169 DSP Peripherals 11

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Manufacturers
    • Advanced Micro Devices
    • Analog Devices
    • Broadcom
    • Cypress Semiconductor
    • Defense Logistics Agency
    • Fairchild Semiconductor
    • Infineon Technologies
    • Integrated Device Technology
    • Intersil
    • Maxim Integrated
    • NXP Semiconductors
    • Onsemi
    • Qualcomm
    • Renesas Electronics
    • STMicroelectronics
    • Samsung
    • Texas Instruments
Peripheral IC Type
    • BIT-SLICE MICROPROCESSOR
    • DSP PERIPHERAL CONTROLLER
    • DSP PERIPHERAL, ADDRESS SEQUENCER
    • DSP PERIPHERAL, BARREL SHIFTER
    • DSP PERIPHERAL, CONVOLVER
    • DSP PERIPHERAL, COORDINATE TRANSFORM PROCESSOR
    • DSP PERIPHERAL, CROSSBAR SWITCH
    • DSP PERIPHERAL, DIGITAL FILTER
    • DSP PERIPHERAL, DIVIDER
    • DSP PERIPHERAL, FAST COSINE TRANSFRM PROCESSOR
    • DSP PERIPHERAL, FFT PROCESSOR
    • DSP PERIPHERAL, FLOATING POINT PROCESSOR
    • DSP PERIPHERAL, HISTOGRAM PROCESSOR
    • DSP PERIPHERAL, MIXER
    • DSP PERIPHERAL, MULTIPLIER
    • DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
    • DSP PERIPHERAL, NUMERIC CONTROLLED OSCILLATOR
    • DSP PERIPHERAL, PIPELINE REGISTER
    • DSP PERIPHERAL, VIDEO IMAGING
Temperature Grade
    • AUTOMOTIVE
    • COMMERCIAL
    • COMMERCIAL EXTENDED
    • INDUSTRIAL
    • MILITARY
    • OTHER
Terminal Form
    • BALL
    • FLAT
    • GULL WING
    • J BEND
    • NO LEAD
    • PIN/PEG
    • THROUGH-HOLE
No. of Terminals (1)
    • 169
    • 10
    • 100
    • 108
    • 120
    • 128
    • 132
    • 14
    • 144
    • 145
    • 155
    • 156
    • 16
    • 160
    • 184
    • 20
    • 208
    • 22
    • 223
    • 24
    • 28
    • 32
    • 40
    • 42
    • 44
    • 48
    • 52
    • 56
    • 64
    • 68
    • 8
    • 80
    • 84
Package Code
    • BGA
    • DFP
    • DIE
    • DIP
    • FQFP
    • HTFQFP
    • HVQCCN
    • HVSON
    • LFQFP
    • PGA
    • QCCJ
    • QCCN
    • QFF
    • QFP
    • SDIP
    • SOP
    • SSOP
    • TFQFP
    • TSSOP
Package Shape
    • RECTANGULAR
    • SQUARE
    • UNSPECIFIED
Package Body Material
    • CERAMIC
    • CERAMIC, GLASS-SEALED
    • CERAMIC, METAL-SEALED COFIRED
    • METAL
    • PLASTIC/EPOXY
    • UNSPECIFIED
Surface Mount
    • NO
    • YES
Maximum Supply Voltage
    • 1.89 V
    • 10.5 V
    • 12 V
    • 16 V
    • 18 V
    • 24 V
    • 3.465 V
    • 3.5 V
    • 3.6 V
    • 3.63 V
    • 5 V
    • 5.25 V
    • 5.5 V
    • 6 V
Screening Level
    • 38535Q/M;38534H;883B
    • AEC-Q100
    • MIL-PRF-38535
    • MIL-STD-883
    • MIL-STD-883 Class B (Modified)
Output Data Bus Width
    • 1
    • 10
    • 12
    • 13
    • 16
    • 19
    • 2
    • 20
    • 22
    • 24
    • 27
    • 28
    • 32
    • 35
    • 4
    • 40
    • 8
Power Supplies (V)
    • -5.2
    • 2.5/5
    • 3
    • 3.3
    • 3.3/5
    • 3/5
    • 5
    • 5/10
Package Style (Meter)
    • CHIP CARRIER
    • CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
    • FLATPACK
    • FLATPACK, FINE PITCH
    • FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
    • FLATPACK, LOW PROFILE, FINE PITCH
    • FLATPACK, THIN PROFILE, FINE PITCH
    • GRID ARRAY
    • IN-LINE
    • IN-LINE, SHRINK PITCH
    • SMALL OUTLINE
    • SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
    • SMALL OUTLINE, SHRINK PITCH
    • SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
    • UNCASED CHIP
Package Equivalence Code
    • BGA160,14X14,40
    • DIP(UNSPEC)
    • DIP14,.3
    • DIP16,.3
    • DIP20,.3
    • DIP24,.3
    • DIP28,.4
    • DIP28,.6
    • DIP40,.6
    • DIP48,.6
    • DIP64,.9
    • FL14,.3
    • FL16,.3
    • HPGA169,17X17
    • LCC20,.20SQ,25
    • LCC28,.2SQ,20
    • LCC28,.45SQ
    • LCC32,.27SQ,25
    • LCC68,.95SQ
    • LDCC20,.4SQ
    • LDCC28,.5SQ
    • LDCC52,.8SQ
    • LDCC68,1.0SQ
    • LDCC84,1.2SQ
    • PGA100M,13X13
    • PGA108,12X12
    • PGA120,13X13
    • PGA132,14X14
    • PGA144,15X15
    • PGA155,15X15
    • PGA156M,15X15MOD
    • PGA169,17X17
    • PGA223,18X18
    • PGA68(UNSPEC)
    • PGA68,11X11
    • PGA68,12X12
    • PGA84,10X10
    • PGA84M,11X11
    • QFL64,.7SQ,40
    • QFL64,.9SQ
    • QFL68,.95SQ
    • QFL84,1.2SQ
    • QFP100,.7X.9
    • QFP160,1.2SQ
    • QFP48,.35SQ,20
    • QFP64,.7SQ,32
    • SDIP42,.6
    • SOP14,.25
    • SOP16,.25
    • SOP20,.3
    • SOP24,.4
    • SOP28,.4
    • SOP28,.45
    • SSOP28,.3
    • TSSOP10,.19,20
    • TSSOP16,.25
    • TSSOP20,.25
Minimum Supply Voltage
    • 1.71 V
    • 1.8 V
    • 10 V
    • 2.3 V
    • 2.5 V
    • 2.7 V
    • 2.97 V
    • 3 V
    • 3.1 V
    • 3.135 V
    • 3.3 V
    • 4 V
    • 4.25 V
    • 4.5 V
    • 4.75 V
Maximum Operating Temperature
    • 100 Cel
    • 105 Cel
    • 125 Cel
    • 70 Cel
    • 85 Cel
    • 90 Cel
CPU Family
    • FCT
Minimum Operating Temperature
    • -10 Cel
    • -20 Cel
    • -25 Cel
    • -40 Cel
    • -55 Cel
    • 0 Cel
Terminal Finish
    • GOLD
    • MATTE TIN
    • Matte Tin (Sn)
    • Matte Tin (Sn) - annealed
    • NICKEL PALLADIUM GOLD
    • TIN BISMUTH
    • TIN LEAD
    • Tin/Lead (Sn/Pb)
    • Tin/Lead (Sn85Pb15)
Terminal Position
    • BOTTOM
    • DUAL
    • PERPENDICULAR
    • QUAD
    • UPPER
Maximum Seated Height
    • .8 mm
    • 1 mm
    • 1.1 mm
    • 1.2 mm
    • 1.6 mm
    • 1.75 mm
    • 1.8 mm
    • 2 mm
    • 2.03 mm
    • 2.45 mm
    • 2.54 mm
    • 2.62 mm
    • 2.65 mm
    • 2.72 mm
    • 2.79 mm
    • 3 mm
    • 3.15 mm
    • 3.4 mm
    • 3.7 mm
    • 3.81 mm
    • 3.86 mm
    • 4.004 mm
    • 4.1 mm
    • 4.17 mm
    • 4.19 mm
    • 4.29 mm
    • 4.31 mm
    • 4.45 mm
    • 4.47 mm
    • 4.5 mm
    • 4.57 mm
    • 4.572 mm
    • 4.826 mm
    • 4.953 mm
    • 5.08 mm
    • 5.334 mm
    • 5.46 mm
    • 5.715 mm
    • 5.72 mm
    • 6.1 mm
    • 6.35 mm
    • 8.76 mm
Width
    • 11.43 mm
    • 11.5062 mm
    • 14 mm
    • 15 mm
    • 15.24 mm
    • 16.585 mm
    • 16.5862 mm
    • 19.1262 mm
    • 20 mm
    • 22.86 mm
    • 24.13 mm
    • 24.18 mm
    • 24.195 mm
    • 24.23 mm
    • 25.145 mm
    • 26.92 mm
    • 26.924 mm
    • 27.64 mm
    • 27.81 mm
    • 27.9 mm
    • 27.94 mm
    • 28 mm
    • 29.135 mm
    • 29.31 mm
    • 29.464 mm
    • 29.465 mm
    • 3 mm
    • 3.9 mm
    • 30.48 mm
    • 31.2 mm
    • 33.525 mm
    • 34.16 mm
    • 34.545 mm
    • 38.85 mm
    • 4.4 mm
    • 40 mm
    • 42.165 mm
    • 44.704 mm
    • 5.3 mm
    • 5.6 mm
    • 7 mm
    • 7.5 mm
    • 7.52 mm
    • 7.62 mm
    • 8 mm
    • 8.4 mm
Additional Features
    • 10 BIT COEFFICIENT INPUT BUS
    • 24 X 24 CROSSPOINT SWITCH
    • 28 BIT RESULT ACCUMULATOR
    • 2S COMPLEMENT
    • 2S COMPLEMENT OR OFFSET BINARY OUTPUT
    • 3 X 8 BIT DATA INPUT BUS
    • 64 BIT DOUBLE PRECISION FPU; COPROCESSOR AND HOST INDEPENDENT MODES OF OPERATION
    • 8 X 8 BIT INPUT BUS
    • ALSO -5V SUPPLY AVAILABLE
    • ALSO REQUIRES 3.3V SUPPLY
    • ALSO REQUIRES 5V NEGATIVE SUPPLY
    • CAN ALSO OPERATE AT 5V NOMINAL SUPPLY
    • HAS FIVE DATA PORTS
    • IT ALSO REQUIRES 4.5 TO 5.5 VDD SUPPLY
    • MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ
    • MULTIPLEXED OUTPUT; ICC SPECIFIED AT 33MHZ
    • OFFSET BINARY OUTPUT
    • OPERATES AT -3 TO -5.25 IN ECL COMPATIBLE INPUT AND OUTPUT LEVEL
    • PROGRAMMABLE PIPELINE DELAY OF UP TO 7 CLOCK CYCLES
    • SUPPORTS NEWTON-RAPHSON DIVISION; SUPPORTS PIPELINED OR FLOW-THROUGH OPERATION
Boundary Scan
    • NO
    • YES
External Data Bus Width
    • 0
    • 1
    • 10
    • 12
    • 16
    • 19
    • 20
    • 24
    • 32
    • 4
    • 7
    • 8
    • 9
Maximum Clock Frequency
    • 10 MHz
    • 10.53 MHz
    • 100 MHz
    • 106 MHz
    • 11.11 MHz
    • 12.352 MHz
    • 12.5 MHz
    • 125 MHz
    • 13.33 MHz
    • 14.28 MHz
    • 140 MHz
    • 16.67 MHz
    • 16.7 MHz
    • 17.24 MHz
    • 20 MHz
    • 2000 MHz
    • 23.53 MHz
    • 24.576 MHz
    • 25 MHz
    • 25.6 MHz
    • 27 MHz
    • 30 MHz
    • 30.3 MHz
    • 32 MHz
    • 32.26 MHz
    • 33 MHz
    • 33.86 MHz
    • 40 MHz
    • 400 MHz
    • 45 MHz
    • 5 MHz
    • 50 MHz
    • 500 MHz
    • 52 MHz
    • 6.25 MHz
    • 6.67 MHz
    • 66.67 MHz
    • 7.14 MHz
    • 75 MHz
    • 76.9 MHz
    • 8 MHz
    • 80 MHz
    • 9.52 MHz
Maximum Time At Peak Reflow Temperature (s)
    • 10
    • 20
    • 30
    • 40
    • NOT SPECIFIED
Peak Reflow Temperature (C)
    • 220
    • 225
    • 240
    • 245
    • 260
    • NOT SPECIFIED
Length
    • 10.2 mm
    • 10.34 mm
    • 11.43 mm
    • 11.5062 mm
    • 14 mm
    • 15 mm
    • 15.4 mm
    • 16.585 mm
    • 16.5862 mm
    • 17.9 mm
    • 18.3 mm
    • 19.1262 mm
    • 19.4 mm
    • 20 mm
    • 24.13 mm
    • 24.18 mm
    • 24.195 mm
    • 24.23 mm
    • 25.145 mm
    • 26.92 mm
    • 26.924 mm
    • 27.64 mm
    • 27.81 mm
    • 27.9 mm
    • 27.94 mm
    • 28 mm
    • 29.135 mm
    • 29.31 mm
    • 29.464 mm
    • 29.465 mm
    • 3 mm
    • 30.48 mm
    • 31.2 mm
    • 31.64 mm
    • 32.005 mm
    • 32.0675 mm
    • 33.525 mm
    • 34.16 mm
    • 34.545 mm
    • 35.179 mm
    • 36.32 mm
    • 36.703 mm
    • 37.4 mm
    • 38.65 mm
    • 38.85 mm
    • 4.9 mm
    • 40 mm
    • 42.165 mm
    • 44.704 mm
    • 5 mm
    • 50.8 mm
    • 52.07 mm
    • 52.1 mm
    • 6.5 mm
    • 60.96 mm
    • 7 mm
    • 8 mm
    • 8.65 mm
    • 81.28 mm
Technology
    • BICMOS
    • BIPOLAR
    • CMOS
    • ECL
    • MOS
    • NMOS
    • TTL
Nominal Negative Supply Voltage
    • -5.2 V
Maximum Supply Current
    • .2 mA
    • .4 mA
    • .6 mA
    • 100 mA
    • 105 mA
    • 110 mA
    • 120 mA
    • 125 mA
    • 13.5 mA
    • 140 mA
    • 150 mA
    • 160 mA
    • 165 mA
    • 170 mA
    • 182 mA
    • 184 mA
    • 185 mA
    • 200 mA
    • 203 mA
    • 205 mA
    • 21.8 mA
    • 210 mA
    • 250 mA
    • 264 mA
    • 30 mA
    • 300 mA
    • 350 mA
    • 360 mA
    • 363 mA
    • 40 mA
    • 45 mA
    • 500 mA
    • 52 mA
    • 55 mA
    • 572 mA
    • 577 mA
    • 60 mA
    • 65 mA
    • 7 mA
    • 70 mA
    • 75 mA
    • 80 mA
    • 800 mA
    • 825 mA
    • 90 mA
    • 96 mA
    • 97 mA
    • 99 mA
Nominal Supply Voltage
    • 1.8 V
    • 10 V
    • 12 V
    • 14 V
    • 2 V
    • 2.5 V
    • 3 V
    • 3.3 V
    • 5 V
Sub-Category
    • DSP Peripherals
    • Math Processors
    • Serial IO/Communication Controllers
Terminal Pitch
    • .4 mm
    • .5 mm
    • .635 mm
    • .65 mm
    • .8 mm
    • 1 mm
    • 1.27 mm
    • 1.778 mm
    • 2.54 mm
JESD-30 Code
    • R-CDIP-P24
    • R-CDIP-T24
    • R-CDIP-T28
    • R-CDIP-T40
    • R-CDIP-T48
    • R-CDIP-T64
    • R-CPGA-P120
    • R-CQFP-G100
    • R-GDIP-T24
    • R-PDIP-T14
    • R-PDIP-T16
    • R-PDIP-T20
    • R-PDIP-T22
    • R-PDIP-T24
    • R-PDIP-T28
    • R-PDIP-T40
    • R-PDIP-T42
    • R-PDIP-T48
    • R-PDIP-T64
    • R-PDSO-G14
    • R-PDSO-G16
    • R-PDSO-G20
    • R-PDSO-G24
    • R-PDSO-G28
    • R-PDSO-G8
    • R-PDSO-N8
    • R-PQFP-G100
    • R-XDFP-F14
    • R-XDFP-F16
    • R-XDIP-T14
    • R-XDIP-T16
    • R-XDIP-T20
    • R-XDIP-T28
    • R-XDIP-T40
    • R-XDIP-T48
    • R-XDIP-T64
    • S-CPGA-P100
    • S-CPGA-P108
    • S-CPGA-P144
    • S-CPGA-P145
    • S-CPGA-P155
    • S-CPGA-P169
    • S-CPGA-P68
    • S-CPGA-P84
    • S-CQCC-N28
    • S-CQCC-N68
    • S-CQFP-G160
    • S-MQFP-G208
    • S-MQFP-G64
    • S-PBGA-B160
    • S-PDSO-G10
    • S-PPGA-P120
    • S-PPGA-P68
    • S-PQCC-J20
    • S-PQCC-J28
    • S-PQCC-J44
    • S-PQCC-J52
    • S-PQCC-J68
    • S-PQCC-J84
    • S-PQCC-N20
    • S-PQCC-N28
    • S-PQFP-G100
    • S-PQFP-G128
    • S-PQFP-G160
    • S-PQFP-G184
    • S-PQFP-G44
    • S-PQFP-G48
    • S-PQFP-G80
    • S-XPGA-P100
    • S-XPGA-P108
    • S-XPGA-P132
    • S-XPGA-P144
    • S-XPGA-P155
    • S-XPGA-P156
    • S-XPGA-P169
    • S-XPGA-P223
    • S-XPGA-P68
    • S-XPGA-P84
    • S-XQCC-J84
    • S-XQCC-N32
    • S-XQCC-N56
    • S-XQCC-N68
    • S-XQFP-F64
    • S-XQFP-F68
    • S-XQFP-F84
    • X-XUUC-N44
Moisture Sensitivity Level (MSL)
    • 1
    • 2
    • 3
    • 4
Qualification
    • Not Qualified
    • Qualified
Low Power Mode
    • NO
    • YES
JESD-609 Code
    • e0
    • e3
    • e4
    • e6
Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount Maximum Supply Voltage Screening Level Output Data Bus Width Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family Minimum Operating Temperature Terminal Finish Terminal Position Maximum Seated Height Width Additional Features Boundary Scan External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Technology Nominal Negative Supply Voltage Maximum Supply Current Nominal Supply Voltage Sub-Category Terminal Pitch JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Low Power Mode JESD-609 Code

AM29027-25GC

Advanced Micro Devices

DSP PERIPHERAL, FLOATING POINT PROCESSOR

OTHER

PIN/PEG

169

PGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

NO

5.25 V

32

5

GRID ARRAY

PGA169,17X17

4.75 V

85 Cel

0 Cel

TIN LEAD

PERPENDICULAR

4.953 mm

44.704 mm

SUPPORTS NEWTON-RAPHSON DIVISION; SUPPORTS PIPELINED OR FLOW-THROUGH OPERATION

NO

32

25 MHz

44.704 mm

CMOS

500 mA

5 V

Math Processors

2.54 mm

S-CPGA-P169

Not Qualified

NO

e0

ADSP7110JG

Analog Devices

DSP PERIPHERAL, MULTIPLIER

COMMERCIAL

PIN/PEG

169

PGA

SQUARE

CERAMIC

NO

5

GRID ARRAY

HPGA169,17X17

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

5 V

DSP Peripherals

2.54 mm

S-XPGA-P169

Not Qualified

e0

ADSP8110JG

Analog Devices

DSP PERIPHERAL, MULTIPLIER

COMMERCIAL

PIN/PEG

169

PGA

SQUARE

CERAMIC

NO

-5.2

GRID ARRAY

HPGA169,17X17

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

-5.2 V

DSP Peripherals

2.54 mm

S-XPGA-P169

Not Qualified

e0

ADSP8110KG

Analog Devices

DSP PERIPHERAL, MULTIPLIER

COMMERCIAL

PIN/PEG

169

PGA

SQUARE

CERAMIC

NO

-5.2

GRID ARRAY

HPGA169,17X17

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

-5.2 V

DSP Peripherals

2.54 mm

S-XPGA-P169

Not Qualified

e0

ADSP7110KG

Analog Devices

DSP PERIPHERAL, MULTIPLIER

COMMERCIAL

PIN/PEG

169

PGA

SQUARE

CERAMIC

NO

5

GRID ARRAY

HPGA169,17X17

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

5 V

DSP Peripherals

2.54 mm

S-XPGA-P169

Not Qualified

e0

ADSP8120KG

Analog Devices

DSP PERIPHERAL, FLOATING POINT PROCESSOR

COMMERCIAL

PIN/PEG

169

PGA

SQUARE

CERAMIC

NO

-5.2

GRID ARRAY

HPGA169,17X17

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

-5.2 V

DSP Peripherals

2.54 mm

S-XPGA-P169

Not Qualified

e0

ADSP7120KG

Analog Devices

DSP PERIPHERAL, FLOATING POINT PROCESSOR

COMMERCIAL

PIN/PEG

169

PGA

SQUARE

CERAMIC

NO

5

GRID ARRAY

HPGA169,17X17

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

5 V

DSP Peripherals

2.54 mm

S-XPGA-P169

Not Qualified

e0

ADSP7110LG

Analog Devices

DSP PERIPHERAL, MULTIPLIER

COMMERCIAL

PIN/PEG

169

PGA

SQUARE

CERAMIC

NO

5

GRID ARRAY

HPGA169,17X17

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

5 V

DSP Peripherals

2.54 mm

S-XPGA-P169

Not Qualified

e0

ADSP8110LG

Analog Devices

DSP PERIPHERAL, MULTIPLIER

COMMERCIAL

PIN/PEG

169

PGA

SQUARE

CERAMIC

NO

-5.2

GRID ARRAY

HPGA169,17X17

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

-5.2 V

DSP Peripherals

2.54 mm

S-XPGA-P169

Not Qualified

e0

ADSP8120JG

Analog Devices

DSP PERIPHERAL, FLOATING POINT PROCESSOR

COMMERCIAL

PIN/PEG

169

PGA

SQUARE

CERAMIC

NO

-5.2

GRID ARRAY

HPGA169,17X17

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

-5.2 V

DSP Peripherals

2.54 mm

S-XPGA-P169

Not Qualified

e0

ADSP7120JG

Analog Devices

DSP PERIPHERAL, FLOATING POINT PROCESSOR

COMMERCIAL

PIN/PEG

169

PGA

SQUARE

CERAMIC

NO

5

GRID ARRAY

HPGA169,17X17

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

5 V

DSP Peripherals

2.54 mm

S-XPGA-P169

Not Qualified

e0
DSP Peripherals

DSP (Digital Signal Processing) peripherals are electronic circuits that are designed to be used with DSP processors to perform specific tasks related to signal processing. DSP processors are used in a variety of applications, including audio and video processing, telecommunications, and image processing. DSP peripherals are designed to enhance the functionality of DSP processors by providing additional capabilities such as data acquisition, signal conditioning, and data conversion.

DSP peripherals can include analog-to-digital converters (ADCs), digital-to-analog converters (DACs), amplifiers, filters, and other signal conditioning circuits. These peripherals are used to acquire and condition signals before they are processed by the DSP processor. ADCs are used to convert analog signals, such as audio or video signals, into digital signals that can be processed by the DSP processor. DACs are used to convert digital signals back into analog signals, such as audio or video signals, for output.

DSP peripherals can also include hardware accelerators, which are used to offload computationally intensive tasks from the DSP processor. These hardware accelerators can include digital signal processors, graphics processing units, and other specialized hardware. By offloading these tasks, the DSP processor can focus on other tasks, resulting in improved performance and efficiency.