369 Microprocessors 30

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Boundary Scan	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8306CVMAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	0 Cel	TIN SILVER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz	40	260	19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369	3		333 rpm	YES	e2
MPC8306SVMAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	1,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA369,23X23,32	.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz	40	260	19 mm	CMOS	1 V	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	333 rpm	YES	e2
MPC8306CVMAFFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz			19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369			333 rpm	YES	e1
MPC8306SCVMACCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.61 mm	19 mm	YES	33.33 MHz			19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369			200 rpm	YES	e1
MPC8306VMABDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	0 Cel	TIN SILVER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz	40	260	19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	133 rpm	YES	e2
MPC8306CVMABDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	0 Cel	TIN SILVER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz	40	260	19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	133 rpm	YES	e2
MPC8306CVMACDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	0 Cel	TIN SILVER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz	40	260	19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	200 rpm	YES	e2
MPC8306SCVMABCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.61 mm	19 mm	YES	33.33 MHz			19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369			133 rpm	YES	e1
MPC8306SVMACDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	1,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA369,23X23,32	.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz	40	260	19 mm	CMOS	1 V	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	200 rpm	YES	e2
MPC8306SVMABCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.61 mm	19 mm	YES	33.33 MHz			19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369			133 rpm	YES	e1
MPC8306SVMADDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	1,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA369,23X23,32	.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz	40	260	19 mm	CMOS	1 V	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	266 rpm	YES	e2
MPC8306SCVMABDCA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	1,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA369,23X23,32	.95 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz	40	260	19 mm	CMOS	1 V	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	133 rpm	YES	e2
MPC8306VMAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	0 Cel	TIN SILVER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz	40	260	19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369	3		333 rpm	YES	e2
MPC8306CVMABFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz			19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369			133 rpm	YES	e1
MPC8306VMACDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	0 Cel	TIN SILVER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz	40	260	19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	200 rpm	YES	e2
MPC8306SCVMAFFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz			19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369			333 rpm	YES	e1
MPC8306SCVMADDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	1,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA369,23X23,32	.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz	40	260	19 mm	CMOS	1 V	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	266 rpm	YES	e2
MPC8306SVMABDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	1,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA369,23X23,32	.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz	40	260	19 mm	CMOS	1 V	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	133 rpm	YES	e2
MPC8306CVMACFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz			19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369			200 rpm	YES	e1
MPC8306CVMADFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz			19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369			266 rpm	YES	e1
MPC8306SVMAFFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz			19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369			333 rpm	YES	e1
MPC8306CVMADDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	0 Cel	TIN SILVER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz	40	260	19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	266 rpm	YES	e2
MPC8306SVMACCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32		GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.61 mm	19 mm	YES	33.33 MHz			19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369			200 rpm	YES	e1
MPC8306VMADDCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	0 Cel	TIN SILVER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz	40	260	19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	266 rpm	YES	e2
MPC8306VMAFFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz			19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369			333 rpm	YES	e1
MPC8306SCVMACDCA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	1,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA369,23X23,32	.95 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz	40	260	19 mm	CMOS	1 V	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	200 rpm	YES	e2
MPC8306VMABFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz			19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369			133 rpm	YES	e1
MPC8306VMACFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz			19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369			200 rpm	YES	e1
MPC8306SCVMAFDCA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	32	1,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA369,23X23,32	.95 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz	40	260	19 mm	CMOS	1 V	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B369	3	Not Qualified	333 rpm	YES	e2
MPC8306VMADFCA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	369	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.61 mm	19 mm	YES	66.67 MHz			19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B369			266 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.