Memory Controllers

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Boundary Scan	External Data Bus Width	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Banks	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	JESD-609 Code
S25FS128SDSMFM100	Infineon Technologies
S25FS128SDSMFB100	Infineon Technologies
S25FS128SDSMFM101	Infineon Technologies
S25FS128SDSMFM103	Infineon Technologies
S25FS128SDSMFA103	Infineon Technologies
S25FS128SAGMFM1D3	Infineon Technologies
S25FS128SDSMFA100	Infineon Technologies
S25FS128SDSMFA101	Infineon Technologies
S25FS128SAGMFM1D1	Infineon Technologies
TC86R4021F	Toshiba	MEMORY CONTROLLER, CACHE		GULL WING	16	QFP	SQUARE	PLASTIC/EPOXY	YES				FLATPACK						QUAD	4.45 mm	28 mm	NO	0		28 mm	CMOS		3.3 V				.65 mm	S-PQFP-G16		Not Qualified	NO
TC86R4032F	Toshiba	MEMORY CONTROLLER, CACHE																				NO	0			CMOS		3.3 V							Not Qualified	NO
TC6387XB	Toshiba		COMMERCIAL	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES			3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,32		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	BOTTOM							CMOS		3.3 V		Memory Controllers		.8 mm	S-PBGA-B64		Not Qualified		e0
TC86R4022F	Toshiba	MEMORY CONTROLLER, CACHE		GULL WING	16	QFP	SQUARE	PLASTIC/EPOXY	YES				FLATPACK						QUAD	4.45 mm	28 mm	NO	0		28 mm	CMOS		3.3 V				.65 mm	S-PQFP-G16		Not Qualified	NO
TC6371AF	Toshiba		COMMERCIAL	GULL WING	128	QFP	SQUARE	PLASTIC/EPOXY	YES			3.3	FLATPACK	QFP128,.64SQ,16		70 Cel	0 Cel		QUAD							CMOS	75 mA	3.3 V		Memory Controllers		.4 mm	S-PQFP-G128		Not Qualified
80KSBR200BRI	Renesas Electronics		INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES			1.2,1.5,2.5/3.3	GRID ARRAY	BGA484,22X22,40		85 Cel	-40 Cel		BOTTOM							CMOS				Memory Controllers		1 mm	S-PBGA-B484		Not Qualified
AMB0480A5BJG8	Renesas Electronics	MEMORY CONTROLLER, DRAM
AMB0480A5BJG	Renesas Electronics	MEMORY CONTROLLER, DRAM
UPD71641R	Renesas Electronics			PIN/PEG	132	PGA		CERAMIC	NO				GRID ARRAY	PGA132(UNSPEC)				Tin/Lead (Sn/Pb)	PERPENDICULAR							CMOS				Memory Controllers					Not Qualified		e0
AMB0480A5HJG	Renesas Electronics	MEMORY CONTROLLER, DRAM
AMB0480A5HJG8	Renesas Electronics	MEMORY CONTROLLER, DRAM
UPD31442	Renesas Electronics			GULL WING	240	QFP	SQUARE	PLASTIC/EPOXY	YES			3.3	FLATPACK	QFP240,1.3SQ,20				Tin/Lead (Sn/Pb)	QUAD									3.3 V		Memory Controllers		.5 mm	S-PQFP-G240		Not Qualified		e0
UPD71641R-25	Renesas Electronics			PIN/PEG	132	PGA		CERAMIC	NO				GRID ARRAY	PGA132(UNSPEC)				Tin/Lead (Sn/Pb)	PERPENDICULAR							CMOS				Memory Controllers					Not Qualified		e0
AMB0480A5RJ	Renesas Electronics	MEMORY CONTROLLER, DRAM																TIN SILVER COPPER						245										4			e1
AMB0480A5RH8	Renesas Electronics	MEMORY CONTROLLER, DRAM
AMB0480A5RH	Renesas Electronics	MEMORY CONTROLLER, DRAM
AMB0480A5RJ8	Renesas Electronics	MEMORY CONTROLLER, DRAM																TIN SILVER COPPER						245										4			e1
L64850GC-33	Broadcom		COMMERCIAL	PIN/PEG	223	PGA	SQUARE	CERAMIC	NO			5	GRID ARRAY	PGA223,18X18		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	PERPENDICULAR							CMOS	460 mA	5 V		Memory Controllers		2.54 mm	S-XPGA-P223		Not Qualified		e0
L64850GC-25	Broadcom		COMMERCIAL	PIN/PEG	223	PGA	SQUARE	CERAMIC	NO			5	GRID ARRAY	PGA223,18X18		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	PERPENDICULAR							CMOS	350 mA	5 V		Memory Controllers		2.54 mm	S-XPGA-P223		Not Qualified		e0
L64850GC-40	Broadcom		COMMERCIAL	PIN/PEG	223	PGA	SQUARE	CERAMIC	NO			5	GRID ARRAY	PGA223,18X18		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	PERPENDICULAR							CMOS	560 mA	5 V		Memory Controllers		2.54 mm	S-XPGA-P223		Not Qualified		e0
KS84C32-25CL	Samsung	MEMORY CONTROLLER, DRAM	COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V	22	5	CHIP CARRIER	LDCC84,1.2SQ	4.75 V	70 Cel	0 Cel	TIN LEAD	QUAD	4.57 mm	29.2862 mm	NO	0		29.2862 mm	CMOS	125 mA	5 V	4	Memory Controllers	MC68030; MC68040; 80486	1.27 mm	S-PQCC-J84		Not Qualified	NO	e0
KS84C31-25	Samsung		COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD							CMOS	62.5 mA	5 V		Memory Controllers		1.27 mm	S-PQCC-J68		Not Qualified		e0
KS84C32-33CL	Samsung	MEMORY CONTROLLER, DRAM	COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V	22	5	CHIP CARRIER	LDCC84,1.2SQ	4.75 V	70 Cel	0 Cel	TIN LEAD	QUAD	4.57 mm	29.2862 mm	NO	0		29.2862 mm	CMOS	125 mA	5 V	4	Memory Controllers	MC68030; MC68040; 80486	1.27 mm	S-PQCC-J84		Not Qualified	NO	e0
KS84C32-33	Samsung		COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC84,1.2SQ		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD							CMOS	82.5 mA	5 V		Memory Controllers		1.27 mm	S-PQCC-J84		Not Qualified		e0
KMCEN0000M	Samsung		OTHER	BALL	169	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES			1.8,2.5/3.3	GRID ARRAY, FINE PITCH	BGA169,14X28,20		85 Cel	-25 Cel		BOTTOM											Memory Controllers		.5 mm	R-PBGA-B169		Not Qualified
KS84C31-33CL	Samsung	MEMORY CONTROLLER, DRAM	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V	20	5	CHIP CARRIER	LDCC68,1.0SQ	4.75 V	70 Cel	0 Cel	TIN LEAD	QUAD	4.57 mm	24.2062 mm	NO	0		24.2062 mm	CMOS	125 mA	5 V	4	Memory Controllers	MC68030; MC68040; 80486	1.27 mm	S-PQCC-J68		Not Qualified	NO	e0
KS84C31-25CL	Samsung	MEMORY CONTROLLER, DRAM	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V	20	5	CHIP CARRIER	LDCC68,1.0SQ	4.75 V	70 Cel	0 Cel	TIN LEAD	QUAD	4.57 mm	24.2062 mm	NO	0		24.2062 mm	CMOS	125 mA	5 V	4	Memory Controllers	MC68030; MC68040; 80486	1.27 mm	S-PQCC-J68		Not Qualified	NO	e0
KS84C22-25CL	Samsung		COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC84,1.2SQ		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD							CMOS	62.5 mA	5 V		Memory Controllers		1.27 mm	S-PQCC-J84		Not Qualified		e0
KMCEN0000M-S998000	Samsung		OTHER	BALL	169	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES			1.8,2.5/3.3	GRID ARRAY, FINE PITCH	BGA169,14X28,20		85 Cel	-25 Cel		BOTTOM											Memory Controllers		.5 mm	R-PBGA-B169		Not Qualified
KS84EC30-40CL	Samsung	MEMORY CONTROLLER, DRAM	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V	20	5	CHIP CARRIER	LDCC68,1.0SQ	4.75 V	70 Cel	0 Cel	TIN LEAD	QUAD	4.57 mm	24.2062 mm	NO	0		24.2062 mm	CMOS	125 mA	5 V	4	Memory Controllers	MC68EC030; MC68040; 80486	1.27 mm	S-PQCC-J68		Not Qualified	NO	e0
KS84C21-25CL	Samsung		COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD							CMOS	62.5 mA	5 V		Memory Controllers		1.27 mm	S-PQCC-J68		Not Qualified		e0
KS84C32-25	Samsung		COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC84,1.2SQ		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD							CMOS	62.5 mA	5 V		Memory Controllers		1.27 mm	S-PQCC-J84		Not Qualified		e0
KS84C31-33	Samsung		COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES			5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD							CMOS	82.5 mA	5 V		Memory Controllers		1.27 mm	S-PQCC-J68		Not Qualified		e0
KS84C32-40CL	Samsung	MEMORY CONTROLLER, DRAM	COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V	22	5	CHIP CARRIER	LDCC84,1.2SQ	4.75 V	70 Cel	0 Cel	TIN LEAD	QUAD	4.57 mm	29.2862 mm	NO	0		29.2862 mm	CMOS	125 mA	5 V	4	Memory Controllers	MC68030; MC68040; 80486	1.27 mm	S-PQCC-J84		Not Qualified	NO	e0
KS84C31-40CL	Samsung	MEMORY CONTROLLER, DRAM	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V	20	5	CHIP CARRIER	LDCC68,1.0SQ	4.75 V	70 Cel	0 Cel	TIN LEAD	QUAD	4.57 mm	24.2062 mm	NO	0		24.2062 mm	CMOS	125 mA	5 V	4	Memory Controllers	MC68030; MC68040; 80486	1.27 mm	S-PQCC-J68		Not Qualified	NO	e0
S3C49F9XX-TX	Samsung		COMMERCIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES			3.3/5	FLATPACK	TQFP100,.63SQ		70 Cel	0 Cel		QUAD							CMOS	70 mA			Memory Controllers		.5 mm	S-PQFP-G100		Not Qualified

Memory Controllers

Memory controllers are specialized electronic circuits that manage the flow of data between a CPU and memory modules. These circuits are typically found on motherboards or embedded systems and are responsible for controlling the timing and data transfer rates between the CPU and memory modules.

Memory controllers are designed to work with specific types of memory modules, such as dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), or double data rate (DDR) memory. They are responsible for configuring the memory modules and managing the transfer of data between the CPU and memory.

Memory controllers use a variety of techniques to optimize the performance of memory access, including prefetching, pipelining, and cache management. Prefetching involves retrieving data from memory before it is requested by the CPU, while pipelining involves overlapping memory operations to reduce the latency of memory access. Cache management involves using on-chip cache memory to store frequently accessed data, reducing the need to access main memory.

Memory controllers are essential components of modern computer systems, as they play a critical role in determining the overall performance of the system. They are responsible for managing the flow of data between the CPU and memory modules, optimizing memory access, and ensuring the reliability and stability of the system.