Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
81 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA81,9X9,32 |
1.71 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
1.52 mm |
524288 |
8 mm |
0 |
50 MHz |
8 mm |
131072 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
.65 mm |
S-PBGA-B81 |
Not Qualified |
100 rpm |
56 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.19 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.51 mm |
2621440 |
14 mm |
96K |
ADC CH(INT AND EXT) BASED ON PACKAGE |
DMA(32), POR, PWM(12), TIMER(10), WDT |
0 |
40 MHz |
14 mm |
393216 |
CMOS |
16-Ch 12-Bit(4) |
1.25 V |
YES |
CAN(3), ETHERNET, SPI(4) |
FLASH |
.8 mm |
S-PBGA-B257 |
150 rpm |
8 |
127 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.19 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.51 mm |
2621440 |
14 mm |
96K |
ADC CH(INT AND EXT) BASED ON PACKAGE |
DMA(32), POR, PWM(12), TIMER(10), WDT |
0 |
40 MHz |
14 mm |
393216 |
CMOS |
16-Ch 12-Bit(4) |
1.25 V |
YES |
CAN(3), ETHERNET, SPI(4) |
FLASH |
.8 mm |
S-PBGA-B257 |
200 rpm |
8 |
127 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
28 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.71 V |
85 Cel |
-40 Cel |
NO |
BOTTOM |
YES |
1.7 mm |
17 mm |
32 |
266 MHz |
17 mm |
CMOS |
1.8 V |
YES |
FLASH |
.8 mm |
S-PBGA-B324 |
Not Qualified |
133 rpm |
64 |
||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.19 V |
135 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.51 mm |
2621440 |
14 mm |
96K |
ADC CH(INT AND EXT) BASED ON PACKAGE |
DMA(32), POR, PWM(12), TIMER(10), WDT |
0 |
40 MHz |
14 mm |
393216 |
CMOS |
16-Ch 12-Bit(4) |
1.25 V |
YES |
CAN(3), ETHERNET, SPI(4) |
FLASH |
.8 mm |
S-PBGA-B257 |
200 rpm |
8 |
127 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.19 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.51 mm |
2621440 |
14 mm |
96K |
ADC CH(INT AND EXT) BASED ON PACKAGE |
DMA(32), POR, PWM(12), TIMER(10), WDT |
0 |
40 MHz |
14 mm |
393216 |
CMOS |
16-Ch 12-Bit(4) |
1.25 V |
YES |
CAN(3), SPI(4) |
FLASH |
.8 mm |
S-PBGA-B257 |
180 rpm |
8 |
127 |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
208 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.98 V |
24 |
NO |
32 |
1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA208,16X16,32 |
1.62 V |
85 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.7 mm |
14 mm |
ALSO REQUIRES 3.3 V I/O SUPPLY |
32 |
20 MHz |
14 mm |
CMOS |
1.8 V |
YES |
Other Microprocessor ICs |
FLASH |
.8 mm |
S-PBGA-B208 |
Not Qualified |
76.205 rpm |
108 |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
121 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA121,11X11,25 |
1.71 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
1.52 mm |
524288 |
8 mm |
0 |
32 MHz |
8 mm |
131072 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
.65 mm |
S-PBGA-B121 |
Not Qualified |
100 rpm |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.19 V |
135 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.51 mm |
2621440 |
14 mm |
96K |
ADC CH(INT AND EXT) BASED ON PACKAGE |
DMA(32), POR, PWM(12), TIMER(10), WDT |
0 |
40 MHz |
14 mm |
393216 |
CMOS |
16-Ch 12-Bit(4) |
1.25 V |
YES |
CAN(3), SPI(4) |
FLASH |
.8 mm |
S-PBGA-B257 |
200 rpm |
8 |
127 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.19 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.51 mm |
2621440 |
14 mm |
96K |
ADC CH(INT AND EXT) BASED ON PACKAGE |
DMA(32), POR, PWM(12), TIMER(10), WDT |
0 |
40 MHz |
14 mm |
393216 |
CMOS |
16-Ch 12-Bit(4) |
1.25 V |
YES |
CAN(3), ETHERNET, SPI(4) |
FLASH |
.8 mm |
S-PBGA-B257 |
150 rpm |
8 |
127 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
121 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.71 V |
105 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.52 mm |
8 mm |
0 |
32 MHz |
8 mm |
CMOS |
3.3 V |
YES |
FLASH |
.65 mm |
S-PBGA-B121 |
100 rpm |
81 |
|||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
64 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.71 V |
105 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.23 mm |
5 mm |
DIFFERENTIAL ANALOG CHANNEL INPUTS: 4-CH 16-BIT |
0 |
48 MHz |
5 mm |
CMOS |
3 V |
YES |
FLASH |
.5 mm |
S-PBGA-B64 |
48 rpm |
54 |
||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
121 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.71 V |
105 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.52 mm |
8 mm |
0 |
32 MHz |
8 mm |
CMOS |
3.3 V |
YES |
FLASH |
.65 mm |
S-PBGA-B121 |
100 rpm |
81 |
|||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.19 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.51 mm |
2621440 |
14 mm |
96K |
ADC CH(INT AND EXT) BASED ON PACKAGE |
DMA(32), POR, PWM(12), TIMER(10), WDT |
0 |
40 MHz |
14 mm |
393216 |
CMOS |
16-Ch 12-Bit(4) |
1.25 V |
YES |
CAN(3), SPI(4) |
FLASH |
.8 mm |
S-PBGA-B257 |
180 rpm |
8 |
127 |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
208 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.98 V |
24 |
NO |
32 |
1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA208,16X16,32 |
1.62 V |
85 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.7 mm |
14 mm |
ALSO REQUIRES 3.3 V I/O SUPPLY |
32 |
20 MHz |
30 |
260 |
14 mm |
CMOS |
1.8 V |
YES |
Other Microprocessor ICs |
FLASH |
.8 mm |
S-PBGA-B208 |
3 |
Not Qualified |
76.205 rpm |
108 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
81 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA81,9X9,32 |
1.71 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
1.52 mm |
524288 |
8 mm |
0 |
50 MHz |
8 mm |
131072 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
.65 mm |
S-PBGA-B81 |
Not Qualified |
100 rpm |
56 |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
COMMERCIAL |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
28 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.71 V |
70 Cel |
0 Cel |
NO |
BOTTOM |
YES |
1.7 mm |
14 mm |
ALSO REQUIRES 3.3 V I/O SUPPLY |
32 |
20 MHz |
14 mm |
CMOS |
1.8 V |
YES |
FLASH |
.8 mm |
S-PBGA-B256 |
3 |
Not Qualified |
250 rpm |
60 |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.19 V |
135 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.51 mm |
2621440 |
14 mm |
96K |
ADC CH(INT AND EXT) BASED ON PACKAGE |
DMA(32), POR, PWM(12), TIMER(10), WDT |
0 |
40 MHz |
14 mm |
393216 |
CMOS |
16-Ch 12-Bit(4) |
1.25 V |
YES |
CAN(3), ETHERNET, SPI(4) |
FLASH |
.8 mm |
S-PBGA-B257 |
200 rpm |
8 |
127 |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
121 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA121,11X11,25 |
1.71 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
1.52 mm |
262144 |
8 mm |
0 |
32 MHz |
8 mm |
131072 |
CMOS |
87 mA |
3.3 V |
YES |
Microcontrollers |
FLASH |
.65 mm |
S-PBGA-B121 |
Not Qualified |
100 rpm |
81 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.19 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.51 mm |
2621440 |
14 mm |
96K |
ADC CH(INT AND EXT) BASED ON PACKAGE |
DMA(32), POR, PWM(12), TIMER(10), WDT |
0 |
40 MHz |
14 mm |
393216 |
CMOS |
16-Ch 12-Bit(4) |
1.25 V |
YES |
CAN(3), SPI(4) |
FLASH |
.8 mm |
S-PBGA-B257 |
200 rpm |
8 |
127 |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER |
INDUSTRIAL |
BALL |
104 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
2/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA104,11X11,32 |
1.8 V |
105 Cel |
COLDFIRE |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
NO |
1.52 mm |
262144 |
10 mm |
0 |
16 MHz |
40 |
260 |
10 mm |
32768 |
CMOS |
48 mA |
3 V |
YES |
Microcontrollers |
FLASH |
.8 mm |
S-PBGA-B104 |
3 |
Not Qualified |
50.33 rpm |
e1 |
72 |
|||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
257 |
LFBGA |
SQUARE |
YES |
1.32 V |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.19 V |
YES |
BOTTOM |
YES |
14 mm |
0 |
40 MHz |
14 mm |
CMOS |
1.25 V |
YES |
.5 mm |
180 rpm |
||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.19 V |
135 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.51 mm |
2621440 |
14 mm |
96K |
ADC CH(INT AND EXT) BASED ON PACKAGE |
DMA(32), POR, PWM(12), TIMER(10), WDT |
0 |
40 MHz |
14 mm |
393216 |
CMOS |
16-Ch 12-Bit(4) |
1.25 V |
YES |
CAN(3), ETHERNET, SPI(4) |
FLASH |
.8 mm |
S-PBGA-B257 |
150 rpm |
8 |
127 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
169 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.71 V |
105 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.28 mm |
9 mm |
ALSO HAVING 0.25MB FLEXMEMORY |
0 |
50 MHz |
9 mm |
CMOS |
3 V |
YES |
FLASH |
.65 mm |
S-PBGA-B169 |
180 rpm |
16 |
||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
0 |
YES |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,12X12,20 |
1.71 V |
105 Cel |
CORTEX-M4F |
-40 Cel |
YES |
BOTTOM |
YES |
1-Ch 12-Bit(2) |
1.7 mm |
2097152 |
13 mm |
ANALOG COMPARATOR HAS 6-BIT DAC |
YES |
ANALOG COMPARATOR(4), CRC, DMA, LVD, POR, PWM(4), RTC, TIMER(11), WDT |
0 |
32 MHz |
13 mm |
11 |
262144 |
CMOS |
6-Ch 16-Bit, 7-Ch 16-Bit |
115.08 mA |
3.3 V |
YES |
2 |
CAN(2), ETHERNET, I2C(4), I2S, LPUART, SPI(3), UART(5), USB(2) |
FLASH |
.5 mm |
FLOATING POINT |
S-PBGA-B144 |
180 rpm |
YES |
8 |
100 |
|||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
81 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA81,9X9,32 |
1.71 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
1.3 mm |
262144 |
8 mm |
0 |
50 MHz |
8 mm |
131072 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
.65 mm |
S-PBGA-B81 |
Not Qualified |
100 rpm |
56 |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
208 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
32 |
1.2,3.3,5 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA208,16X16,40 |
1.14 V |
125 Cel |
E200Z335 |
-40 Cel |
YES |
BOTTOM |
YES |
1572864 |
17 mm |
0 |
20 MHz |
17 mm |
96256 |
CMOS |
1.2 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B208 |
Not Qualified |
60 rpm |
80 |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
208 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
32 |
1.2,3.3,5 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA208,16X16,40 |
1.14 V |
125 Cel |
E200Z335 |
-40 Cel |
YES |
BOTTOM |
YES |
1048576 |
17 mm |
0 |
20 MHz |
17 mm |
65536 |
CMOS |
1.2 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B208 |
Not Qualified |
80 rpm |
80 |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.19 V |
135 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.51 mm |
2621440 |
14 mm |
96K |
ADC CH(INT AND EXT) BASED ON PACKAGE |
DMA(32), POR, PWM(12), TIMER(10), WDT |
0 |
40 MHz |
14 mm |
393216 |
CMOS |
16-Ch 12-Bit(4) |
1.25 V |
YES |
CAN(3), SPI(4) |
FLASH |
.8 mm |
S-PBGA-B257 |
150 rpm |
8 |
127 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
121 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA121,11X11,25 |
1.71 V |
105 Cel |
CORTEX-M0 |
0 |
-40 Cel |
YES |
BOTTOM |
YES |
1-Ch 12-Bit |
1.43 mm |
131072 |
8 mm |
0 |
NO |
DMA(8), POR, RTC, TIMER(16), WDT |
0 |
32 MHz |
8 mm |
6 |
98304 |
CMOS |
16-Ch 16-Bit |
3.3 V |
8 |
YES |
3 |
I2C(2), LPUART(3), SPI(2), QSPI |
FLASH |
.65 mm |
FIXED POINT |
S-PBGA-B121 |
72 rpm |
YES |
8 |
85 |
|||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
121 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA121,11X11,25 |
1.71 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
2-Ch 12-Bit |
1.52 mm |
262144 |
8 mm |
0 |
COMPARATOR(3), DMA(16), RTC, TIMER(15) |
0 |
32 MHz |
40 |
260 |
8 mm |
65536 |
CMOS |
38-Ch 16-Bit |
77 mA |
3.3 V |
YES |
Microcontrollers |
CAN(2), I2C(2), I2S, SPI(3), UART(6) |
FLASH |
.65 mm |
S-PBGA-B121 |
3 |
Not Qualified |
100 rpm |
e1 |
8 |
81 |
|||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,12X12,40 |
1.71 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
1.7 mm |
524288 |
13 mm |
0 |
32 MHz |
13 mm |
131072 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
.5 mm |
S-PBGA-B144 |
Not Qualified |
100 rpm |
104 |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.71 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.7 mm |
13 mm |
0 |
32 MHz |
40 |
260 |
13 mm |
CMOS |
3.3 V |
YES |
FLASH |
.5 mm |
S-PBGA-B144 |
3 |
Not Qualified |
100 rpm |
e1 |
104 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.19 V |
135 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.51 mm |
2621440 |
14 mm |
96K |
ADC CH(INT AND EXT) BASED ON PACKAGE |
DMA(32), POR, PWM(12), TIMER(10), WDT |
0 |
40 MHz |
14 mm |
393216 |
CMOS |
16-Ch 12-Bit(4) |
1.25 V |
YES |
CAN(3), ETHERNET, SPI(4) |
FLASH |
.8 mm |
S-PBGA-B257 |
180 rpm |
8 |
127 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.19 V |
135 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.51 mm |
2621440 |
14 mm |
96K |
ADC CH(INT AND EXT) BASED ON PACKAGE |
DMA(32), POR, PWM(12), TIMER(10), WDT |
0 |
40 MHz |
14 mm |
393216 |
CMOS |
16-Ch 12-Bit(4) |
1.25 V |
YES |
CAN(3), SPI(4) |
FLASH |
.8 mm |
S-PBGA-B257 |
180 rpm |
8 |
127 |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
COMMERCIAL |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
28 |
NO |
32 |
1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA256,16X16,40 |
1.71 V |
70 Cel |
0 Cel |
NO |
BOTTOM |
YES |
1.7 mm |
14 mm |
ALSO REQUIRES 3.3 V I/O SUPPLY |
32 |
20 MHz |
14 mm |
CMOS |
1.8 V |
YES |
Other Microprocessor ICs |
FLASH |
.8 mm |
S-PBGA-B256 |
Not Qualified |
250 rpm |
60 |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
121 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA121,11X11,25 |
1.71 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
1.52 mm |
524288 |
8 mm |
0 |
32 MHz |
8 mm |
131072 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
.65 mm |
S-PBGA-B121 |
Not Qualified |
100 rpm |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
COMMERCIAL |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
28 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.71 V |
70 Cel |
0 Cel |
NO |
BOTTOM |
YES |
1.7 mm |
14 mm |
ALSO REQUIRES 3.3 V I/O SUPPLY |
32 |
20 MHz |
14 mm |
CMOS |
1.8 V |
YES |
FLASH |
.8 mm |
S-PBGA-B256 |
3 |
Not Qualified |
250 rpm |
60 |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,12X12,40 |
1.71 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
1.7 mm |
262144 |
13 mm |
0 |
32 MHz |
13 mm |
65536 |
CMOS |
87 mA |
3.3 V |
YES |
Microcontrollers |
FLASH |
.5 mm |
S-PBGA-B144 |
Not Qualified |
100 rpm |
104 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.19 V |
125 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.51 mm |
2621440 |
14 mm |
96K |
ADC CH(INT AND EXT) BASED ON PACKAGE |
DMA(32), POR, PWM(12), TIMER(10), WDT |
0 |
40 MHz |
14 mm |
393216 |
CMOS |
16-Ch 12-Bit(4) |
1.25 V |
YES |
CAN(3), SPI(4) |
FLASH |
.8 mm |
S-PBGA-B257 |
200 rpm |
8 |
127 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
121 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
1.8/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA121,11X11,25 |
1.71 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
1.52 mm |
524288 |
8 mm |
0 |
32 MHz |
8 mm |
131072 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
.65 mm |
S-PBGA-B121 |
Not Qualified |
100 rpm |
75 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
121 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.71 V |
105 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.52 mm |
8 mm |
0 |
32 MHz |
8 mm |
CMOS |
3.3 V |
YES |
FLASH |
.65 mm |
S-PBGA-B121 |
100 rpm |
81 |
|||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
64 |
LFBGA |
SQUARE |
YES |
3.6 V |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.71 V |
YES |
BOTTOM |
YES |
5 mm |
0 |
32 MHz |
40 |
260 |
5 mm |
3.3 V |
YES |
.5 mm |
3 |
72 rpm |
41 |
||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.19 V |
135 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.51 mm |
2621440 |
14 mm |
96K |
ADC CH(INT AND EXT) BASED ON PACKAGE |
DMA(32), POR, PWM(12), TIMER(10), WDT |
0 |
40 MHz |
14 mm |
393216 |
CMOS |
16-Ch 12-Bit(4) |
1.25 V |
YES |
CAN(3), SPI(4) |
FLASH |
.8 mm |
S-PBGA-B257 |
150 rpm |
8 |
127 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.19 V |
135 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.51 mm |
2621440 |
14 mm |
96K |
ADC CH(INT AND EXT) BASED ON PACKAGE |
DMA(32), POR, PWM(12), TIMER(10), WDT |
0 |
40 MHz |
14 mm |
393216 |
CMOS |
16-Ch 12-Bit(4) |
1.25 V |
YES |
CAN(3), SPI(4) |
FLASH |
.8 mm |
S-PBGA-B257 |
180 rpm |
8 |
127 |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER |
AUTOMOTIVE |
BALL |
208 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
0 |
32 |
1.2,3.3,5 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA208,16X16,40 |
1.14 V |
125 Cel |
E200Z335 |
-40 Cel |
YES |
BOTTOM |
YES |
1048576 |
17 mm |
0 |
20 MHz |
17 mm |
65536 |
CMOS |
1.2 V |
YES |
Microcontrollers |
FLASH |
1 mm |
S-PBGA-B208 |
Not Qualified |
40 rpm |
80 |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
257 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
ISO 26262 |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.19 V |
135 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.51 mm |
2621440 |
14 mm |
96K |
ADC CH(INT AND EXT) BASED ON PACKAGE |
DMA(32), POR, PWM(12), TIMER(10), WDT |
0 |
40 MHz |
14 mm |
393216 |
CMOS |
16-Ch 12-Bit(4) |
1.25 V |
YES |
CAN(3), ETHERNET, SPI(4) |
FLASH |
.8 mm |
S-PBGA-B257 |
180 rpm |
8 |
127 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
64 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
NO |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.71 V |
105 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.23 mm |
5 mm |
DIFFERENTIAL ANALOG CHANNEL INPUTS: 4-CH 16-BIT |
0 |
48 MHz |
5 mm |
CMOS |
3 V |
YES |
FLASH |
.5 mm |
S-PBGA-B64 |
48 rpm |
54 |
A microcontroller is a type of integrated circuit (IC) that is designed to control a specific task or set of tasks within a larger system. Unlike a microprocessor, which is designed to be a general-purpose computing device, a microcontroller is optimized for embedded applications that require real-time control and processing.
Microcontrollers typically contain a processor core, memory, input/output (I/O) ports, and various peripheral devices, all on a single chip. The processor core is usually a low-power, low-speed version of a microprocessor, such as an 8-bit or 16-bit processor. The memory on a microcontroller includes both volatile and non-volatile memory, such as random-access memory (RAM) and flash memory, respectively. The I/O ports are used to interface with external devices such as sensors, switches, and displays.
Microcontrollers are used in a wide range of applications, including automotive systems, medical devices, consumer electronics, and industrial automation. They are particularly well-suited for applications that require real-time control and processing, such as motor control, temperature sensing, and data acquisition.
One of the key advantages of microcontrollers is their low cost and small size. Because all of the necessary components are integrated onto a single chip, microcontrollers are much smaller and less expensive than other types of computing devices. This makes them ideal for use in small, battery-powered devices such as handheld calculators and remote controls.