538 Microprocessors 19

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Package Style (Meter)	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
AM5708BCBDJEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	16	GRID ARRAY, LOW PROFILE, FINE PITCH	1.11 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm	17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS	1.15 V	.65 mm	FIXED POINT	S-PBGA-B538	3	1000 rpm	YES	e1
AM5706BCBDJA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	16	GRID ARRAY, LOW PROFILE, FINE PITCH	1.11 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm	17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS	1.15 V	.65 mm	FIXED POINT	S-PBGA-B538	3	1000 rpm	YES	e1
AM5708BCBDJA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	16	GRID ARRAY, LOW PROFILE, FINE PITCH	1.11 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm	17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS	1.15 V	.65 mm	FIXED POINT	S-PBGA-B538	3	1000 rpm	YES	e1
AM5706BCBDDA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	16	GRID ARRAY, LOW PROFILE, FINE PITCH	1.11 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm	17 mm	OPERATES AT 0.85V NOMINAL SUPPLY AFTER AVS ENABLE	YES	32	32 MHz	NOT SPECIFIED	260	17 mm	CMOS	1.15 V	.65 mm	FIXED POINT	S-PBGA-B538	3	500 rpm	YES	e1
AM5706BCBDDEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	16	GRID ARRAY, LOW PROFILE, FINE PITCH	1.11 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm	17 mm		YES	32	38.4 MHz	NOT SPECIFIED	260	17 mm	CMOS	1.15 V	.65 mm	FIXED POINT	S-PBGA-B538	3	500 rpm	YES	e1
AM5708BCBDJ	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	16	GRID ARRAY, LOW PROFILE, FINE PITCH	1.11 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm	17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS	1.15 V	.65 mm	FIXED POINT	S-PBGA-B538	3	1000 rpm	YES	e1
AM5706BCBDD	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	16	GRID ARRAY, LOW PROFILE, FINE PITCH	1.1 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm	17 mm	OPERATES AT 0.85V NOMINAL SUPPLY AFTER AVS ENABLE	YES	32	32 MHz	30	260	17 mm	CMOS	1.15 V	.65 mm	FIXED POINT	S-PBGA-B538	3	500 rpm	YES	e1
AM5706BCBDJEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	16	GRID ARRAY, LOW PROFILE, FINE PITCH	1.11 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm	17 mm		YES	32	38.4 MHz	NOT SPECIFIED	260	17 mm	CMOS	1.15 V	.65 mm	FIXED POINT	S-PBGA-B538	3	1000 rpm	YES	e1
AM5708BCBDJEAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	16	GRID ARRAY, LOW PROFILE, FINE PITCH	1.11 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm	17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS	1.15 V	.65 mm	FIXED POINT	S-PBGA-B538	3	1000 rpm	YES	e1
XAM5708BCBDJEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	16	GRID ARRAY, LOW PROFILE, FINE PITCH	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.298 mm	17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS	1.15 V	.65 mm	FIXED POINT	S-PBGA-B538	3	1000 rpm	YES	e1
AM5708BCBDJAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	16	GRID ARRAY, LOW PROFILE, FINE PITCH	1.11 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm	17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS	1.15 V	.65 mm	FIXED POINT	S-PBGA-B538	3	1000 rpm	YES	e1
AM5708BCBDJAS	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	16	GRID ARRAY, LOW PROFILE, FINE PITCH	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.298 mm	17 mm	GPMC CONSISTS OF 28-BIT ADDRESS LINES AND 16-BIT DATA LINES	YES	32	38.4 MHz	30	260	17 mm	CMOS	1.15 V	.65 mm	FIXED POINT	S-PBGA-B538	3	1000 rpm	YES	e1
AM5706BCBDDAS	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	16	GRID ARRAY, FINE PITCH	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		17 mm	ALSO OPERATES AT 0.85 V TO 1.15 V AFTER AVS ENABLED	YES	32	38.4 MHz	30	260	17 mm	CMOS	1.15 V	.65 mm	FIXED POINT	S-PBGA-B538	3	500 rpm	YES	e1
XAM5706ACBDJEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V	16	GRID ARRAY, LOW PROFILE, FINE PITCH	1.11 V	105 Cel	-40 Cel		BOTTOM	1.298 mm	17 mm		YES	32	38.4 MHz			17 mm	CMOS	1.15 V	.65 mm	FLOATING POINT	S-PBGA-B538		1000 rpm	YES
AM5708ACBDJEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	BGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V	16	GRID ARRAY	1.11 V	105 Cel	-40 Cel		BOTTOM				YES	32	38.4 MHz				CMOS	1.15 V		FLOATING POINT	S-PBGA-B538		1000 rpm	YES
XAM5708ACBDJEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V	16	GRID ARRAY, LOW PROFILE, FINE PITCH	1.11 V	105 Cel	-40 Cel		BOTTOM	1.298 mm	17 mm		YES	32	38.4 MHz			17 mm	CMOS	1.15 V	.65 mm	FLOATING POINT	S-PBGA-B538		1000 rpm	YES
AM5708BCBDJR	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	16	GRID ARRAY, LOW PROFILE, FINE PITCH	1.11 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm	17 mm		YES	32	38.4 MHz	NOT SPECIFIED	260	17 mm	CMOS	1.15 V	.65 mm	FIXED POINT	S-PBGA-B538	3	1000 rpm	YES	e1
AM5706BCBDJ	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	16	GRID ARRAY, LOW PROFILE, FINE PITCH	1.11 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.298 mm	17 mm		YES	32	38.4 MHz	30	260	17 mm	CMOS	1.15 V	.65 mm	FIXED POINT	S-PBGA-B538	3	1000 rpm	YES	e1
AM5706ACBDJEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	BGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V	16	GRID ARRAY	1.11 V	105 Cel	-40 Cel		BOTTOM				YES	32	38.4 MHz				CMOS	1.15 V		FLOATING POINT	S-PBGA-B538		1000 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.