HVBCC Microcontrollers 13

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	DAC Channels	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Digital To Analog Convertors	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	Maximum Clock Frequency	Length	No. of Timers	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	No. of Serial I/Os	Connectivity	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Speed	Low Power Mode	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
PIC32MX270F256D-50I/TL	Microchip Technology	MICROCONTROLLER, RISC	INDUSTRIAL	BUTT	44	HVBCC	SQUARE	UNSPECIFIED		YES	3.6 V		TS 16949	NO	32	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.3 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	YES	BOTTOM	YES		1 mm	262144		6 mm	0	THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY		BOR, COMPARATOR(3), DMA(6), POR, PWM, RTC, TIMER(5), USB, WDT	50 MHz	6 mm		65536	CMOS	13-Ch 10-Bit		3.3 V	YES		I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)	FLASH	.5 mm		S-XBCC-B44	50 rpm		e4	8	33
PIC32MX270F256D-I/TL	Microchip Technology	MICROCONTROLLER, RISC	INDUSTRIAL	BUTT	44	HVBCC	SQUARE	UNSPECIFIED		YES	3.6 V		TS 16949	NO	32	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.3 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	YES	BOTTOM	YES		1 mm	262144		6 mm	0	THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY		BOR, COMPARATOR(3), DMA(6), POR, PWM, RTC, TIMER(5), USB, WDT	50 MHz	6 mm		65536	CMOS	13-Ch 10-Bit		3.3 V	YES		I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)	FLASH	.5 mm		S-XBCC-B44	40 rpm		e4	8	33
PIC32MX170F256D-I/TL	Microchip Technology	MICROCONTROLLER, RISC	INDUSTRIAL	BUTT	44	HVBCC	SQUARE	UNSPECIFIED		YES	3.6 V		TS 16949	NO	32	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.3 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	YES	BOTTOM	YES		1 mm	262144		6 mm	0	THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY		BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT	50 MHz	6 mm		65536	CMOS	13-Ch 10-Bit		3.3 V	YES		I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)	FLASH	.5 mm		S-XBCC-B44	40 rpm		e4	8	35
PIC32MX170F256D-V/TL	Microchip Technology	MICROCONTROLLER, RISC	INDUSTRIAL	BUTT	44	HVBCC	SQUARE	UNSPECIFIED		YES	3.6 V		TS 16949	NO	32	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.3 V	105 Cel			-40 Cel	NICKEL PALLADIUM GOLD	YES	BOTTOM	YES		1 mm	262144		6 mm	0	AEC-Q100 PLANNED, THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY		BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT	40 MHz	6 mm		65536	CMOS	13-Ch 10-Bit		3.3 V	YES		I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)	FLASH	.5 mm		S-XBCC-B44	40 rpm		e4	8	35
ATTINY1617-MBT-VAO	Microchip Technology	MICROCONTROLLER, RISC	INDUSTRIAL	NO LEAD	24	HVBCC	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8	AEC-Q100; TS 16949	YES	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	2.7 V	105 Cel	AVR RISC	21	-40 Cel		NO	QUAD	NO	1-Ch 8-Bit	.9 mm	8192	2048	4 mm	256	OPERATES AT 2.7V MIN AT 8MHZ	NO	BOD, COMPARATOR(3), POR, RTC, TIMER(5), WDT	16 MHz	4 mm	5	2048	CMOS	23-Ch 10-Bit	10 mA	3 V	YES	1	I2C, SPI, USART	FLASH	.5 mm	FIXED POINT	S-PQCC-N24	16 rpm	YES		16	21
ATTINY1617-MZT-VAO	Microchip Technology	MICROCONTROLLER, RISC	AUTOMOTIVE	NO LEAD	24	HVBCC	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8	AEC-Q100; TS 16949	YES	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	2.7 V	125 Cel	AVR RISC	21	-40 Cel		NO	QUAD	NO	1-Ch 8-Bit	.9 mm	8192	2048	4 mm	256	OPERATES AT 2.7V MIN AT 8MHZ	NO	BOD, COMPARATOR(3), POR, RTC, TIMER(5), WDT	16 MHz	4 mm	5	2048	CMOS	23-Ch 10-Bit	10 mA	3 V	YES	1	I2C, SPI, USART	FLASH	.5 mm	FIXED POINT	S-PQCC-N24	16 rpm	YES		16	21
PIC32MX270F256D-V/TL	Microchip Technology	MICROCONTROLLER, RISC	INDUSTRIAL	BUTT	44	HVBCC	SQUARE	UNSPECIFIED		YES	3.6 V		TS 16949	NO	32	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.3 V	105 Cel			-40 Cel	NICKEL PALLADIUM GOLD	YES	BOTTOM	YES		1 mm	262144		6 mm	0	AEC-Q100 PLANNED, THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY		BOR, COMPARATOR(3), DMA(6), POR, PWM, RTC, TIMER(5), USB, WDT	40 MHz	6 mm		65536	CMOS	13-Ch 10-Bit		3.3 V	YES		I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)	FLASH	.5 mm		S-XBCC-B44	40 rpm		e4	8	33
PIC32MX270F256DT-50I/TL	Microchip Technology	MICROCONTROLLER, RISC	INDUSTRIAL	BUTT	44	HVBCC	SQUARE	UNSPECIFIED		YES	3.6 V		TS 16949	NO	32	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.3 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	YES	BOTTOM	YES		1 mm	262144		6 mm	0	THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY		BOR, COMPARATOR(3), DMA(6), POR, PWM, RTC, TIMER(5), USB, WDT	50 MHz	6 mm		65536	CMOS	13-Ch 10-Bit		3.3 V	YES		I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)	FLASH	.5 mm		S-XBCC-B44	50 rpm		e4	8	33
PIC32MX270F256DT-I/TL	Microchip Technology	MICROCONTROLLER, RISC	INDUSTRIAL	BUTT	44	HVBCC	SQUARE	UNSPECIFIED		YES	3.6 V		TS 16949	NO	32	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.3 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	YES	BOTTOM	YES		1 mm	262144		6 mm	0	THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY		BOR, COMPARATOR(3), DMA(6), POR, PWM, RTC, TIMER(5), USB, WDT	50 MHz	6 mm		65536	CMOS	13-Ch 10-Bit		3.3 V	YES		I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)	FLASH	.5 mm		S-XBCC-B44	40 rpm		e4	8	33
PIC32MX270F256DT-V/TL	Microchip Technology	MICROCONTROLLER, RISC	INDUSTRIAL	BUTT	44	HVBCC	SQUARE	UNSPECIFIED		YES	3.6 V		TS 16949	NO	32	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.3 V	105 Cel			-40 Cel	NICKEL PALLADIUM GOLD	YES	BOTTOM	YES		1 mm	262144		6 mm	0	AEC-Q100 PLANNED, THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY		BOR, COMPARATOR(3), DMA(6), POR, PWM, RTC, TIMER(5), USB, WDT	40 MHz	6 mm		65536	CMOS	13-Ch 10-Bit		3.3 V	YES		I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)	FLASH	.5 mm		S-XBCC-B44	40 rpm		e4	8	33
COP8SCE9HLQ9	Texas Instruments	MICROCONTROLLER	COMMERCIAL	BUTT	44	HVBCC	SQUARE	UNSPECIFIED		YES	5.5 V			NO	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.7 V	70 Cel			0 Cel		NO	BOTTOM	NO		.8 mm	8192		7 mm	0			BOR, POR, TIMER(3), WDT	10 MHz	7 mm		256	CMOS			4.5 V	YES		SPI, USART(2)	FLASH	.5 mm		S-XBCC-B44	20 rpm			8	37
COP8SBE9HLQ7	Texas Instruments	MICROCONTROLLER	AUTOMOTIVE	BUTT	44	HVBCC	SQUARE	UNSPECIFIED		YES	5.5 V			NO	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	125 Cel			-40 Cel		NO	BOTTOM	NO		.8 mm	8192		7 mm	0			BOR, POR, TIMER(3), WDT	3.33 MHz	7 mm		256	CMOS			5 V	YES		SPI, USART(2)	FLASH	.5 mm		S-XBCC-B44	6.67 rpm			8	37
COP8SCE9HLQ7	Texas Instruments	MICROCONTROLLER	AUTOMOTIVE	BUTT	44	HVBCC	SQUARE	UNSPECIFIED		YES	5.5 V			NO	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	125 Cel			-40 Cel		NO	BOTTOM	NO		.8 mm	8192		7 mm	0			BOR, POR, TIMER(3), WDT	10 MHz	7 mm		256	CMOS			5 V	YES		SPI, USART(2)	FLASH	.5 mm		S-XBCC-B44	20 rpm			8	37

Microcontrollers

A microcontroller is a type of integrated circuit (IC) that is designed to control a specific task or set of tasks within a larger system. Unlike a microprocessor, which is designed to be a general-purpose computing device, a microcontroller is optimized for embedded applications that require real-time control and processing.

Microcontrollers typically contain a processor core, memory, input/output (I/O) ports, and various peripheral devices, all on a single chip. The processor core is usually a low-power, low-speed version of a microprocessor, such as an 8-bit or 16-bit processor. The memory on a microcontroller includes both volatile and non-volatile memory, such as random-access memory (RAM) and flash memory, respectively. The I/O ports are used to interface with external devices such as sensors, switches, and displays.

Microcontrollers are used in a wide range of applications, including automotive systems, medical devices, consumer electronics, and industrial automation. They are particularly well-suited for applications that require real-time control and processing, such as motor control, temperature sensing, and data acquisition.

One of the key advantages of microcontrollers is their low cost and small size. Because all of the necessary components are integrated onto a single chip, microcontrollers are much smaller and less expensive than other types of computing devices. This makes them ideal for use in small, battery-powered devices such as handheld calculators and remote controls.