361 Microprocessors 69

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
STM32MP157AAC3	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	12 mm		YES	0	64 MHz	NOT SPECIFIED	NOT SPECIFIED	12 mm	CMOS	1000 mA	.9 V	48			.65 mm	FLOATING POINT	S-PBGA-B361			650 rpm	YES
STM32MP151AAC3	STMicroelectronics	MICROPROCESSOR, RISC		BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,23X23,25/20	1.18 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	12 mm		YES	16	48 MHz	NOT SPECIFIED	NOT SPECIFIED	12 mm	CMOS	940 mA	1.2 V	48	8		.65 mm	FLOATING POINT	S-PBGA-B361			650 rpm	YES
ATSAMA5D27C-LD2G-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32		0	16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.7 V	85 Cel		-40 Cel		BOTTOM	1.2 mm	32768	16 mm		YES	0	24 MHz			16 mm	CMOS		1.8 V	51	1		.8 mm	FIXED POINT	S-PBGA-G361			500 rpm	YES
ATSAMA5D27C-LD2G-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32		0	16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.7 V	85 Cel		-40 Cel		BOTTOM	1.2 mm	32768	16 mm		YES	0	24 MHz			16 mm	CMOS		1.8 V	51	1		.8 mm	FIXED POINT	S-PBGA-G361			500 rpm	YES
ATSAMA5D27C-LD1G-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32		0	16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.7 V	85 Cel		-40 Cel		BOTTOM	1.2 mm	32768	16 mm		YES	0	24 MHz			16 mm	CMOS		1.8 V	51	1		.8 mm	FIXED POINT	S-PBGA-G361			500 rpm	YES
STM32MP157DAC1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	105 Cel		-20 Cel		BOTTOM	1.2 mm	724992	12 mm		YES	0	64 MHz			12 mm	CMOS	865 mA	.9 V	48			.65 mm	FLOATING POINT	S-PBGA-B361			800 rpm	YES
STM32MP151DAC1	STMicroelectronics	MICROPROCESSOR, RISC		BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,23X23,25/20	1.3 V	105 Cel		-20 Cel		BOTTOM	1.2 mm	724992	12 mm		YES	16	48 MHz			12 mm	CMOS	955 mA	1.34 V	48	8		.65 mm	FLOATING POINT	S-PBGA-B361			800 rpm	YES
ATSAMA5D27C-LD2G-CUR22	Microchip Technology	MICROPROCESSOR, RISC		BALL	361	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY		1.1 V	85 Cel	1	-40 Cel		BOTTOM		131072			YES	16	24 MHz				CMOS		1.2 V	51	7			FLOATING POINT	S-PBGA-B361			500 rpm	YES
ATSAMA5D27C-LD2G-CU22	Microchip Technology	MICROPROCESSOR, RISC		BALL	361	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32		GRID ARRAY		1.1 V	85 Cel	1	-40 Cel		BOTTOM		131072			YES	16	24 MHz				CMOS		1.2 V	51	7			FLOATING POINT	S-PBGA-B361			500 rpm	YES
ATSAMA5D42B-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	131072	16 mm		YES	32	50 MHz			16 mm	CMOS		1.26 V	32	2		.8 mm	FLOATING POINT	S-PBGA-B361			600 rpm	YES
ATSAMA5D44B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	131072	16 mm		YES	32	50 MHz			16 mm	CMOS		1.26 V	32	2		.8 mm	FLOATING POINT	S-PBGA-B361			600 rpm	YES
ATSAMA5D42B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	131072	16 mm		YES	32	50 MHz			16 mm	CMOS		1.26 V	32	2		.8 mm	FLOATING POINT	S-PBGA-B361			600 rpm	YES
STM32MP157AAC3T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		26	32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	12 mm		YES	0	64 MHz	NOT SPECIFIED	NOT SPECIFIED	12 mm	CMOS	1000 mA	.9 V	48			.65 mm	FLOATING POINT	S-PBGA-B361			650 rpm	YES
ATSAMA5D27C-LD1G-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32		0	16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.7 V	85 Cel		-40 Cel		BOTTOM	1.2 mm	32768	16 mm		YES	0	24 MHz			16 mm	CMOS		1.8 V	51	1		.8 mm	FIXED POINT	S-PBGA-G361			500 rpm	YES
AM1806BZCE4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			23	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,25	1.25 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.3 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	456 rpm	YES	e1
AM1808EZWT4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.3 V				.8 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
ATSAMA5D44B-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	131072	16 mm		YES	32	50 MHz			16 mm	CMOS		1.26 V	32	2		.8 mm	FLOATING POINT	S-PBGA-B361			600 rpm	YES
SMOMAPL138BGWTA3R	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		23	32	1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.4 mm	131072	16 mm		YES	16	30 MHz	20	220	16 mm	CMOS	.31 mA	1.2 V	64		Other uPs/uCs/Peripheral ICs	.8 mm	FLOATING POINT	S-PBGA-B361	3	Not Qualified	456 rpm	YES	e0
AM1802EZWTD3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	172032	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V	80			.8 mm	FIXED POINT	S-PBGA-B361	3		300 rpm	YES	e1
AM1808EZWTA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1802EZCED3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	172032	13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.2 V	80			.65 mm	FIXED POINT	S-PBGA-B361	3		300 rpm	YES	e1
ATSAMA5D44A-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel	1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	16 mm		YES	32	50 MHz			16 mm	CMOS		1.26 V	32	2		.8 mm	FLOATING POINT	S-PBGA-B361	3		600 rpm	YES	e2
XAM1808AZCE4	Texas Instruments	MICROPROCESSOR, RISC		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V	YES	16	50 MHz			13 mm	CMOS		1.3 V				.65 mm	FIXED POINT	S-PBGA-B361		Not Qualified	456 rpm	YES
XAM1808BZCE4	Texas Instruments	MICROPROCESSOR, RISC		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V				NICKEL PALLADIUM GOLD	BOTTOM	1.3 mm		13 mm	ALSO OPERATES AT 1V AND 1.1 V NOMINAL	YES	16	50 MHz			13 mm	CMOS		1.3 V				.65 mm	FIXED POINT	S-PBGA-B361		Not Qualified	456 rpm	YES	e4
AM1808BZCEA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			23	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,25	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	ALSO OPERATES AT 1V AND 1.1 V NOMINAL	YES	16	50 MHz	30	260	13 mm	CMOS		1.2 V			Microprocessors	.65 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	375 rpm	YES	e1
AM1808BZCE4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			23	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,25	1.25 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	ALSO OPERATES AT 1V AND 1.1 V NOMINAL	YES	16	50 MHz	30	260	13 mm	CMOS		1.3 V			Microprocessors	.65 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	456 rpm	YES	e1
AM1808BZCED4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			23	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,25	1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	ALSO OPERATES AT 1V AND 1.1 V NOMINAL	YES	16	50 MHz	30	260	13 mm	CMOS		1.3 V			Microprocessors	.65 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	456 rpm	YES	e1
AM1808BZWT4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			23	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.25 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	ALSO OPERATES AT 1V AND 1.1 V NOMINAL	YES	16	50 MHz	30	260	16 mm	CMOS		1.3 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	456 rpm	YES	e1
AM1808BZWTD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			23	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	ALSO OPERATES AT 1V AND 1.1 V NOMINAL	YES	16	50 MHz	30	260	16 mm	CMOS		1.3 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	456 rpm	YES	e1
AM1808EZWT3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1806BZCEA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			23	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,25	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	375 rpm	YES	e1
AM1810EZWTA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		14	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	16 mm		YES	16	50 MHz	30	260	16 mm	CMOS	.31 mA	1.2 V	64			.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1806EZCE3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	172032	13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.2 V	80			.65 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1808EZWTD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.3 V				.8 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM1806BZCED4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			23	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,25	1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.3 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	456 rpm	YES	e1
AM1806BZWTD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			23	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.3 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	456 rpm	YES	e1
AM1808BZWTA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			23	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	ALSO OPERATES AT 1V AND 1.1 V NOMINAL	YES	16	50 MHz	30	260	16 mm	CMOS		1.2 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	375 rpm	YES	e1
AM1808BZWT3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			23	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	ALSO OPERATES AT 1V AND 1.1 V NOMINAL	YES	16	50 MHz	30	260	16 mm	CMOS		1.2 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	375 rpm	YES	e1
AM1808BZWTT3	Texas Instruments	MICROPROCESSOR, RISC		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V				TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	50 MHz	30	260	16 mm	CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1806EZWT4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	172032	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.3 V	80			.8 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM1808EZCED4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.3 V				.65 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM1806BZWTA3	Texas Instruments	MICROPROCESSOR, RISC		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			23	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V					BOTTOM	1.4 mm		16 mm		YES	16	30 MHz			16 mm	CMOS		1.2 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B361		Not Qualified	375 rpm	YES
AM1808EZCE3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.2 V				.65 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1806BZWT4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V			23	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.25 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.3 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	456 rpm	YES	e1
AM1806EZCEA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	172032	13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.2 V	80			.65 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1808EZCEA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.2 V				.65 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1806EZWT3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	172032	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V	80			.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1806EZCED4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	172032	13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.3 V	80			.65 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.