621 Microprocessors 16

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

PS32V234CMN0AVUB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

64

GRID ARRAY, FINE PITCH

.95 V

105 Cel

-40 Cel

BOTTOM

2.44 mm

17 mm

YES

17 mm

CMOS

1 V

.65 mm

FLOATING POINT

S-PBGA-B621

1000 rpm

YES

FS32V234CKN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

8

0

64

GRID ARRAY, FINE PITCH

BGA621,25X25,25

.95 V

125 Cel

1

-40 Cel

TIN SILVER

BOTTOM

2.44 mm

4194304

17 mm

YES

0

40 MHz

40

260

17 mm

CMOS

1 V

32

0

.65 mm

FLOATING POINT

S-PBGA-B621

3

1000 rpm

YES

e2

FS32V232CTN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

8

AEC-Q100

0

64

GRID ARRAY, FINE PITCH

BGA621,25X25,25

.95 V

125 Cel

1

-40 Cel

BOTTOM

2.44 mm

4194304

17 mm

YES

0

40 MHz

40

260

17 mm

CMOS

1 V

32

0

.65 mm

FLOATING POINT

S-PBGA-B621

3

1000 rpm

YES

FS32V234CMN1AVUB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

8

0

64

GRID ARRAY, FINE PITCH

BGA621,25X25,25

.95 V

125 Cel

1

-40 Cel

BOTTOM

2.44 mm

4194304

17 mm

YES

0

40 MHz

17 mm

CMOS

1 V

32

0

.65 mm

FLOATING POINT

S-PBGA-B621

1000 rpm

YES

FS32V234CTN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

8

AEC-Q100

0

64

GRID ARRAY, FINE PITCH

BGA621,25X25,25

.95 V

125 Cel

1

-40 Cel

BOTTOM

2.44 mm

4194304

17 mm

YES

0

40 MHz

40

260

17 mm

CMOS

1 V

32

0

.65 mm

FLOATING POINT

S-PBGA-B621

3

1000 rpm

YES

FS32V234CON2VUB

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

8

AEC-Q100

64

GRID ARRAY, FINE PITCH

BGA621,25X25,25

.95 V

125 Cel

1

-40 Cel

BOTTOM

2.44 mm

4194304

17 mm

YES

40 MHz

40

260

17 mm

CMOS

1 V

32

2

.65 mm

FLOATING POINT

S-PBGA-B621

3

1000 rpm

YES

FS32V234BMN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

8

AEC-Q100

0

64

GRID ARRAY, FINE PITCH

BGA621,25X25,25

.95 V

125 Cel

1

-40 Cel

TIN SILVER

BOTTOM

2.44 mm

4194304

17 mm

YES

0

40 MHz

40

260

17 mm

CMOS

1 V

32

0

.65 mm

FLOATING POINT

S-PBGA-B621

3

800 rpm

YES

e2

FS32V232BMN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

8

AEC-Q100

0

64

GRID ARRAY, FINE PITCH

BGA621,25X25,25

.95 V

125 Cel

1

-40 Cel

BOTTOM

2.44 mm

4194304

17 mm

YES

0

40 MHz

40

260

17 mm

CMOS

1 V

32

0

.65 mm

FLOATING POINT

S-PBGA-B621

3

800 rpm

YES

FS32V234CMN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

8

AEC-Q100

0

64

GRID ARRAY, FINE PITCH

BGA621,25X25,25

.95 V

125 Cel

1

-40 Cel

TIN SILVER

BOTTOM

2.44 mm

4194304

17 mm

YES

0

40 MHz

40

260

17 mm

CMOS

1 V

32

0

.65 mm

FLOATING POINT

S-PBGA-B621

3

1000 rpm

YES

e2

FS32V234CON1VUB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

8

0

64

GRID ARRAY, FINE PITCH

BGA621,25X25,25

.95 V

125 Cel

1

-40 Cel

TIN SILVER

BOTTOM

2.44 mm

4194304

17 mm

YES

0

40 MHz

40

260

17 mm

CMOS

1 V

32

0

.65 mm

FLOATING POINT

S-PBGA-B621

3

1000 rpm

YES

e2

FS32V234BLN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

8

AEC-Q100

0

64

GRID ARRAY, FINE PITCH

BGA621,25X25,25

.95 V

125 Cel

1

-40 Cel

TIN SILVER

BOTTOM

2.44 mm

4194304

17 mm

YES

0

40 MHz

40

260

17 mm

CMOS

1 V

32

0

.65 mm

FLOATING POINT

S-PBGA-B621

3

800 rpm

YES

e2

FS32V234BJN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

8

AEC-Q100

0

64

GRID ARRAY, FINE PITCH

BGA621,25X25,25

.95 V

125 Cel

1

-40 Cel

TIN SILVER

BOTTOM

2.44 mm

4194304

17 mm

YES

0

40 MHz

40

260

17 mm

CMOS

1 V

32

0

.65 mm

FLOATING POINT

S-PBGA-B621

3

800 rpm

YES

e2

LS1043ASE7PQB

NXP Semiconductors

SoC

OTHER

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

.93 V

16

64

GRID ARRAY, FINE PITCH

.87 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

21 mm

ALSO OPERATES AT 1V NOMINAL SUPPLY

YES

32

30

250

21 mm

CMOS

.9 V

.8 mm

FIXED POINT

S-PBGA-B621

3

1400 rpm

YES

e1

LS1043AXE7QQB

NXP Semiconductors

SoC

INDUSTRIAL

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

.93 V

16

64

GRID ARRAY, FINE PITCH

.87 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

21 mm

ALSO OPERATES AT 1V NOMINAL SUPPLY

YES

32

30

250

21 mm

CMOS

.9 V

.8 mm

FIXED POINT

S-PBGA-B621

3

1600 rpm

YES

e1

LS1043ASE7QQB

NXP Semiconductors

SoC

OTHER

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

.93 V

16

64

GRID ARRAY, FINE PITCH

.87 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

21 mm

ALSO OPERATES AT 1V NOMINAL SUPPLY

YES

32

30

250

21 mm

CMOS

.9 V

.8 mm

FIXED POINT

S-PBGA-B621

3

1600 rpm

YES

e1

LS1043ASE7KQB

NXP Semiconductors

SoC

OTHER

BALL

621

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

.93 V

16

64

GRID ARRAY, FINE PITCH

.87 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.07 mm

21 mm

ALSO OPERATES AT 1V NOMINAL SUPPLY

YES

32

30

250

21 mm

CMOS

.9 V

.8 mm

FIXED POINT

S-PBGA-B621

3

1000 rpm

YES

e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.