Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | Digital To Analog Convertors | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
8 |
16 |
NO |
8 |
3/5 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,10X10,32 |
4.5 V |
85 Cel |
AVR RISC |
8 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
NO |
1.2 mm |
32768 |
9 mm |
4096 |
OPERATES AT 2.7V MINIMUM SUPPLY AT 8 MHZ |
YES |
BOD, COMPARATOR, POR, PWM(12), RTC, TIMER(6), WDT |
8 |
16 MHz |
9 mm |
6 |
8192 |
CMOS |
16-Ch 10-Bit |
14 mA |
5 V |
YES |
4 |
Microcontrollers |
SPI, TWI, USART(4) |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B100 |
Not Qualified |
16 rpm |
YES |
e1 |
16 |
86 |
||||||||||||||
|
STMicroelectronics |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
64 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.8 V |
85 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.2 mm |
5 mm |
0 |
32 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
CMOS |
3 V |
YES |
FLASH |
.5 mm |
S-PBGA-B64 |
32 rpm |
50 |
||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
24 |
YES |
32 |
1.2 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,10X10,32 |
1.08 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
2-Ch 12-Bit |
1.1 mm |
2097152 |
163840 |
9 mm |
0 |
YES |
CRC, DMA(22), POR, PWM, RTC, TIMER(6), WDT, |
8 |
20 MHz |
9 mm |
6 |
163840 |
CMOS |
16-Ch 12-Bit |
25 mA |
1.2 V |
22 |
YES |
Microcontrollers |
I2C, I2S, SPI, UART(2), USB |
FLASH |
.8 mm |
FLOATING POINT |
S-PBGA-B100 |
Not Qualified |
120 rpm |
YES |
e1 |
8 |
79 |
||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
144 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
AEC-Q100; TS 16949 |
24 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA144,10X10 |
1.08 V |
105 Cel |
CORTEX-M7 |
3 |
-40 Cel |
YES |
BOTTOM |
YES |
1.2 mm |
262144 |
393216 |
10 mm |
ONE ADC CHANNEL IS RESERVED FOR INTERNAL TEMPERATURE SENSOR |
NO |
BOD, COMPARATOR, DMA(24), POR, PWM(16), RTC, RTT, TIMER(12), WDT(2) |
16 |
150 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
12 |
393216 |
CMOS |
24-Ch 12-Bit |
.006 mA |
1.2 V |
24 |
YES |
CAN(2), ETHERNET, HSMCI, I2C, I2S(2), IRDA, ISI, LIN, MMC, QEI(4) |
FLASH |
.8 mm |
FLOATING POINT |
S-PBGA-B144 |
300 rpm |
YES |
8 |
114 |
||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
208 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA208,17X17,32 |
3 V |
85 Cel |
ARM7 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.2 mm |
524288 |
15 mm |
32 |
25 MHz |
30 |
260 |
15 mm |
100352 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
.8 mm |
S-PBGA-B208 |
2 |
Not Qualified |
72 rpm |
e1 |
160 |
||||||||||||||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
247 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.1 V |
8 |
TS 16949 |
26 |
NO |
32 |
1,1.8/3.3,3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA247,19X19,20 |
.9 V |
85 Cel |
ARM9 |
3 |
-40 Cel |
YES |
BOTTOM |
YES |
1.1 mm |
65536 |
10 mm |
0 |
YES |
DMA(24), POR, PWM(2), RTC, TIMER(4), WDT |
32 |
50 MHz |
10 mm |
4 |
16384 |
CMOS |
4-Ch 10-Bit |
.75 mA |
1 V |
24 |
YES |
11 |
Microcontrollers |
ETHERNET, I2S(2), SPI(2), TWI, USART(4), USB |
FLASH |
.5 mm |
FIXED POINT |
S-PBGA-B247 |
Not Qualified |
400 rpm |
YES |
8 |
96 |
|||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
2.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.2 mm |
9 mm |
ALSO OPERATES AT 1.6V MINIMUM SUPPLY AT 12 MHZ |
0 |
32 MHz |
9 mm |
CMOS |
3.3 V |
YES |
FLASH |
.8 mm |
S-PBGA-B100 |
Not Qualified |
32 rpm |
e1 |
78 |
||||||||||||||||||||||||||||||||||
|
Atmel |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
16 |
1.8/3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,10X10,32 |
2.7 V |
85 Cel |
AVR RISC |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
2-Ch 12-Bit(2) |
1.2 mm |
65536 |
9 mm |
2K |
ALSO OPERATES AT 1.6V MINIMUM SUPPLY AT 12 MHZ |
BOD, COMPARATOR(4), DMA(4), POR, RTC, TIMER(8), WDT |
0 |
32 MHz |
9 mm |
8192 |
CMOS |
8-Ch 12-Bit(2) |
3.3 V |
YES |
Microcontrollers |
SPI(4), TWI(4), USART(8) |
FLASH |
.8 mm |
S-PBGA-B100 |
Not Qualified |
32 rpm |
e1 |
16 |
78 |
||||||||||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
0 |
NO |
32 |
1.8,3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,10X10,32 |
1.65 V |
85 Cel |
ARM7 |
-40 Cel |
YES |
BOTTOM |
YES |
1.1 mm |
262144 |
9 mm |
ALSO REQUIRES 3.3V SUPPLY |
0 |
50 MHz |
9 mm |
65536 |
CMOS |
1.8 V |
YES |
Microcontrollers |
FLASH |
.8 mm |
S-PBGA-B100 |
Not Qualified |
55 rpm |
62 |
||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
TS 16949 |
24 |
YES |
16 |
1.8/3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,10X10,32 |
2.7 V |
85 Cel |
AVR RISC |
78 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
2-Ch 12-Bit (2) |
1.2 mm |
32768 |
2048 |
9 mm |
2048 |
OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHz |
YES |
ANALOG COMPARATOR(4), BOD, CRC, DMA(4), POR, PWM(8), RTC, TIMER(8), WDT |
24 |
32 MHz |
9 mm |
8 |
4096 |
CMOS |
16-Ch 12-Bit (2) |
20 mA |
3 V |
4 |
YES |
8 |
Microcontrollers |
SPI(4), TWI(4), USART(8), USB |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B100 |
Not Qualified |
32 rpm |
NO |
e1 |
16 |
78 |
||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
3 V |
YES |
BOTTOM |
YES |
1.2 mm |
9 mm |
32 |
25 MHz |
9 mm |
CMOS |
3.3 V |
NO |
FLASH |
.5 mm |
S-PBGA-B100 |
204 rpm |
49 |
||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
AEC-Q100; TS 16949 |
24 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.08 V |
105 Cel |
CORTEX-M7 |
3 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.1 mm |
524288 |
393216 |
9 mm |
NO |
BOD, COMPARATOR, DMA(24), POR, PWM(16), RTC, RTT, TIMER(12), WDT(2) |
16 |
20 MHz |
9 mm |
12 |
393216 |
CMOS |
10-Ch 12-Bit |
.006 mA |
1.2 V |
24 |
YES |
CAN(2), ETHERNET, HSMCI, I2C, I2S(2), IRDA, ISI, LIN, MMC, QEI(4) |
FLASH |
.8 mm |
FLOATING POINT |
S-PBGA-B100 |
300 rpm |
YES |
e1 |
8 |
75 |
||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
48 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
NO |
32 |
3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,8X8,20 |
1.8 V |
85 Cel |
CORTEX-M0 |
-40 Cel |
YES |
BOTTOM |
YES |
1.1 mm |
65536 |
4.5 mm |
0 |
25 MHz |
260 |
4.5 mm |
12288 |
CMOS |
3.3 V |
NO |
Microcontrollers |
FLASH |
.5 mm |
S-PBGA-B48 |
1 |
Not Qualified |
50 rpm |
8 |
40 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
180 |
TFBGA |
SQUARE |
YES |
3.6 V |
8 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
2.7 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
2097152 |
12 mm |
16K |
BOD, DMA(30),POR, RTC, TIMER(9), WDT |
16 |
25 MHz |
260 |
12 mm |
368640 |
12-Ch 12-Bit |
3.3 V |
YES |
CAN(2),ETHERNET, I2C(10), I2S(2), SPI(11), UART(10), USB(2) |
FLASH |
.8 mm |
3 |
180 rpm |
8 |
137 |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROCONTROLLER, RISC |
BALL |
100 |
TFBGA |
SQUARE |
YES |
3.6 V |
0 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.8 V |
YES |
BOTTOM |
YES |
8 mm |
0 |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
CMOS |
3 V |
YES |
.8 mm |
32 rpm |
84 |
||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROCONTROLLER, RISC |
BALL |
100 |
TFBGA |
SQUARE |
YES |
3.6 V |
24 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.7 V |
YES |
BOTTOM |
YES |
8 mm |
8 |
26 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
3.3 V |
YES |
.8 mm |
216 rpm |
82 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.95 V |
8 |
24 |
NO |
32 |
1.8,3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,10X10,32 |
1.62 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
TIN SILVER COPPER NICKEL |
YES |
BOTTOM |
YES |
1.1 mm |
262144 |
9 mm |
0 |
YES |
BOD, DMA(4), POR, PWM(4), RTC, TIMER(3), WDT |
8 |
12 MHz |
9 mm |
3 |
53248 |
CMOS |
4-Ch 12-Bit, 4-Ch 10-Bit |
1.8 V |
4 |
YES |
3 |
Microcontrollers |
SPI(4), TWI, UART, USART(3) |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B100 |
Not Qualified |
96 rpm |
YES |
e2 |
8 |
57 |
||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
100 |
TFBGA |
SQUARE |
YES |
3.6 V |
14 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.71 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
524288 |
9 mm |
0 |
BOD, DMA(30), RTC, TIMER(8), WDT |
16 |
25 MHz |
260 |
9 mm |
163840 |
12-Ch 12-Bit |
1.8 V |
YES |
I2C(9), I2S(9), SPI(9), USART(9), USB(2) |
FLASH |
3 |
180 rpm |
8 |
64 |
||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
216 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
26 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.7 V |
105 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
2-Ch 12-Bit |
1.1 mm |
2097152 |
13 mm |
0 |
BOR, DMA(2), POR, PVD, PWM(4), RTC, TEMPERATURE SENSOR, TIMER(15), WDT(2) |
32 |
26 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
13 mm |
524288 |
CMOS |
24-Ch 12-Bit |
1.8 V |
YES |
CAN(3), ETHERNET, I2C(4), I2S(3), IRDA, LIN, SAI(2), SDMMC(2), SPI(6), UART(4), USART(4), USB(2) |
FLASH |
.8 mm |
S-PBGA-B216 |
200 rpm |
8 |
168 |
||||||||||||||||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
8 |
TS 16949 |
0 |
NO |
32 |
2.5/3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA121,11X11,32 |
2.3 V |
85 Cel |
PIC32 |
5 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.2 mm |
536576 |
65536 |
10 mm |
0 |
YES |
BOR, COMPARATOR(2), DMA(8), POR, TIMER(5), WDT |
0 |
50 MHz |
10 mm |
5 |
65536 |
CMOS |
16-Ch 10-Bit |
98 mA |
3.3 V |
8 |
YES |
Microcontrollers |
ETHERNET, I2C(5), SPI(4), UART(6), USB |
FLASH |
.8 mm |
S-PBGA-B121 |
Not Qualified |
80 rpm |
YES |
e1 |
8 |
83 |
||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.95 V |
8 |
24 |
NO |
32 |
1.8,3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,10X10,32 |
1.62 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
TIN SILVER COPPER NICKEL |
YES |
BOTTOM |
YES |
1.1 mm |
131072 |
9 mm |
0 |
YES |
BOD, DMA(4), POR, PWM(4), RTC, TIMER(3), WDT |
8 |
12 MHz |
9 mm |
3 |
36864 |
CMOS |
4-Ch 12-Bit, 4-Ch 10-Bit |
1.8 V |
4 |
YES |
3 |
Microcontrollers |
SPI(4), TWI, UART, USART(3) |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B100 |
Not Qualified |
96 rpm |
YES |
e2 |
8 |
57 |
||||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
144 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.32 V |
8 |
AEC-Q100; TS 16949 |
24 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA144,12X12,32 |
1.2 V |
105 Cel |
CORTEX-M7 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
2-Ch 12-Bit |
1.2 mm |
524288 |
10 mm |
0 |
ONE ADC CHANNEL IS RESERVED FOR INTERNAL TEMPERATURE SENSOR |
YES |
BOD, COMPARATOR, DMA(24), POR, PWM(8), RTC, TIMER(12), WDT(2) |
16 |
150 MHz |
10 mm |
12 |
262144 |
CMOS |
24-Ch 12-Bit |
1.4 V |
24 |
YES |
6 |
CAN(2), ISI, I2S(2), QSPI, SPI(2), TWI(3), UART(5), USART(3), USB |
FLASH |
.8 mm |
FLOATING POINT |
S-PBGA-B144 |
300 rpm |
YES |
e1 |
8 |
114 |
||||||||||||||||
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.95 V |
8 |
TS 16949 |
0 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,10X10,32 |
1.65 V |
85 Cel |
AT91SAM7 |
2 |
-40 Cel |
YES |
BOTTOM |
YES |
1.1 mm |
9 mm |
YES |
BOD, DMA(13), POR, PWM(4), RTC, RTT, TIMER, WDT |
0 |
20 MHz |
9 mm |
3 |
CMOS |
8-Ch 10-Bit |
3 mA |
1.8 V |
13 |
YES |
3 |
CAN, ETHERNET, I2C, IRDA, RS-485, SPI(2), SSC, TWI, USART(2), USB |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B100 |
55 rpm |
YES |
8 |
62 |
||||||||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
14 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
3 V |
YES |
BOTTOM |
YES |
1.2 mm |
9 mm |
8 |
25 MHz |
9 mm |
CMOS |
3.3 V |
NO |
FLASH |
.8 mm |
S-PBGA-B100 |
180 rpm |
49 |
||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
64 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
0 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA64,8X8,20 |
1.8 V |
85 Cel |
CORTEX-M0 |
-40 Cel |
YES |
BOTTOM |
YES |
1.2 mm |
65536 |
5 mm |
2K |
NO |
BOR, DMA, POR, PWM, RTC, TIMER(5), WDT |
0 |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
5 |
8192 |
CMOS |
15-Ch 12-Bit |
6.8 mA |
3 V |
7 |
YES |
I2C(2), I2S, SPI(4), UART, USART(2) |
FLASH |
.5 mm |
S-PBGA-B64 |
32 rpm |
YES |
8 |
50 |
|||||||||||||||||||||
|
STMicroelectronics |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
2-Ch 12-Bit |
1.1 mm |
524288 |
8 mm |
0 |
IT IS ALSO HAVING DCMI, SDMMC, SPDIFRX(4) CONNECTIVITY |
BOR, DMA(2), POR, PWM, RTC, TIMER(16), WDT(2) |
0 |
50 MHz |
260 |
8 mm |
327680 |
CMOS |
16-Ch 12-Bit |
3.3 V |
YES |
CAN(2), ETHERNET, I2C(4), I2S(3), IRDA, LIN, SAI(2), SPI(4), UART(4), USART(4) |
FLASH |
.8 mm |
S-PBGA-B100 |
3 |
216 rpm |
e1 |
8 |
82 |
|||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
180 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
20 |
YES |
32 |
3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA180,14X14,32 |
2.4 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.2 mm |
524288 |
12 mm |
16 |
25 MHz |
30 |
260 |
12 mm |
98304 |
CMOS |
3.3 V |
YES |
Microcontrollers |
FLASH |
.8 mm |
S-PBGA-B180 |
3 |
Not Qualified |
120 rpm |
e1 |
141 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
2.5/3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,10X10,32 |
2.2 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
1.2 mm |
524288 |
9 mm |
32 |
25 MHz |
260 |
9 mm |
106496 |
CMOS |
3.3 V |
NO |
Microcontrollers |
FLASH |
.8 mm |
S-PBGA-B100 |
3 |
Not Qualified |
204 rpm |
49 |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
180 |
TFBGA |
SQUARE |
YES |
3.6 V |
8 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
2.7 V |
105 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
2097152 |
12 mm |
16K |
BOD, DMA(30),POR, RTC, TIMER(9), WDT |
16 |
25 MHz |
260 |
12 mm |
368640 |
12-Ch 12-Bit |
3.3 V |
YES |
CAN(2),ETHERNET, I2C(10), I2S(2), SPI(11), UART(10), USB(2) |
FLASH |
.8 mm |
3 |
180 rpm |
8 |
137 |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
AUTOMOTIVE |
BALL |
144 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
8 |
AEC-Q100; TS 16949 |
0 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
2.1 V |
125 Cel |
PIC32 |
5 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.02 mm |
2097152 |
524288 |
7 mm |
0 |
IT ALSO HAS 12-CH DEDICATED DMA AND 160KBYTE OF BOOT FLASH MEMORY |
YES |
BOD, COMPARATOR(2), DMA(16), DMT, POR, PWM(9), RTCC, TIMER(9), WDT |
0 |
64 MHz |
7 mm |
9 |
524288 |
CMOS |
48-Ch 12-Bit |
150 mA |
3.3 V |
16 |
YES |
CAN(2), ETHERNET, I2C(5), I2S(6), IRDA, LIN, SMBUS, SPI(6), SQI, UART(6), USB |
FLASH |
.5 mm |
FLOATING POINT |
S-PBGA-B144 |
180 rpm |
YES |
e1 |
8 |
120 |
||||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
8 |
TS 16949 |
0 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
2.1 V |
85 Cel |
PIC32 |
5 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.06 mm |
2097152 |
524288 |
7 mm |
0 |
IT ALSO HAS 12-CH DEDICATED DMA AND 160KBYTE OF BOOT FLASH MEMORY |
YES |
BOR, COMPARATOR(2), DMA(8), POR, PWM, RTC, TIMER(10), WDT |
0 |
64 MHz |
7 mm |
10 |
524288 |
CMOS |
40-Ch 12-Bit |
135 mA |
3.3 V |
8 |
YES |
CAN(2), ETHERNET, I2C(5), I2S(6), IRDA, LIN, SMBUS, SPI(6), SQI, UART(6), USB |
FLASH |
.65 mm |
FLOATING POINT |
S-PBGA-B100 |
252 rpm |
YES |
e1 |
8 |
78 |
||||||||||||||||
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
180 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
21 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.71 V |
105 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1.2 mm |
12 mm |
16 |
25 MHz |
12 mm |
CMOS |
3.3 V |
YES |
FLASH |
.8 mm |
S-PBGA-B180 |
180 rpm |
8 |
145 |
||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
AEC-Q100; TS 16949 |
24 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.08 V |
105 Cel |
CORTEX-M7 |
3 |
-40 Cel |
YES |
BOTTOM |
YES |
1.1 mm |
524288 |
393216 |
9 mm |
NO |
BOD, COMPARATOR, DMA(24), POR, PWM(16), RTC, RTT, TIMER(12), WDT(2) |
16 |
20 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
12 |
393216 |
CMOS |
10-Ch 12-Bit |
.006 mA |
1.2 V |
24 |
YES |
CAN(2), ETHERNET, HSMCI, I2C, I2S(2), IRDA, ISI, LIN, MMC, QEI(4) |
FLASH |
.8 mm |
FLOATING POINT |
S-PBGA-B100 |
300 rpm |
YES |
8 |
75 |
||||||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
AEC-Q100; TS 16949 |
24 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.08 V |
105 Cel |
CORTEX-M7 |
3 |
-40 Cel |
YES |
BOTTOM |
YES |
1.1 mm |
131072 |
262144 |
9 mm |
ALSO OPERATES AS 1.7V TO 3.6V SUPPLY |
NO |
BOD, COMPARATOR, DMA(24), POR, PWM(16), RTC, RTT, TIMER(12), WDT(2) |
16 |
150 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
12 |
262144 |
CMOS |
10-Ch 12-Bit |
.006 mA |
1.2 V |
24 |
YES |
CAN(2), ETHERNET, HSMCI, I2C, I2S(2), IRDA, ISI, LIN, MMC, QEI(4) |
FLASH |
.8 mm |
FLOATING POINT |
S-PBGA-B100 |
300 rpm |
YES |
8 |
75 |
|||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
2.5/3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,10X10,32 |
2.2 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
1.2 mm |
1048576 |
9 mm |
32 |
25 MHz |
260 |
9 mm |
139264 |
CMOS |
3.3 V |
NO |
Microcontrollers |
FLASH |
.8 mm |
S-PBGA-B100 |
3 |
Not Qualified |
204 rpm |
49 |
|||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROCONTROLLER, RISC |
BALL |
100 |
TFBGA |
SQUARE |
YES |
3.6 V |
24 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.7 V |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
8 mm |
8 |
26 MHz |
260 |
8 mm |
3.3 V |
YES |
.8 mm |
3 |
216 rpm |
e1 |
82 |
|||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
64 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.8 V |
85 Cel |
-40 Cel |
YES |
BOTTOM |
YES |
1-Ch 12-Bit |
1.2 mm |
65536 |
5 mm |
2K |
BOR, COMPARATOR(2), DMA(7), LCD, POR, RTC, TIMER(6), WDT(2) |
0 |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
8192 |
CMOS |
15-Ch 12-Bit |
3 V |
YES |
I2C(2), I2S, SPI(4), UART, USART(2), USB |
FLASH |
.5 mm |
S-PBGA-B64 |
32 rpm |
8 |
50 |
||||||||||||||||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
8 |
TS 16949 |
0 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
2.3 V |
105 Cel |
PIC32 |
5 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.2 mm |
536576 |
131072 |
10 mm |
0 |
YES |
BOR, COMPARATOR(2), DMA(8), POR, TIMER(5), WDT |
0 |
50 MHz |
10 mm |
5 |
131072 |
CMOS |
16-Ch 10-Bit |
120 mA |
3.3 V |
8 |
YES |
ETHERNET, I2C(5), SPI(4), UART(6), USB |
FLASH |
.8 mm |
S-PBGA-B121 |
Not Qualified |
80 rpm |
YES |
e1 |
8 |
83 |
|||||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
AEC-Q100; TS 16949 |
24 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.08 V |
105 Cel |
CORTEX-M7 |
3 |
-40 Cel |
YES |
BOTTOM |
YES |
1.1 mm |
262144 |
393216 |
9 mm |
ONE ADC CHANNEL IS RESERVED FOR INTERNAL TEMPERATURE SENSOR |
NO |
BOD, COMPARATOR, DMA(24), POR, PWM(16), RTC, RTT, TIMER(12), WDT(2) |
16 |
150 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
12 |
393216 |
CMOS |
10-Ch 12-Bit |
.006 mA |
1.2 V |
24 |
YES |
CAN(2), ETHERNET, HSMCI, I2C, I2S(2), IRDA, ISI, LIN, MMC, QEI(4) |
FLASH |
.8 mm |
FLOATING POINT |
S-PBGA-B100 |
300 rpm |
YES |
8 |
75 |
|||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
64 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
0 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.71 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.2 mm |
5 mm |
0 |
50 MHz |
40 |
260 |
5 mm |
CMOS |
3.3 V |
YES |
FLASH |
.5 mm |
S-PBGA-B64 |
3 |
50 rpm |
e1 |
40 |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
24 |
YES |
32 |
2.5/3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,10X10,32 |
2.2 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
1.2 mm |
524288 |
9 mm |
32 |
25 MHz |
260 |
9 mm |
106496 |
CMOS |
3.3 V |
NO |
Microcontrollers |
FLASH |
.8 mm |
S-PBGA-B100 |
3 |
Not Qualified |
204 rpm |
49 |
|||||||||||||||||||||||||||||
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
AEC-Q100 |
24 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,10X10,32 |
1.08 V |
105 Cel |
CORTEX-M7 |
1 |
-40 Cel |
YES |
BOTTOM |
YES |
2-Ch 12-Bit |
1.1 mm |
2097152 |
9 mm |
0 |
YES |
BOD, COMPARATOR, DMA(24), POR, PWM(8), RTC, RTT, TIMER(12), WDT |
16 |
20 MHz |
9 mm |
12 |
393216 |
CMOS |
10-Ch 12-Bit |
1.2 V |
24 |
YES |
8 |
I2SC, QSPI, SPI, SSC, TWI(3), UART(5), USART(3), USB |
FLASH |
.8 mm |
FLOATING POINT |
S-PBGA-B100 |
300 rpm |
YES |
8 |
75 |
|||||||||||||||||||
|
NXP Semiconductors |
MICROCONTROLLER, RISC |
BALL |
180 |
TFBGA |
SQUARE |
YES |
3.6 V |
14 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.71 V |
85 Cel |
CORTEX-M4 |
-40 Cel |
YES |
BOTTOM |
YES |
262144 |
12 mm |
0 |
BOD, DMA(30), RTC, TIMER(8), WDT |
16 |
25 MHz |
260 |
12 mm |
139264 |
12-Ch 12-Bit |
1.8 V |
YES |
I2C(10), I2S(10), SPI(10), USART(10), USB(2) |
FLASH |
.8 mm |
3 |
180 rpm |
8 |
145 |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
3.6 V |
8 |
TS 16949 |
24 |
YES |
16 |
1.8/3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,10X10,32 |
2.7 V |
85 Cel |
AVR RISC |
78 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
2-Ch 12-Bit (2) |
1.2 mm |
32768 |
2048 |
9 mm |
2048 |
OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHz |
YES |
ANALOG COMPARATOR(4), BOD, CRC, DMA(4), POR, PWM(8), RTC, TIMER(8), WDT |
24 |
32 MHz |
9 mm |
8 |
4096 |
CMOS |
16-Ch 12-Bit (2) |
20 mA |
3 V |
4 |
YES |
8 |
Microcontrollers |
SPI(4), TWI(4), USART(8), USB |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B100 |
Not Qualified |
32 rpm |
NO |
e1 |
16 |
78 |
||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
144 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
8 |
TS 16949 |
0 |
NO |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
2.1 V |
85 Cel |
PIC32 |
5 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
YES |
1.02 mm |
2097152 |
524288 |
7 mm |
0 |
IT ALSO HAS 12-CH DEDICATED DMA AND 160KBYTE OF BOOT FLASH MEMORY |
YES |
BOD, COMPARATOR(2), DMA(16), DMT, POR, PWM(9), RTCC, TIMER(9), WDT |
0 |
64 MHz |
7 mm |
9 |
524288 |
CMOS |
48-Ch 12-Bit |
130 mA |
3.3 V |
16 |
YES |
CAN(2), ETHERNET, I2C(5), I2S(6), IRDA, LIN, SMBUS, SPI(6), SQI, UART(6), USB |
FLASH |
.5 mm |
FLOATING POINT |
S-PBGA-B144 |
200 rpm |
YES |
e1 |
8 |
120 |
||||||||||||||||
|
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
8 |
16 |
NO |
8 |
3/5 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,10X10,32 |
4.5 V |
85 Cel |
AVR RISC |
8 |
-40 Cel |
TIN SILVER COPPER |
YES |
BOTTOM |
NO |
1.2 mm |
65536 |
9 mm |
4096 |
OPERATES AT 2.7V MINIMUM SUPPLY AT 8 MHZ |
YES |
BOD, COMPARATOR, POR, PWM(12), RTC, TIMER(6), WDT |
8 |
16 MHz |
9 mm |
6 |
8192 |
CMOS |
16-Ch 10-Bit |
14 mA |
5 V |
YES |
4 |
Microcontrollers |
SPI, TWI, USART(4) |
FLASH |
.8 mm |
FIXED POINT |
S-PBGA-B100 |
Not Qualified |
16 rpm |
YES |
e1 |
16 |
86 |
||||||||||||||
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
8 |
AEC-Q100 |
24 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,10X10,32 |
1.08 V |
105 Cel |
CORTEX-M7 |
1 |
-40 Cel |
YES |
BOTTOM |
YES |
2-Ch 12-Bit |
1.1 mm |
524288 |
9 mm |
0 |
YES |
BOD, COMPARATOR, DMA(24), POR, PWM(8), RTC, RTT, TIMER(12), WDT |
16 |
20 MHz |
9 mm |
12 |
262144 |
CMOS |
10-Ch 12-Bit |
1.2 V |
24 |
YES |
8 |
I2SC, QSPI, SPI, SSC, TWI(3), UART(5), USART(3), USB |
FLASH |
.8 mm |
FLOATING POINT |
S-PBGA-B100 |
300 rpm |
YES |
8 |
75 |
|||||||||||||||||||
Microchip Technology |
MICROCONTROLLER, RISC |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1.32 V |
8 |
AEC-Q100; TS 16949 |
0 |
YES |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,10X10,32 |
1.2 V |
105 Cel |
CORTEX-M7 |
-40 Cel |
YES |
BOTTOM |
YES |
2-Ch 12-Bit |
1.1 mm |
524288 |
9 mm |
0 |
ONE ADC CHANNEL IS RESERVED FOR INTERNAL TEMPERATURE SENSOR |
YES |
BOD, COMPARATOR, DMA(24), POR, PWM(8), RTC, TIMER(12), WDT(2) |
0 |
150 MHz |
9 mm |
12 |
262144 |
CMOS |
10-Ch 12-Bit |
1.4 V |
24 |
YES |
6 |
CAN(2), ISI, I2S, QSPI, SPI, SSI, TWI(3), UART(5), USART(3), USB |
FLASH |
.8 mm |
FLOATING POINT |
S-PBGA-B100 |
300 rpm |
YES |
8 |
75 |
A microcontroller is a type of integrated circuit (IC) that is designed to control a specific task or set of tasks within a larger system. Unlike a microprocessor, which is designed to be a general-purpose computing device, a microcontroller is optimized for embedded applications that require real-time control and processing.
Microcontrollers typically contain a processor core, memory, input/output (I/O) ports, and various peripheral devices, all on a single chip. The processor core is usually a low-power, low-speed version of a microprocessor, such as an 8-bit or 16-bit processor. The memory on a microcontroller includes both volatile and non-volatile memory, such as random-access memory (RAM) and flash memory, respectively. The I/O ports are used to interface with external devices such as sensors, switches, and displays.
Microcontrollers are used in a wide range of applications, including automotive systems, medical devices, consumer electronics, and industrial automation. They are particularly well-suited for applications that require real-time control and processing, such as motor control, temperature sensing, and data acquisition.
One of the key advantages of microcontrollers is their low cost and small size. Because all of the necessary components are integrated onto a single chip, microcontrollers are much smaller and less expensive than other types of computing devices. This makes them ideal for use in small, battery-powered devices such as handheld calculators and remote controls.