Samsung Memory Controllers 16

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Boundary Scan	External Data Bus Width	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Banks	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Qualification	Low Power Mode	JESD-609 Code
KS84C32-25CL	Samsung	MEMORY CONTROLLER, DRAM	COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V	22	5	CHIP CARRIER	LDCC84,1.2SQ	4.75 V	70 Cel	0 Cel	TIN LEAD	QUAD	4.57 mm	29.2862 mm	NO	0	29.2862 mm	CMOS	125 mA	5 V	4	Memory Controllers	MC68030; MC68040; 80486	1.27 mm	S-PQCC-J84	Not Qualified	NO	e0
KS84C31-25	Samsung		COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD						CMOS	62.5 mA	5 V		Memory Controllers		1.27 mm	S-PQCC-J68	Not Qualified		e0
KS84C32-33CL	Samsung	MEMORY CONTROLLER, DRAM	COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V	22	5	CHIP CARRIER	LDCC84,1.2SQ	4.75 V	70 Cel	0 Cel	TIN LEAD	QUAD	4.57 mm	29.2862 mm	NO	0	29.2862 mm	CMOS	125 mA	5 V	4	Memory Controllers	MC68030; MC68040; 80486	1.27 mm	S-PQCC-J84	Not Qualified	NO	e0
KS84C32-33	Samsung		COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC84,1.2SQ		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD						CMOS	82.5 mA	5 V		Memory Controllers		1.27 mm	S-PQCC-J84	Not Qualified		e0
KMCEN0000M	Samsung		OTHER	BALL	169	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES			1.8,2.5/3.3	GRID ARRAY, FINE PITCH	BGA169,14X28,20		85 Cel	-25 Cel		BOTTOM										Memory Controllers		.5 mm	R-PBGA-B169	Not Qualified
KS84C31-33CL	Samsung	MEMORY CONTROLLER, DRAM	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V	20	5	CHIP CARRIER	LDCC68,1.0SQ	4.75 V	70 Cel	0 Cel	TIN LEAD	QUAD	4.57 mm	24.2062 mm	NO	0	24.2062 mm	CMOS	125 mA	5 V	4	Memory Controllers	MC68030; MC68040; 80486	1.27 mm	S-PQCC-J68	Not Qualified	NO	e0
KS84C31-25CL	Samsung	MEMORY CONTROLLER, DRAM	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V	20	5	CHIP CARRIER	LDCC68,1.0SQ	4.75 V	70 Cel	0 Cel	TIN LEAD	QUAD	4.57 mm	24.2062 mm	NO	0	24.2062 mm	CMOS	125 mA	5 V	4	Memory Controllers	MC68030; MC68040; 80486	1.27 mm	S-PQCC-J68	Not Qualified	NO	e0
KS84C22-25CL	Samsung		COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC84,1.2SQ		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD						CMOS	62.5 mA	5 V		Memory Controllers		1.27 mm	S-PQCC-J84	Not Qualified		e0
KMCEN0000M-S998000	Samsung		OTHER	BALL	169	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES			1.8,2.5/3.3	GRID ARRAY, FINE PITCH	BGA169,14X28,20		85 Cel	-25 Cel		BOTTOM										Memory Controllers		.5 mm	R-PBGA-B169	Not Qualified
KS84EC30-40CL	Samsung	MEMORY CONTROLLER, DRAM	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V	20	5	CHIP CARRIER	LDCC68,1.0SQ	4.75 V	70 Cel	0 Cel	TIN LEAD	QUAD	4.57 mm	24.2062 mm	NO	0	24.2062 mm	CMOS	125 mA	5 V	4	Memory Controllers	MC68EC030; MC68040; 80486	1.27 mm	S-PQCC-J68	Not Qualified	NO	e0
KS84C21-25CL	Samsung		COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD						CMOS	62.5 mA	5 V		Memory Controllers		1.27 mm	S-PQCC-J68	Not Qualified		e0
KS84C32-25	Samsung		COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC84,1.2SQ		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD						CMOS	62.5 mA	5 V		Memory Controllers		1.27 mm	S-PQCC-J84	Not Qualified		e0
KS84C31-33	Samsung		COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD						CMOS	82.5 mA	5 V		Memory Controllers		1.27 mm	S-PQCC-J68	Not Qualified		e0
KS84C32-40CL	Samsung	MEMORY CONTROLLER, DRAM	COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V	22	5	CHIP CARRIER	LDCC84,1.2SQ	4.75 V	70 Cel	0 Cel	TIN LEAD	QUAD	4.57 mm	29.2862 mm	NO	0	29.2862 mm	CMOS	125 mA	5 V	4	Memory Controllers	MC68030; MC68040; 80486	1.27 mm	S-PQCC-J84	Not Qualified	NO	e0
KS84C31-40CL	Samsung	MEMORY CONTROLLER, DRAM	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V	20	5	CHIP CARRIER	LDCC68,1.0SQ	4.75 V	70 Cel	0 Cel	TIN LEAD	QUAD	4.57 mm	24.2062 mm	NO	0	24.2062 mm	CMOS	125 mA	5 V	4	Memory Controllers	MC68030; MC68040; 80486	1.27 mm	S-PQCC-J68	Not Qualified	NO	e0
S3C49F9XX-TX	Samsung		COMMERCIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES			3.3/5	FLATPACK	TQFP100,.63SQ		70 Cel	0 Cel		QUAD						CMOS	70 mA			Memory Controllers		.5 mm	S-PQFP-G100	Not Qualified

Memory Controllers

Memory controllers are specialized electronic circuits that manage the flow of data between a CPU and memory modules. These circuits are typically found on motherboards or embedded systems and are responsible for controlling the timing and data transfer rates between the CPU and memory modules.

Memory controllers are designed to work with specific types of memory modules, such as dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), or double data rate (DDR) memory. They are responsible for configuring the memory modules and managing the transfer of data between the CPU and memory.

Memory controllers use a variety of techniques to optimize the performance of memory access, including prefetching, pipelining, and cache management. Prefetching involves retrieving data from memory before it is requested by the CPU, while pipelining involves overlapping memory operations to reduce the latency of memory access. Cache management involves using on-chip cache memory to store frequently accessed data, reducing the need to access main memory.

Memory controllers are essential components of modern computer systems, as they play a critical role in determining the overall performance of the system. They are responsible for managing the flow of data between the CPU and memory modules, optimizing memory access, and ensuring the reliability and stability of the system.