AGNZA5

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

548

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.44 V

23

32

1.4,3.3

GRID ARRAY

BGA548,26X26,40

1.36 V

105 Cel

4

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

2.8 mm

16384

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.19 MHz

NOT SPECIFIED

220

MULTIPLE

27 mm

3

CMOS

1.4 V

64

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B548

4

Not Qualified

YES

NO

e0

OMAPL137BZKBD4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

13

1.3,1.8/3.3

GRID ARRAY

BGA256,16X16,40

1.25 V

90 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.05 mm

17 mm

IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY

YES

16

456 MHz

30

260

MULTIPLE

17 mm

CMOS

1.3 V

Other Microprocessor ICs

1 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

YES

NO

e1

TMS320F28234ZAYA

Texas Instruments

DIGITAL SIGNAL PROCESSOR, CONTROLLER

INDUSTRIAL

BALL

179

LFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.995 V

16

0

32

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA179,14X14,32

1.805 V

85 Cel

C28X

8

-40 Cel

TIN SILVER COPPER

YES

BOTTOM

1.4 mm

34816

12 mm

YES

0

150 MHz

30

260

MULTIPLE

12 mm

3

69632

CMOS

.315 mA

1.9 V

6

YES

FLASH

.8 mm

FLOATING POINT

S-PBGA-B179

3

YES

NO

e1

16

TMS320C6416GLZ400

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

32

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.16 V

BOTTOM

3.3 mm

23 mm

0 TO 90 OPERATING CASE TEMPERATURE

YES

32

75.18 MHz

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320DM8168SCYG4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, MIXED

COMMERCIAL

BALL

1031

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

15

32

1

GRID ARRAY, HEAT SINK/SLUG

BGA1031,37X37,25

.95 V

95 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.31 mm

16384

25 mm

YES

32

NOT SPECIFIED

245

MULTIPLE

25 mm

8

CMOS

1 V

72

Digital Signal Processors

.65 mm

FLOATING POINT

S-PBGA-B1031

4

Not Qualified

YES

NO

e1

TMS320VC5410AZGU16

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.65 V

16

23

16

1.6,3/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,13X13,32

1.55 V

100 Cel

4

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

65536

12 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

20 MHz

30

260

MULTIPLE

12 mm

1

CMOS

1.6 V

6

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B144

3

Not Qualified

YES

YES

e1

16

TMS320VC5502ZZZ200

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

201

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

16

20

16

1.2,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA201,17X17,32

1.2 V

85 Cel

4

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

32768

15 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

50 MHz

30

260

MULTIPLE

15 mm

4

CMOS

239 mA

1.26 V

6

Digital Signal Processors

MROM

.8 mm

FIXED POINT

S-PBGA-B201

3

Not Qualified

YES

NO

e1

16

TMS320C6416EZLZ7E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.44 V

23

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

1.36 V

BOTTOM

3.3 mm

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.75 MHz

MULTIPLE

23 mm

CMOS

1.4 V

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS32C6415DGLZKW6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

BOTTOM

4096

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

TMS320C6657SCZH8

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

625

FBGA

SQUARE

PLASTIC/EPOXY

YES

24

GRID ARRAY, FINE PITCH

85 Cel

0 Cel

BOTTOM

2.99 mm

21 mm

YES

16

MULTIPLE

21 mm

CMOS

.8 mm

FLOATING POINT

S-PBGA-B625

YES

NO

TMS320C6743BZKB3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

15

32

1.2,3.3

GRID ARRAY

BGA256,16X16,40

1.14 V

TIN SILVER COPPER

BOTTOM

2.05 mm

8192

17 mm

YES

16

30 MHz

30

260

SINGLE

17 mm

CMOS

1.2 V

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

YES

NO

e1

TMS320DM641AGNZ5

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

548

BGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

23

32

1.4,3.3

GRID ARRAY

BGA548,26X26,40

1.14 V

BOTTOM

2.8 mm

16384

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

75 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

27 mm

CMOS

1.2 V

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B548

Not Qualified

YES

NO

TMS320C6454BZTZA7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

697

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2875 V

16

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA697,29X29,32

1.2125 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.242 mm

8192

24 mm

YES

64

30

260

MULTIPLE

24 mm

CMOS

1.25 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B697

4

Not Qualified

YES

NO

e1

TMS320C6454BZTZ7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

697

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.89 V

20

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA697,29X29,32

1.71 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

32768

24 mm

YES

64

66.6 MHz

30

260

MULTIPLE

24 mm

CMOS

1.8 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B697

4

Not Qualified

NO

YES

e1

TMS320C5421GGUA200

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

5.25 V

19

GRID ARRAY, LOW PROFILE, FINE PITCH

4.75 V

85 Cel

0 Cel

BOTTOM

1.4 mm

12 mm

ALSO REQUIRES 3.3V SUPPLY

YES

16

50 MHz

MULTIPLE

12 mm

CMOS

5 V

.8 mm

FIXED POINT

S-PBGA-B144

Not Qualified

YES

YES

TMS320C6416TBZLZ7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.25 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

30

260

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e1

TMS320F28044ZGMS

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

AUTOMOTIVE

BALL

100

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.89 V

0

GRID ARRAY, LOW PROFILE, FINE PITCH

1.71 V

125 Cel

-40 Cel

BOTTOM

1.4 mm

10 mm

ALSO REQUIRES 3.3V SUPPLY

YES

0

35 MHz

MULTIPLE

10 mm

CMOS

1.8 V

.8 mm

FIXED POINT

S-PBGA-B100

Not Qualified

YES

NO

TMS320C6748AZCE3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

24

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

YES

64

50 MHz

30

260

MULTIPLE

13 mm

CMOS

1.2 V

.65 mm

FLOATING POINT

S-PBGA-B361

3

Not Qualified

YES

NO

e1

TMS320VC5510AZAVD2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

240

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.65 V

16

22

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA240,17X17,32

1.55 V

85 Cel

6

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

163840

15 mm

YES

32

200 MHz

30

260

MULTIPLE

15 mm

2

CMOS

112 mA

1.6 V

6

MROM

.8 mm

FIXED POINT

S-PBGA-B240

3

YES

NO

e1

16

TMS320C6746EZCE3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

8

23

GRID ARRAY, LOW PROFILE, FINE PITCH

.95 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

327680

13 mm

ALSO OPEARTES AT 1.1V AND 1.2V SUPLLY

YES

16

30 MHz

30

260

SINGLE

13 mm

8

CMOS

1 V

80

.65 mm

FLOATING POINT

S-PBGA-B361

3

YES

NO

e1

TMS320C6415TBGLZ8

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.1,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.16 V

90 Cel

0 Cel

BOTTOM

3.3 mm

262144

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.18 MHz

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6415TBGLZA8

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.24 V

23

32

1.1,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

105 Cel

4

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.25 mm

262144

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

1.2 V

64

Digital Signal Processors

FLASH

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

8

TMS320C6654GZHL8

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

625

FBGA

SQUARE

PLASTIC/EPOXY

YES

0

GRID ARRAY, FINE PITCH

BOTTOM

2.99 mm

21 mm

YES

0

MULTIPLE

21 mm

CMOS

.8 mm

FLOATING POINT

S-PBGA-B625

YES

NO

TMS320C6415GLZ400

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

32

32

1.2,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.16 V

BOTTOM

3.3 mm

16384

23 mm

0 TO 90 OPERATING CASE TEMPERATURE

YES

32

75.18 MHz

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C5533AZAY05

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

COMMERCIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.15 V

16

0

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,14X14,32

.998 V

70 Cel

2

-10 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

65536

12 mm

YES

0

12 MHz

30

260

MULTIPLE

12 mm

4

CMOS

1.05 V

16

MROM

.8 mm

FIXED POINT

S-PBGA-B144

3

YES

NO

e1

8

TMS320C6455BGTZ7

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

697

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.236 V

20

32

1.2

GRID ARRAY, FINE PITCH

BGA697,29X29,32

1.164 V

90 Cel

0 Cel

TIN LEAD

BOTTOM

3.242 mm

32768

24 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

66.6 MHz

20

220

MULTIPLE

24 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B697

4

Not Qualified

YES

NO

e0

SM32C6415EGLZ50SEP

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.31 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.19 V

105 Cel

4

-55 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

33 MHz

NOT SPECIFIED

220

MULTIPLE

23 mm

3

CMOS

1.25 V

64

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS320C2802GGMA

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

100

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.89 V

0

32

1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA100,10X10,32

1.71 V

85 Cel

-40 Cel

BOTTOM

1.4 mm

3072

10 mm

ALSO REQUIRES 3.3V SUPPLY

YES

0

100 MHz

MULTIPLE

10 mm

CMOS

1.8 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B100

Not Qualified

YES

NO

TMS320TCI6482ZTZ8

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

697

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.236 V

20

32

1.2,1.5/1.8,1.8,3.3

GRID ARRAY, FINE PITCH

BGA697,29X29,32

1.164 V

TIN SILVER COPPER

BOTTOM

3.242 mm

65536

24 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

66.6 MHz

MULTIPLE

24 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B697

Not Qualified

YES

NO

e1

TMS320C6414TZLZ8

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.24 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.16 V

90 Cel

0 Cel

BOTTOM

3.25 mm

16384

23 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS32C6414DGLZK6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.4,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

BOTTOM

4096

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

TMS32C6416DGLZK6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.4,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

BOTTOM

4096

CMOS

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

TMS320TCI6612XCMSA2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

0

GRID ARRAY

.95 V

BOTTOM

YES

0

MULTIPLE

CMOS

1 V

FLOATING POINT

S-PBGA-B900

YES

NO

SM320C6201BGLPW15

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

429

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1.89 V

MIL-PRF-38535

20

32

1.8,3.3

GRID ARRAY

BGA429,21X21,50

1.71 V

BOTTOM

3.3 mm

16384

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

150 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

27 mm

CMOS

1.8 V

Digital Signal Processors

1.27 mm

FIXED POINT

S-CBGA-B429

Not Qualified

YES

NO

OMAPL137DZKBD4

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.35 V

8

15

1.3,1.8/3.3

GRID ARRAY

BGA256,16X16,40

1.25 V

70 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.05 mm

499712

17 mm

YES

16

30 MHz

30

260

SINGLE

17 mm

3

CMOS

1.3 V

40

Other Microprocessor ICs

1 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

456 rpm

YES

NO

e1

TMS32C6415CGLZW5E0

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

23

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA532,26X26,32

1.14 V

BOTTOM

3.3 mm

4096

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

MULTIPLE

23 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

Not Qualified

YES

NO

TMS320C6202BGLS-250

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

384

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.575 V

22

32

1.5,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA384,22X22,32

1.425 V

90 Cel

0 Cel

BOTTOM

2.8 mm

32768

18 mm

YES

32

250 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

18 mm

CMOS

1.5 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B384

Not Qualified

YES

NO

TMS320TCI6482GTZ2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

697

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2875 V

20

32

1.25,1.5/1.8,1.8,3.3

GRID ARRAY, FINE PITCH

BGA697,29X29,32

1.2125 V

BOTTOM

3.242 mm

8192

24 mm

YES

64

66.6 MHz

NOT SPECIFIED

NOT SPECIFIED

MULTIPLE

24 mm

CMOS

1.25 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B697

Not Qualified

YES

NO

TMS320C6701GJCA120

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

352

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.89 V

22

32

1.8,3.3

GRID ARRAY, HEAT SINK/SLUG

BGA352,26X26,50

1.71 V

105 Cel

4

-40 Cel

TIN LEAD

BOTTOM

3.5 mm

16384

35 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

120.48 MHz

20

220

MULTIPLE

35 mm

2

CMOS

1.8 V

4

Digital Signal Processors

1.27 mm

FLOATING POINT

S-PBGA-B352

4

Not Qualified

YES

NO

e0

TMS320DM642AZNZA6

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

INDUSTRIAL

BALL

548

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.44 V

23

32

1.4,3.3

GRID ARRAY

BGA548,26X26,40

1.36 V

105 Cel

4

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

2.8 mm

4096

27 mm

ALSO REQUIRES 3.3V SUPPLY

YES

64

75.19 MHz

NOT SPECIFIED

260

MULTIPLE

27 mm

3

CMOS

1.4 V

64

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B548

4

Not Qualified

YES

NO

e1

TMS320C6747BZKB3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

16

32

1.2,1.8,3.3

GRID ARRAY

BGA256,16X16,40

1.14 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.05 mm

8192

17 mm

YES

16

30 MHz

30

260

MULTIPLE

17 mm

CMOS

1.2 V

Digital Signal Processors

1 mm

FLOATING POINT

S-PBGA-B256

3

Not Qualified

YES

NO

e1

OMAPL137ZKBT3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

256

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

S-PBGA-B256

Not Qualified

TMS320C6457CMHA2

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

688

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.236 V

20

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

1.164 V

BOTTOM

3.3 mm

23 mm

YES

64

62.5 MHz

MULTIPLE

23 mm

CMOS

1.2 V

.8 mm

FIXED POINT

S-PBGA-B688

Not Qualified

NO

NO

TMS32C6414DGLZA6E3

Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER

BALL

532

HFBGA

SQUARE

PLASTIC/EPOXY

YES

1.44 V

32

32

1.4,3.3

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

BGA532,26X26,32

1.36 V

TIN LEAD

BOTTOM

3.3 mm

16384

23 mm

ALSO REQUIRES 3.3VI/O SUPPLY

YES

64

75.18 MHz

20

220

MULTIPLE

23 mm

CMOS

1.4 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B532

4

Not Qualified

YES

NO

e0

TMS320C6424AZDU400

Texas Instruments

COMMERCIAL

BALL

376

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1.1,1.8,3.3

GRID ARRAY

BGA376,22X22,40

70 Cel

0 Cel

BOTTOM

20480

CMOS

Digital Signal Processors

1 mm

FIXED POINT

S-PBGA-B376

Not Qualified

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.