1023 Microprocessors 383

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

MC8641DVU1250KB

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1250 rpm

YES

MPC8568EVTAQGG

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

1.1,1.8/2.5,2.5/3.3

GRID ARRAY

BGA1023,32X32,40

1.045 V

105 Cel

0 Cel

BOTTOM

2.75 mm

33 mm

YES

64

40

260

33 mm

CMOS

1.1 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B1023

3

Not Qualified

1000 rpm

YES

e2

MC8640DVU1067NE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

HBGA

SQUARE

CERAMIC

YES

YES

1 V

32

32

GRID ARRAY, HEAT SINK/SLUG

BGA1023,32X32,40

.9 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

32

166.66 MHz

33 mm

CMOS

.95 V

4

1 mm

FLOATING POINT

S-CBGA-B1023

1067 rpm

NO

MPC8567VTANGG

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

1.1,1.8/2.5,2.5/3.3

GRID ARRAY

BGA1023,32X32,40

1.045 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

2.75 mm

33 mm

YES

64

40

260

33 mm

CMOS

1.1 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B1023

3

Not Qualified

800 rpm

YES

e2

MC8641VJ1000HB

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

1000 rpm

YES

MPC8567ECVTAUJGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

GRID ARRAY

1.045 V

BOTTOM

2.75 mm

33 mm

YES

64

166 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B1023

1333 rpm

YES

MC8641DVU1500JB

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.15 V

16

32

GRID ARRAY

1.05 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1500 rpm

YES

MPC8568CVTAQGGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

0

32

GRID ARRAY

1.045 V

TIN SILVER

BOTTOM

2.75 mm

33 mm

YES

0

166 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B1023

Not Qualified

1000 rpm

YES

e2

MPC8567ECVTAQGGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

0

32

GRID ARRAY

1.045 V

TIN SILVER

BOTTOM

2.75 mm

33 mm

YES

0

166 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B1023

Not Qualified

1000 rpm

YES

e2

MC8641DVJ1000GC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

1000 rpm

YES

MPC8567EVTAQJGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

GRID ARRAY

1.045 V

BOTTOM

2.75 mm

33 mm

YES

64

166 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B1023

1000 rpm

YES

MPC8572ECLPXAULE

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

GRID ARRAY

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

33 mm

YES

64

133 MHz

33 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1023

1333 rpm

YES

MC8640THX1067NE

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1023

HBGA

SQUARE

CERAMIC

YES

YES

1 V

32

32

1,1.8/2.5,2.5/3.3

GRID ARRAY, HEAT SINK/SLUG

BGA1023,32X32,40

.9 V

105 Cel

-40 Cel

TIN LEAD

BOTTOM

2.97 mm

33 mm

YES

32

166.66 MHz

30

245

33 mm

CMOS

.95 V

4

Microprocessors

1 mm

FLOATING POINT

S-CBGA-B1023

3

Not Qualified

1067 rpm

NO

e0

MPC8568ECVTAQGGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

0

32

GRID ARRAY

1.045 V

TIN SILVER

BOTTOM

2.75 mm

33 mm

YES

0

166 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B1023

Not Qualified

1000 rpm

YES

e2

MC8640DVJ1000HC

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

1000 rpm

YES

MC8641HX1000JB

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1 V

16

32

GRID ARRAY

.9 V

105 Cel

0 Cel

BOTTOM

2.97 mm

33 mm

ALSO REQUIRIED 1.05 VDD CORE1

YES

64

166.66 MHz

33 mm

CMOS

.95 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1000 rpm

YES

MC8641VJ1333JE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

2.77 mm

33 mm

YES

64

30

245

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

3

1333 rpm

YES

e2

MC8640DTVJ1067NC

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1 V

16

32

GRID ARRAY

.9 V

105 Cel

-40 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

.95 V

1 mm

FLOATING POINT

S-CBGA-B1023

1067 rpm

YES

MPC8572ELPXARLE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

GRID ARRAY

1.045 V

105 Cel

0 Cel

BOTTOM

3.38 mm

33 mm

YES

64

133 MHz

33 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1023

1067 rpm

YES

MPC8572ELVTARLE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

GRID ARRAY

1.045 V

105 Cel

0 Cel

BOTTOM

3.38 mm

33 mm

YES

64

133 MHz

33 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1023

1067 rpm

YES

MC8641DHX1250GB

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.97 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1250 rpm

YES

MPC8568EVTANJGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

GRID ARRAY

1.045 V

BOTTOM

2.75 mm

33 mm

YES

64

166 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B1023

800 rpm

YES

MC8640DHJ1067NE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

HBGA

SQUARE

CERAMIC

YES

YES

1 V

32

32

GRID ARRAY, HEAT SINK/SLUG

BGA1023,32X32,40

.9 V

105 Cel

0 Cel

BOTTOM

2.97 mm

33 mm

YES

32

166.66 MHz

30

245

33 mm

CMOS

.95 V

4

1 mm

FLOATING POINT

S-CBGA-B1023

3

1067 rpm

NO

MC8641VU1000HE

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

32

32

1.1,1.8/2.5,2.5/3.3

GRID ARRAY

BGA1023,32X32,40

1 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

32

166.66 MHz

NOT SPECIFIED

NOT SPECIFIED

33 mm

CMOS

1.05 V

Microprocessors

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

166.66 rpm

YES

MC8641DVU1250HE

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

32

32

1.1,1.8/2.5,2.5/3.3

GRID ARRAY

BGA1023,32X32,40

1 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

32

166.66 MHz

NOT SPECIFIED

NOT SPECIFIED

33 mm

CMOS

1.05 V

Microprocessors

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

166.66 rpm

YES

MPC8572ECLVTAULE

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1023

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

GRID ARRAY, HEAT SINK/SLUG

1.045 V

TIN SILVER

BOTTOM

3.38 mm

33 mm

YES

64

133 MHz

30

245

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B1023

3

1333 rpm

YES

e2

MC8640DTVU1000HC

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

32

32

GRID ARRAY

1 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

2.97 mm

33 mm

YES

32

166.66 MHz

30

245

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

3

Not Qualified

1000 rpm

YES

e2

MPC8572EVJARLE

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

GRID ARRAY

1.045 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

3.38 mm

33 mm

YES

64

133 MHz

30

245

33 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1023

3

1067 rpm

YES

e2

MC8641VU1333HC

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1333 rpm

YES

MC8641VJ1000NC

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1 V

16

32

GRID ARRAY

.9 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

.95 V

1 mm

FLOATING POINT

S-CBGA-B1023

1000 rpm

YES

MC8640TVU1067NE

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1023

HBGA

SQUARE

CERAMIC

YES

YES

1 V

32

32

GRID ARRAY, HEAT SINK/SLUG

BGA1023,32X32,40

.9 V

105 Cel

-40 Cel

BOTTOM

2.77 mm

33 mm

YES

32

166.66 MHz

33 mm

CMOS

.95 V

4

1 mm

FLOATING POINT

S-CBGA-B1023

1067 rpm

NO

MPC8572ECLPXAVNE

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

GRID ARRAY

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

33 mm

YES

64

133 MHz

33 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1023

1500 rpm

YES

MC8640DTHJ1000HE

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1023

HBGA

SQUARE

CERAMIC

YES

YES

1.1 V

32

32

GRID ARRAY, HEAT SINK/SLUG

BGA1023,32X32,40

1 V

105 Cel

-40 Cel

BOTTOM

2.97 mm

33 mm

YES

32

166.66 MHz

33 mm

CMOS

1.05 V

4

1 mm

FLOATING POINT

S-CBGA-B1023

1000 rpm

NO

MPC8567ECVTAUGGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

GRID ARRAY

1.045 V

BOTTOM

2.75 mm

33 mm

YES

64

166 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B1023

1333 rpm

YES

MPC8568ECVTAQGJA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

GRID ARRAY

1.045 V

BOTTOM

2.75 mm

33 mm

YES

64

166 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B1023

1000 rpm

YES

MC8641DHX1000HB

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1 V

16

32

GRID ARRAY

.9 V

105 Cel

0 Cel

BOTTOM

2.97 mm

33 mm

ALSO REQUIRIED 1.05 VDD CORE1

YES

64

166.66 MHz

33 mm

CMOS

.95 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1000 rpm

YES

MPC8572ECVJATLE

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

GRID ARRAY

1.045 V

105 Cel

-40 Cel

BOTTOM

3.38 mm

33 mm

YES

64

133 MHz

33 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1023

1200 rpm

YES

MC8640VU1067NC

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1 V

32

32

GRID ARRAY

.9 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

2.97 mm

33 mm

YES

32

166.66 MHz

30

245

33 mm

CMOS

.95 V

1 mm

FLOATING POINT

S-CBGA-B1023

3

Not Qualified

1067 rpm

YES

e2

MC8640TVU1000HE

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1023

HBGA

SQUARE

CERAMIC

YES

YES

1.1 V

32

32

1,1.8/2.5,2.5/3.3

GRID ARRAY, HEAT SINK/SLUG

BGA1023,32X32,40

1 V

105 Cel

-40 Cel

BOTTOM

2.77 mm

33 mm

YES

32

166.66 MHz

NOT SPECIFIED

NOT SPECIFIED

33 mm

CMOS

1.05 V

4

Microprocessors

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1000 rpm

NO

MPC8567CVTAUJJ

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1.1,1.8/2.5,2.5/3.3

GRID ARRAY

BGA1023,32X32,40

105 Cel

-45 Cel

BOTTOM

Microprocessors

1 mm

S-PBGA-B1023

Not Qualified

1333 rpm

MPC8567EVTAUJJ

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

16

32

1.1,1.8/2.5,2.5/3.3

GRID ARRAY

BGA1023,32X32,40

1.045 V

105 Cel

0 Cel

BOTTOM

2.75 mm

33 mm

YES

64

40

260

33 mm

CMOS

1.1 V

Microprocessors

1 mm

FIXED POINT

S-PBGA-B1023

3

Not Qualified

1333 rpm

YES

e2

MC8641HX1250NB

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.97 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1250 rpm

YES

MPC8568VTAQGGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

0

32

GRID ARRAY

1.045 V

TIN SILVER

BOTTOM

2.75 mm

33 mm

YES

0

166 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B1023

Not Qualified

1000 rpm

YES

e2

MC8641DVU1000HB

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1 V

16

32

GRID ARRAY

.9 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

ALSO REQUIRIED 1.05 VDD CORE1

YES

64

166.66 MHz

33 mm

CMOS

.95 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1000 rpm

YES

MC8641DVU1250NC

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.1 V

16

32

GRID ARRAY

1 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.05 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1250 rpm

YES

MC8640VJ1067NC

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1 V

16

32

GRID ARRAY

.9 V

105 Cel

0 Cel

BOTTOM

2.77 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

.95 V

1 mm

FLOATING POINT

S-CBGA-B1023

1067 rpm

YES

MC8641DHX1500JB

NXP Semiconductors

MICROPROCESSOR

BALL

1023

BGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

YES

1.15 V

16

32

GRID ARRAY

1.05 V

105 Cel

0 Cel

BOTTOM

2.97 mm

33 mm

YES

64

166.66 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-CBGA-B1023

Not Qualified

1500 rpm

YES

MPC8568EVTANGGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

1023

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.155 V

0

32

GRID ARRAY

1.045 V

TIN SILVER

BOTTOM

2.75 mm

33 mm

YES

0

166 MHz

33 mm

CMOS

1.1 V

1 mm

FLOATING POINT

S-PBGA-B1023

Not Qualified

800 rpm

YES

e2

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.