NO LEAD DSP Peripherals 106

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  2. DSP Peripherals
Manufacturers
    • Advanced Micro Devices
    • Analog Devices
    • Broadcom
    • Cypress Semiconductor
    • Defense Logistics Agency
    • Fairchild Semiconductor
    • Infineon Technologies
    • Integrated Device Technology
    • Intersil
    • Maxim Integrated
    • NXP Semiconductors
    • Onsemi
    • Qualcomm
    • Renesas Electronics
    • STMicroelectronics
    • Samsung
    • Texas Instruments
Peripheral IC Type
    • BIT-SLICE MICROPROCESSOR
    • DSP PERIPHERAL CONTROLLER
    • DSP PERIPHERAL, ADDRESS SEQUENCER
    • DSP PERIPHERAL, BARREL SHIFTER
    • DSP PERIPHERAL, CONVOLVER
    • DSP PERIPHERAL, COORDINATE TRANSFORM PROCESSOR
    • DSP PERIPHERAL, CROSSBAR SWITCH
    • DSP PERIPHERAL, DIGITAL FILTER
    • DSP PERIPHERAL, DIVIDER
    • DSP PERIPHERAL, FAST COSINE TRANSFRM PROCESSOR
    • DSP PERIPHERAL, FFT PROCESSOR
    • DSP PERIPHERAL, FLOATING POINT PROCESSOR
    • DSP PERIPHERAL, HISTOGRAM PROCESSOR
    • DSP PERIPHERAL, MIXER
    • DSP PERIPHERAL, MULTIPLIER
    • DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
    • DSP PERIPHERAL, NUMERIC CONTROLLED OSCILLATOR
    • DSP PERIPHERAL, PIPELINE REGISTER
    • DSP PERIPHERAL, VIDEO IMAGING
Temperature Grade
    • AUTOMOTIVE
    • COMMERCIAL
    • COMMERCIAL EXTENDED
    • INDUSTRIAL
    • MILITARY
    • OTHER
Terminal Form (1)
    • NO LEAD
    • BALL
    • FLAT
    • GULL WING
    • J BEND
    • PIN/PEG
    • THROUGH-HOLE
No. of Terminals
    • 10
    • 100
    • 108
    • 120
    • 128
    • 132
    • 14
    • 144
    • 145
    • 155
    • 156
    • 16
    • 160
    • 169
    • 184
    • 20
    • 208
    • 22
    • 223
    • 24
    • 28
    • 32
    • 40
    • 42
    • 44
    • 48
    • 52
    • 56
    • 64
    • 68
    • 8
    • 80
    • 84
Package Code
    • BGA
    • DFP
    • DIE
    • DIP
    • FQFP
    • HTFQFP
    • HVQCCN
    • HVSON
    • LFQFP
    • PGA
    • QCCJ
    • QCCN
    • QFF
    • QFP
    • SDIP
    • SOP
    • SSOP
    • TFQFP
    • TSSOP
Package Shape
    • RECTANGULAR
    • SQUARE
    • UNSPECIFIED
Package Body Material
    • CERAMIC
    • CERAMIC, GLASS-SEALED
    • CERAMIC, METAL-SEALED COFIRED
    • METAL
    • PLASTIC/EPOXY
    • UNSPECIFIED
Surface Mount
    • NO
    • YES
Maximum Supply Voltage
    • 1.89 V
    • 10.5 V
    • 12 V
    • 16 V
    • 18 V
    • 24 V
    • 3.465 V
    • 3.5 V
    • 3.6 V
    • 3.63 V
    • 5 V
    • 5.25 V
    • 5.5 V
    • 6 V
Screening Level
    • 38535Q/M;38534H;883B
    • AEC-Q100
    • MIL-PRF-38535
    • MIL-STD-883
    • MIL-STD-883 Class B (Modified)
Output Data Bus Width
    • 1
    • 10
    • 12
    • 13
    • 16
    • 19
    • 2
    • 20
    • 22
    • 24
    • 27
    • 28
    • 32
    • 35
    • 4
    • 40
    • 8
Power Supplies (V)
    • -5.2
    • 2.5/5
    • 3
    • 3.3
    • 3.3/5
    • 3/5
    • 5
    • 5/10
Package Style (Meter)
    • CHIP CARRIER
    • CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
    • FLATPACK
    • FLATPACK, FINE PITCH
    • FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
    • FLATPACK, LOW PROFILE, FINE PITCH
    • FLATPACK, THIN PROFILE, FINE PITCH
    • GRID ARRAY
    • IN-LINE
    • IN-LINE, SHRINK PITCH
    • SMALL OUTLINE
    • SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
    • SMALL OUTLINE, SHRINK PITCH
    • SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
    • UNCASED CHIP
Package Equivalence Code
    • BGA160,14X14,40
    • DIP(UNSPEC)
    • DIP14,.3
    • DIP16,.3
    • DIP20,.3
    • DIP24,.3
    • DIP28,.4
    • DIP28,.6
    • DIP40,.6
    • DIP48,.6
    • DIP64,.9
    • FL14,.3
    • FL16,.3
    • HPGA169,17X17
    • LCC20,.20SQ,25
    • LCC28,.2SQ,20
    • LCC28,.45SQ
    • LCC32,.27SQ,25
    • LCC68,.95SQ
    • LDCC20,.4SQ
    • LDCC28,.5SQ
    • LDCC52,.8SQ
    • LDCC68,1.0SQ
    • LDCC84,1.2SQ
    • PGA100M,13X13
    • PGA108,12X12
    • PGA120,13X13
    • PGA132,14X14
    • PGA144,15X15
    • PGA155,15X15
    • PGA156M,15X15MOD
    • PGA169,17X17
    • PGA223,18X18
    • PGA68(UNSPEC)
    • PGA68,11X11
    • PGA68,12X12
    • PGA84,10X10
    • PGA84M,11X11
    • QFL64,.7SQ,40
    • QFL64,.9SQ
    • QFL68,.95SQ
    • QFL84,1.2SQ
    • QFP100,.7X.9
    • QFP160,1.2SQ
    • QFP48,.35SQ,20
    • QFP64,.7SQ,32
    • SDIP42,.6
    • SOP14,.25
    • SOP16,.25
    • SOP20,.3
    • SOP24,.4
    • SOP28,.4
    • SOP28,.45
    • SSOP28,.3
    • TSSOP10,.19,20
    • TSSOP16,.25
    • TSSOP20,.25
Minimum Supply Voltage
    • 1.71 V
    • 1.8 V
    • 10 V
    • 2.3 V
    • 2.5 V
    • 2.7 V
    • 2.97 V
    • 3 V
    • 3.1 V
    • 3.135 V
    • 3.3 V
    • 4 V
    • 4.25 V
    • 4.5 V
    • 4.75 V
Maximum Operating Temperature
    • 100 Cel
    • 105 Cel
    • 125 Cel
    • 70 Cel
    • 85 Cel
    • 90 Cel
CPU Family
    • FCT
Minimum Operating Temperature
    • -10 Cel
    • -20 Cel
    • -25 Cel
    • -40 Cel
    • -55 Cel
    • 0 Cel
Terminal Finish
    • GOLD
    • MATTE TIN
    • Matte Tin (Sn)
    • Matte Tin (Sn) - annealed
    • NICKEL PALLADIUM GOLD
    • TIN BISMUTH
    • TIN LEAD
    • Tin/Lead (Sn/Pb)
    • Tin/Lead (Sn85Pb15)
Terminal Position
    • BOTTOM
    • DUAL
    • PERPENDICULAR
    • QUAD
    • UPPER
Maximum Seated Height
    • .8 mm
    • 1 mm
    • 1.1 mm
    • 1.2 mm
    • 1.6 mm
    • 1.75 mm
    • 1.8 mm
    • 2 mm
    • 2.03 mm
    • 2.45 mm
    • 2.54 mm
    • 2.62 mm
    • 2.65 mm
    • 2.72 mm
    • 2.79 mm
    • 3 mm
    • 3.15 mm
    • 3.4 mm
    • 3.7 mm
    • 3.81 mm
    • 3.86 mm
    • 4.004 mm
    • 4.1 mm
    • 4.17 mm
    • 4.19 mm
    • 4.29 mm
    • 4.31 mm
    • 4.45 mm
    • 4.47 mm
    • 4.5 mm
    • 4.57 mm
    • 4.572 mm
    • 4.826 mm
    • 4.953 mm
    • 5.08 mm
    • 5.334 mm
    • 5.46 mm
    • 5.715 mm
    • 5.72 mm
    • 6.1 mm
    • 6.35 mm
    • 8.76 mm
Width
    • 11.43 mm
    • 11.5062 mm
    • 14 mm
    • 15 mm
    • 15.24 mm
    • 16.585 mm
    • 16.5862 mm
    • 19.1262 mm
    • 20 mm
    • 22.86 mm
    • 24.13 mm
    • 24.18 mm
    • 24.195 mm
    • 24.23 mm
    • 25.145 mm
    • 26.92 mm
    • 26.924 mm
    • 27.64 mm
    • 27.81 mm
    • 27.9 mm
    • 27.94 mm
    • 28 mm
    • 29.135 mm
    • 29.31 mm
    • 29.464 mm
    • 29.465 mm
    • 3 mm
    • 3.9 mm
    • 30.48 mm
    • 31.2 mm
    • 33.525 mm
    • 34.16 mm
    • 34.545 mm
    • 38.85 mm
    • 4.4 mm
    • 40 mm
    • 42.165 mm
    • 44.704 mm
    • 5.3 mm
    • 5.6 mm
    • 7 mm
    • 7.5 mm
    • 7.52 mm
    • 7.62 mm
    • 8 mm
    • 8.4 mm
Additional Features
    • 10 BIT COEFFICIENT INPUT BUS
    • 24 X 24 CROSSPOINT SWITCH
    • 28 BIT RESULT ACCUMULATOR
    • 2S COMPLEMENT
    • 2S COMPLEMENT OR OFFSET BINARY OUTPUT
    • 3 X 8 BIT DATA INPUT BUS
    • 64 BIT DOUBLE PRECISION FPU; COPROCESSOR AND HOST INDEPENDENT MODES OF OPERATION
    • 8 X 8 BIT INPUT BUS
    • ALSO -5V SUPPLY AVAILABLE
    • ALSO REQUIRES 3.3V SUPPLY
    • ALSO REQUIRES 5V NEGATIVE SUPPLY
    • CAN ALSO OPERATE AT 5V NOMINAL SUPPLY
    • HAS FIVE DATA PORTS
    • IT ALSO REQUIRES 4.5 TO 5.5 VDD SUPPLY
    • MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ
    • MULTIPLEXED OUTPUT; ICC SPECIFIED AT 33MHZ
    • OFFSET BINARY OUTPUT
    • OPERATES AT -3 TO -5.25 IN ECL COMPATIBLE INPUT AND OUTPUT LEVEL
    • PROGRAMMABLE PIPELINE DELAY OF UP TO 7 CLOCK CYCLES
    • SUPPORTS NEWTON-RAPHSON DIVISION; SUPPORTS PIPELINED OR FLOW-THROUGH OPERATION
Boundary Scan
    • NO
    • YES
External Data Bus Width
    • 0
    • 1
    • 10
    • 12
    • 16
    • 19
    • 20
    • 24
    • 32
    • 4
    • 7
    • 8
    • 9
Maximum Clock Frequency
    • 10 MHz
    • 10.53 MHz
    • 100 MHz
    • 106 MHz
    • 11.11 MHz
    • 12.352 MHz
    • 12.5 MHz
    • 125 MHz
    • 13.33 MHz
    • 14.28 MHz
    • 140 MHz
    • 16.67 MHz
    • 16.7 MHz
    • 17.24 MHz
    • 20 MHz
    • 2000 MHz
    • 23.53 MHz
    • 24.576 MHz
    • 25 MHz
    • 25.6 MHz
    • 27 MHz
    • 30 MHz
    • 30.3 MHz
    • 32 MHz
    • 32.26 MHz
    • 33 MHz
    • 33.86 MHz
    • 40 MHz
    • 400 MHz
    • 45 MHz
    • 5 MHz
    • 50 MHz
    • 500 MHz
    • 52 MHz
    • 6.25 MHz
    • 6.67 MHz
    • 66.67 MHz
    • 7.14 MHz
    • 75 MHz
    • 76.9 MHz
    • 8 MHz
    • 80 MHz
    • 9.52 MHz
Maximum Time At Peak Reflow Temperature (s)
    • 10
    • 20
    • 30
    • 40
    • NOT SPECIFIED
Peak Reflow Temperature (C)
    • 220
    • 225
    • 240
    • 245
    • 260
    • NOT SPECIFIED
Length
    • 10.2 mm
    • 10.34 mm
    • 11.43 mm
    • 11.5062 mm
    • 14 mm
    • 15 mm
    • 15.4 mm
    • 16.585 mm
    • 16.5862 mm
    • 17.9 mm
    • 18.3 mm
    • 19.1262 mm
    • 19.4 mm
    • 20 mm
    • 24.13 mm
    • 24.18 mm
    • 24.195 mm
    • 24.23 mm
    • 25.145 mm
    • 26.92 mm
    • 26.924 mm
    • 27.64 mm
    • 27.81 mm
    • 27.9 mm
    • 27.94 mm
    • 28 mm
    • 29.135 mm
    • 29.31 mm
    • 29.464 mm
    • 29.465 mm
    • 3 mm
    • 30.48 mm
    • 31.2 mm
    • 31.64 mm
    • 32.005 mm
    • 32.0675 mm
    • 33.525 mm
    • 34.16 mm
    • 34.545 mm
    • 35.179 mm
    • 36.32 mm
    • 36.703 mm
    • 37.4 mm
    • 38.65 mm
    • 38.85 mm
    • 4.9 mm
    • 40 mm
    • 42.165 mm
    • 44.704 mm
    • 5 mm
    • 50.8 mm
    • 52.07 mm
    • 52.1 mm
    • 6.5 mm
    • 60.96 mm
    • 7 mm
    • 8 mm
    • 8.65 mm
    • 81.28 mm
Technology
    • BICMOS
    • BIPOLAR
    • CMOS
    • ECL
    • MOS
    • NMOS
    • TTL
Nominal Negative Supply Voltage
    • -5.2 V
Maximum Supply Current
    • .2 mA
    • .4 mA
    • .6 mA
    • 100 mA
    • 105 mA
    • 110 mA
    • 120 mA
    • 125 mA
    • 13.5 mA
    • 140 mA
    • 150 mA
    • 160 mA
    • 165 mA
    • 170 mA
    • 182 mA
    • 184 mA
    • 185 mA
    • 200 mA
    • 203 mA
    • 205 mA
    • 21.8 mA
    • 210 mA
    • 250 mA
    • 264 mA
    • 30 mA
    • 300 mA
    • 350 mA
    • 360 mA
    • 363 mA
    • 40 mA
    • 45 mA
    • 500 mA
    • 52 mA
    • 55 mA
    • 572 mA
    • 577 mA
    • 60 mA
    • 65 mA
    • 7 mA
    • 70 mA
    • 75 mA
    • 80 mA
    • 800 mA
    • 825 mA
    • 90 mA
    • 96 mA
    • 97 mA
    • 99 mA
Nominal Supply Voltage
    • 1.8 V
    • 10 V
    • 12 V
    • 14 V
    • 2 V
    • 2.5 V
    • 3 V
    • 3.3 V
    • 5 V
Sub-Category
    • DSP Peripherals
    • Math Processors
    • Serial IO/Communication Controllers
Terminal Pitch
    • .4 mm
    • .5 mm
    • .635 mm
    • .65 mm
    • .8 mm
    • 1 mm
    • 1.27 mm
    • 1.778 mm
    • 2.54 mm
JESD-30 Code
    • R-CDIP-P24
    • R-CDIP-T24
    • R-CDIP-T28
    • R-CDIP-T40
    • R-CDIP-T48
    • R-CDIP-T64
    • R-CPGA-P120
    • R-CQFP-G100
    • R-GDIP-T24
    • R-PDIP-T14
    • R-PDIP-T16
    • R-PDIP-T20
    • R-PDIP-T22
    • R-PDIP-T24
    • R-PDIP-T28
    • R-PDIP-T40
    • R-PDIP-T42
    • R-PDIP-T48
    • R-PDIP-T64
    • R-PDSO-G14
    • R-PDSO-G16
    • R-PDSO-G20
    • R-PDSO-G24
    • R-PDSO-G28
    • R-PDSO-G8
    • R-PDSO-N8
    • R-PQFP-G100
    • R-XDFP-F14
    • R-XDFP-F16
    • R-XDIP-T14
    • R-XDIP-T16
    • R-XDIP-T20
    • R-XDIP-T28
    • R-XDIP-T40
    • R-XDIP-T48
    • R-XDIP-T64
    • S-CPGA-P100
    • S-CPGA-P108
    • S-CPGA-P144
    • S-CPGA-P145
    • S-CPGA-P155
    • S-CPGA-P169
    • S-CPGA-P68
    • S-CPGA-P84
    • S-CQCC-N28
    • S-CQCC-N68
    • S-CQFP-G160
    • S-MQFP-G208
    • S-MQFP-G64
    • S-PBGA-B160
    • S-PDSO-G10
    • S-PPGA-P120
    • S-PPGA-P68
    • S-PQCC-J20
    • S-PQCC-J28
    • S-PQCC-J44
    • S-PQCC-J52
    • S-PQCC-J68
    • S-PQCC-J84
    • S-PQCC-N20
    • S-PQCC-N28
    • S-PQFP-G100
    • S-PQFP-G128
    • S-PQFP-G160
    • S-PQFP-G184
    • S-PQFP-G44
    • S-PQFP-G48
    • S-PQFP-G80
    • S-XPGA-P100
    • S-XPGA-P108
    • S-XPGA-P132
    • S-XPGA-P144
    • S-XPGA-P155
    • S-XPGA-P156
    • S-XPGA-P169
    • S-XPGA-P223
    • S-XPGA-P68
    • S-XPGA-P84
    • S-XQCC-J84
    • S-XQCC-N32
    • S-XQCC-N56
    • S-XQCC-N68
    • S-XQFP-F64
    • S-XQFP-F68
    • S-XQFP-F84
    • X-XUUC-N44
Moisture Sensitivity Level (MSL)
    • 1
    • 2
    • 3
    • 4
Qualification
    • Not Qualified
    • Qualified
Low Power Mode
    • NO
    • YES
JESD-609 Code
    • e0
    • e3
    • e4
    • e6
Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount Maximum Supply Voltage Screening Level Output Data Bus Width Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family Minimum Operating Temperature Terminal Finish Terminal Position Maximum Seated Height Width Additional Features Boundary Scan External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Technology Nominal Negative Supply Voltage Maximum Supply Current Nominal Supply Voltage Sub-Category Terminal Pitch JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Low Power Mode JESD-609 Code

LT5560EDD#PBF

Analog Devices

DSP PERIPHERAL, MIXER

INDUSTRIAL

NO LEAD

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2.7 V

85 Cel

-40 Cel

MATTE TIN

DUAL

.8 mm

3 mm

NO

140 MHz

30

260

3 mm

CMOS

3 V

.5 mm

R-PDSO-N8

1

Not Qualified

YES

e3

LT5560EDD#TRPBF

Analog Devices

DSP PERIPHERAL, MIXER

INDUSTRIAL

NO LEAD

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2.7 V

85 Cel

-40 Cel

MATTE TIN

DUAL

.8 mm

3 mm

NO

140 MHz

30

260

3 mm

CMOS

3 V

.5 mm

R-PDSO-N8

1

Not Qualified

YES

e3

LT5560EDD#TR

Analog Devices

DSP PERIPHERAL, MIXER

INDUSTRIAL

NO LEAD

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2.7 V

85 Cel

-40 Cel

TIN LEAD

DUAL

.8 mm

3 mm

NO

140 MHz

3 mm

CMOS

3 V

.5 mm

R-PDSO-N8

1

Not Qualified

YES

e0

LT5560EDD

Analog Devices

DSP PERIPHERAL, MIXER

INDUSTRIAL

NO LEAD

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2.7 V

85 Cel

-40 Cel

TIN LEAD

DUAL

.8 mm

3 mm

NO

140 MHz

3 mm

CMOS

3 V

.5 mm

R-PDSO-N8

1

Not Qualified

YES

e0

AD9959BCPZ-REEL7

Analog Devices

DSP PERIPHERAL, NUMERIC CONTROLLED OSCILLATOR

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1.89 V

10

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

MATTE TIN

QUAD

1 mm

8 mm

ALSO REQUIRES 3.3V SUPPLY

NO

32

500 MHz

260

8 mm

CMOS

1.8 V

.5 mm

S-XQCC-N56

3

Not Qualified

YES

e3

VSC7173XYI

Maxim Integrated

DSP PERIPHERAL, MULTIPLIER

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

3 V

0 Cel

QUAD

.8 mm

7 mm

NO

7 mm

CMOS

3.3 V

Serial IO/Communication Controllers

.65 mm

S-XQCC-N32

3

Not Qualified

NO

AD9959BCPZ

Analog Devices

DSP PERIPHERAL, NUMERIC CONTROLLED OSCILLATOR

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1.89 V

10

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.71 V

85 Cel

-40 Cel

MATTE TIN

QUAD

1 mm

8 mm

ALSO REQUIRES 3.3V SUPPLY

NO

32

500 MHz

260

8 mm

CMOS

1.8 V

.5 mm

S-XQCC-N56

3

Not Qualified

YES

e3

THCT1010-100FK

Texas Instruments

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

COMMERCIAL

NO LEAD

68

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

35

5

CHIP CARRIER

LCC68,.95SQ

4.5 V

70 Cel

0 Cel

QUAD

2.03 mm

24.13 mm

NO

16

NOT SPECIFIED

NOT SPECIFIED

24.13 mm

CMOS

5 V

DSP Peripherals

1.27 mm

S-CQCC-N68

Not Qualified

NO

5962-9220503M3X

Texas Instruments

DSP PERIPHERAL, PIPELINE REGISTER

MILITARY

NO LEAD

28

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

MIL-STD-883

CHIP CARRIER

4.5 V

125 Cel

-55 Cel

QUAD

NO

CMOS

21.8 mA

5 V

S-CQCC-N28

Not Qualified

NO

5962-9220501M3X

Texas Instruments

DSP PERIPHERAL, PIPELINE REGISTER

MILITARY

NO LEAD

28

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

MIL-STD-883

CHIP CARRIER

4.5 V

125 Cel

-55 Cel

QUAD

NO

CMOS

21.8 mA

5 V

S-CQCC-N28

Not Qualified

NO

THCT1010-140FKE

Texas Instruments

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

INDUSTRIAL

NO LEAD

68

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

35

5

CHIP CARRIER

LCC68,.95SQ

4.5 V

85 Cel

-40 Cel

QUAD

2.03 mm

24.13 mm

NO

16

NOT SPECIFIED

NOT SPECIFIED

24.13 mm

CMOS

5 V

DSP Peripherals

1.27 mm

S-CQCC-N68

Not Qualified

NO

TACT1010-65FKE

Texas Instruments

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

INDUSTRIAL

NO LEAD

68

QCCN

SQUARE

CERAMIC

YES

5

CHIP CARRIER

LCC68,.95SQ

85 Cel

-40 Cel

QUAD

CMOS

5 V

DSP Peripherals

1.27 mm

S-XQCC-N68

Not Qualified

5962-9220505M3A

Texas Instruments

DSP PERIPHERAL, PIPELINE REGISTER

MILITARY

NO LEAD

28

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

MIL-STD-883

CHIP CARRIER

4.5 V

125 Cel

-55 Cel

QUAD

NO

CMOS

21.8 mA

5 V

S-CQCC-N28

Not Qualified

NO

5962-9220503M3A

Texas Instruments

DSP PERIPHERAL, PIPELINE REGISTER

MILITARY

NO LEAD

28

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

MIL-STD-883

CHIP CARRIER

4.5 V

125 Cel

-55 Cel

QUAD

NO

CMOS

21.8 mA

5 V

S-CQCC-N28

Not Qualified

NO

THCT1010-160FKM

Texas Instruments

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

35

5

CHIP CARRIER

LCC68,.95SQ

4.5 V

125 Cel

-55 Cel

QUAD

2.03 mm

24.13 mm

NO

16

NOT SPECIFIED

NOT SPECIFIED

24.13 mm

CMOS

5 V

DSP Peripherals

1.27 mm

S-CQCC-N68

Not Qualified

NO

5962-9220505M3X

Texas Instruments

DSP PERIPHERAL, PIPELINE REGISTER

MILITARY

NO LEAD

28

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

MIL-STD-883

CHIP CARRIER

4.5 V

125 Cel

-55 Cel

QUAD

NO

CMOS

21.8 mA

5 V

S-CQCC-N28

Not Qualified

NO

5962-9220501M3A

Texas Instruments

DSP PERIPHERAL, PIPELINE REGISTER

MILITARY

NO LEAD

28

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

MIL-STD-883

CHIP CARRIER

4.5 V

125 Cel

-55 Cel

QUAD

NO

CMOS

21.8 mA

5 V

S-CQCC-N28

Not Qualified

NO

ADSP1016JE

Analog Devices

DSP PERIPHERAL, MULTIPLIER

COMMERCIAL

NO LEAD

68

QCCN

SQUARE

CERAMIC

YES

5

CHIP CARRIER

LCC68,.95SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

DSP Peripherals

1.27 mm

S-XQCC-N68

Not Qualified

e0

ADSP-1010ASE

Analog Devices

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

35

5

CHIP CARRIER

LCC68,.95SQ

4.5 V

125 Cel

-55 Cel

TIN LEAD

QUAD

2.62 mm

24.195 mm

NO

16

24.195 mm

CMOS

100 mA

5 V

DSP Peripherals

1.27 mm

S-CQCC-N68

Not Qualified

NO

e0

ADSP1016KE

Analog Devices

DSP PERIPHERAL, MULTIPLIER

COMMERCIAL

NO LEAD

68

QCCN

SQUARE

CERAMIC

YES

5

CHIP CARRIER

LCC68,.95SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

DSP Peripherals

1.27 mm

S-XQCC-N68

Not Qualified

e0

ADSP1009SE/883B

Analog Devices

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC

YES

38535Q/M;38534H;883B

5

CHIP CARRIER

LCC68,.95SQ

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

DSP Peripherals

1.27 mm

S-XQCC-N68

Not Qualified

e0

ADSP-1012ATE/883B

Analog Devices

DSP PERIPHERAL, MULTIPLIER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

38535Q/M;38534H;883B

24

5

CHIP CARRIER

LCC68,.95SQ

4.5 V

125 Cel

-55 Cel

TIN LEAD

QUAD

2.62 mm

24.195 mm

NO

12

24.195 mm

CMOS

70 mA

5 V

DSP Peripherals

1.27 mm

S-CQCC-N68

Not Qualified

NO

e0

ADSP1012KE

Analog Devices

DSP PERIPHERAL, MULTIPLIER

COMMERCIAL

NO LEAD

68

QCCN

SQUARE

CERAMIC

YES

5

CHIP CARRIER

LCC68,.95SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

DSP Peripherals

1.27 mm

S-XQCC-N68

Not Qualified

e0

ADSP-1016ATE/+

Analog Devices

DSP PERIPHERAL, MULTIPLIER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC

YES

5

CHIP CARRIER

LCC68,.95SQ

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

DSP Peripherals

1.27 mm

S-XQCC-N68

e0

ADSP-1010ATE/883B

Analog Devices

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

38535Q/M;38534H;883B

35

5

CHIP CARRIER

LCC68,.95SQ

4.5 V

125 Cel

-55 Cel

TIN LEAD

QUAD

2.62 mm

24.195 mm

NO

16

24.195 mm

CMOS

100 mA

5 V

DSP Peripherals

1.27 mm

S-CQCC-N68

Not Qualified

NO

e0

ADSP-1009ATE

Analog Devices

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

27

CHIP CARRIER

4.5 V

125 Cel

-55 Cel

TIN LEAD

QUAD

2.62 mm

24.195 mm

NO

12

24.195 mm

CMOS

75 mA

5 V

1.27 mm

S-CQCC-N68

Not Qualified

NO

e0

ADSP-1012ATE

Analog Devices

DSP PERIPHERAL, MULTIPLIER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC

YES

5

CHIP CARRIER

LCC68,.95SQ

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

DSP Peripherals

1.27 mm

S-XQCC-N68

Not Qualified

e0

ADSP1009KE

Analog Devices

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

COMMERCIAL

NO LEAD

68

QCCN

SQUARE

CERAMIC

YES

5

CHIP CARRIER

LCC68,.95SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

DSP Peripherals

1.27 mm

S-XQCC-N68

Not Qualified

e0

ADSP-1016ATE

Analog Devices

DSP PERIPHERAL, MULTIPLIER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

32

5

CHIP CARRIER

LCC68,.95SQ

4.5 V

125 Cel

-55 Cel

TIN LEAD

QUAD

2.62 mm

24.195 mm

NO

16

24.195 mm

CMOS

55 mA

5 V

DSP Peripherals

1.27 mm

S-CQCC-N68

Not Qualified

NO

e0

ADSP1010TE

Analog Devices

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC

YES

5

CHIP CARRIER

LCC68,.95SQ

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

DSP Peripherals

1.27 mm

S-XQCC-N68

Not Qualified

e0

ADSP-1110ATE/+

Analog Devices

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

MILITARY

NO LEAD

28

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

16

5

CHIP CARRIER

LCC28,.45SQ

4.5 V

125 Cel

-55 Cel

TIN LEAD

QUAD

2.54 mm

11.43 mm

NO

16

11.43 mm

CMOS

80 mA

5 V

DSP Peripherals

1.27 mm

S-CQCC-N28

Not Qualified

NO

e0

ADSP1009SE

Analog Devices

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC

YES

5

CHIP CARRIER

LCC68,.95SQ

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

DSP Peripherals

1.27 mm

S-XQCC-N68

Not Qualified

e0

ADSP-1009ASE/+

Analog Devices

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

27

5

CHIP CARRIER

LCC68,.95SQ

4.5 V

125 Cel

-55 Cel

TIN LEAD

QUAD

2.62 mm

24.195 mm

NO

12

24.195 mm

CMOS

75 mA

5 V

DSP Peripherals

1.27 mm

S-CQCC-N68

Not Qualified

NO

e0

ADSP1010SE

Analog Devices

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC

YES

5

CHIP CARRIER

LCC68,.95SQ

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

DSP Peripherals

1.27 mm

S-XQCC-N68

Not Qualified

e0

ADSP1016SE

Analog Devices

DSP PERIPHERAL, MULTIPLIER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC

YES

5

CHIP CARRIER

LCC68,.95SQ

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

DSP Peripherals

1.27 mm

S-XQCC-N68

Not Qualified

e0

ADSP-1012ASE/883B

Analog Devices

DSP PERIPHERAL, MULTIPLIER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

38535Q/M;38534H;883B

24

5

CHIP CARRIER

LCC68,.95SQ

4.5 V

125 Cel

-55 Cel

TIN LEAD

QUAD

2.62 mm

24.195 mm

NO

12

24.195 mm

CMOS

70 mA

5 V

DSP Peripherals

1.27 mm

S-CQCC-N68

Not Qualified

NO

e0

ADSP1009JE

Analog Devices

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

COMMERCIAL

NO LEAD

68

QCCN

SQUARE

CERAMIC

YES

5

CHIP CARRIER

LCC68,.95SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

DSP Peripherals

1.27 mm

S-XQCC-N68

Not Qualified

e0

ADSP-1010ASE/+

Analog Devices

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

35

5

CHIP CARRIER

LCC68,.95SQ

4.5 V

125 Cel

-55 Cel

TIN LEAD

QUAD

2.62 mm

24.195 mm

NO

16

24.195 mm

CMOS

100 mA

5 V

DSP Peripherals

1.27 mm

S-CQCC-N68

Not Qualified

NO

e0

ADSP-1110ATE/883B

Analog Devices

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

MILITARY

NO LEAD

28

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

38535Q/M;38534H;883B

16

5

CHIP CARRIER

LCC28,.45SQ

4.5 V

125 Cel

-55 Cel

TIN LEAD

QUAD

2.54 mm

11.43 mm

NO

16

11.43 mm

CMOS

80 mA

5 V

DSP Peripherals

1.27 mm

S-CQCC-N28

Not Qualified

NO

e0

ADSP-1009ATE/883B

Analog Devices

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

38535Q/M;38534H;883B

27

5

CHIP CARRIER

LCC68,.95SQ

4.5 V

125 Cel

-55 Cel

TIN LEAD

QUAD

2.62 mm

24.195 mm

NO

12

24.195 mm

CMOS

75 mA

5 V

DSP Peripherals

1.27 mm

S-CQCC-N68

Not Qualified

NO

e0

ADSP-1016ASE/883B

Analog Devices

DSP PERIPHERAL, MULTIPLIER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

38535Q/M;38534H;883B

32

5

CHIP CARRIER

LCC68,.95SQ

4.5 V

125 Cel

-55 Cel

TIN LEAD

QUAD

2.62 mm

24.195 mm

NO

16

24.195 mm

CMOS

55 mA

5 V

DSP Peripherals

1.27 mm

S-CQCC-N68

Not Qualified

NO

e0

ADSP1012TE

Analog Devices

DSP PERIPHERAL, MULTIPLIER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC

YES

5

CHIP CARRIER

LCC68,.95SQ

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

DSP Peripherals

1.27 mm

S-XQCC-N68

Not Qualified

e0

ADSP-1009ASE/883B

Analog Devices

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

38535Q/M;38534H;883B

27

5

CHIP CARRIER

LCC68,.95SQ

4.5 V

125 Cel

-55 Cel

TIN LEAD

QUAD

2.62 mm

24.195 mm

NO

12

24.195 mm

CMOS

75 mA

5 V

DSP Peripherals

1.27 mm

S-CQCC-N68

Not Qualified

NO

e0

ADSP-1016ASE/+

Analog Devices

DSP PERIPHERAL, MULTIPLIER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC

YES

5

CHIP CARRIER

LCC68,.95SQ

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

DSP Peripherals

1.27 mm

S-XQCC-N68

e0

ADSP1009TE/883B

Analog Devices

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC

YES

38535Q/M;38534H;883B

5

CHIP CARRIER

LCC68,.95SQ

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

DSP Peripherals

1.27 mm

S-XQCC-N68

Not Qualified

e0

ADSP-1016ASE

Analog Devices

DSP PERIPHERAL, MULTIPLIER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

32

5

CHIP CARRIER

LCC68,.95SQ

4.5 V

125 Cel

-55 Cel

TIN LEAD

QUAD

2.62 mm

24.195 mm

NO

16

24.195 mm

CMOS

55 mA

5 V

DSP Peripherals

1.27 mm

S-CQCC-N68

Not Qualified

NO

e0

ADSP1016TE

Analog Devices

DSP PERIPHERAL, MULTIPLIER

MILITARY

NO LEAD

68

QCCN

SQUARE

CERAMIC

YES

5

CHIP CARRIER

LCC68,.95SQ

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

DSP Peripherals

1.27 mm

S-XQCC-N68

Not Qualified

e0

ADSP-1110ASE/+

Analog Devices

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

MILITARY

NO LEAD

28

QCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

16

5

CHIP CARRIER

LCC28,.45SQ

4.5 V

125 Cel

-55 Cel

TIN LEAD

QUAD

2.54 mm

11.43 mm

NO

16

11.43 mm

CMOS

80 mA

5 V

DSP Peripherals

1.27 mm

S-CQCC-N28

Not Qualified

NO

e0
DSP Peripherals

DSP (Digital Signal Processing) peripherals are electronic circuits that are designed to be used with DSP processors to perform specific tasks related to signal processing. DSP processors are used in a variety of applications, including audio and video processing, telecommunications, and image processing. DSP peripherals are designed to enhance the functionality of DSP processors by providing additional capabilities such as data acquisition, signal conditioning, and data conversion.

DSP peripherals can include analog-to-digital converters (ADCs), digital-to-analog converters (DACs), amplifiers, filters, and other signal conditioning circuits. These peripherals are used to acquire and condition signals before they are processed by the DSP processor. ADCs are used to convert analog signals, such as audio or video signals, into digital signals that can be processed by the DSP processor. DACs are used to convert digital signals back into analog signals, such as audio or video signals, for output.

DSP peripherals can also include hardware accelerators, which are used to offload computationally intensive tasks from the DSP processor. These hardware accelerators can include digital signal processors, graphics processing units, and other specialized hardware. By offloading these tasks, the DSP processor can focus on other tasks, resulting in improved performance and efficiency.