740 Microprocessors 111

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Package Style (Meter)	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8360EZUAGDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	GRID ARRAY, LOW PROFILE	1.14 V			Tin/Lead (Sn/Pb)	BOTTOM	1.69 mm	37.5 mm	YES	32	66.67 MHz	40	260	37.5 mm	CMOS	1.2 V	1 mm	FLOATING POINT	S-PBGA-B740	3	Not Qualified	400 rpm	YES	e0
MPC8360ZUAGDHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	GRID ARRAY, LOW PROFILE	1.14 V				BOTTOM	1.69 mm	37.5 mm	YES	32	66.67 MHz			37.5 mm	CMOS	1.2 V	1 mm	FLOATING POINT	S-PBGA-B740		Not Qualified	400 rpm	YES
MPC8360EZUAJDHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	32	32	GRID ARRAY, LOW PROFILE	1.15 V				BOTTOM	1.69 mm	37.5 mm	YES	32	66.67 MHz			37.5 mm	CMOS	1.3 V	1 mm	FLOATING POINT	S-PBGA-B740		Not Qualified	533 rpm	YES
MPC8360CZUAJFGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	32	32	GRID ARRAY, LOW PROFILE	1.15 V			TIN LEAD SILVER	BOTTOM	1.69 mm	37.5 mm	YES	32	66.67 MHz			37.5 mm	CMOS	1.3 V	1 mm	FLOATING POINT	S-PBGA-B740		Not Qualified	533 rpm	YES	e0
MPC8360ECVVAGFHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	GRID ARRAY, LOW PROFILE	1.14 V			TIN SILVER COPPER	BOTTOM	1.69 mm	37.5 mm	YES	32	66.67 MHz			37.5 mm	CMOS	1.2 V	1 mm	FLOATING POINT	S-PBGA-B740		Not Qualified	400 rpm	YES	e1
MPC8360ZUAGFHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	GRID ARRAY, LOW PROFILE	1.14 V				BOTTOM	1.69 mm	37.5 mm	YES	32	66.67 MHz			37.5 mm	CMOS	1.2 V	1 mm	FLOATING POINT	S-PBGA-B740		Not Qualified	400 rpm	YES
MPC8360ECZUAJFGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	32	32	GRID ARRAY, LOW PROFILE	1.15 V			TIN LEAD SILVER	BOTTOM	1.69 mm	37.5 mm	YES	32	66.67 MHz			37.5 mm	CMOS	1.3 V	1 mm	FLOATING POINT	S-PBGA-B740		Not Qualified	533 rpm	YES	e0
MPC8360ECVVAJDHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	32	32	GRID ARRAY, LOW PROFILE	1.15 V			TIN SILVER COPPER	BOTTOM	1.69 mm	37.5 mm	YES	32	66.67 MHz			37.5 mm	CMOS	1.3 V	1 mm	FLOATING POINT	S-PBGA-B740		Not Qualified	533 rpm	YES	e1
MPC8360VVALDHA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	32	32	GRID ARRAY, LOW PROFILE	1.25 V				BOTTOM	1.69 mm	37.5 mm	YES	32	66.67 MHz			37.5 mm	CMOS	1.3 V	1 mm	FLOATING POINT	S-PBGA-B740		Not Qualified	667 rpm	YES
MPC8360CZUAJDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	32	32	GRID ARRAY, LOW PROFILE	1.15 V			TIN LEAD	BOTTOM	1.69 mm	37.5 mm	YES	32	66.67 MHz	40	260	37.5 mm	CMOS	1.3 V	1 mm	FLOATING POINT	S-PBGA-B740	3	Not Qualified	533 rpm	YES	e0
MPC8360ECZUAGFGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	GRID ARRAY, LOW PROFILE	1.14 V			TIN LEAD SILVER	BOTTOM	1.69 mm	37.5 mm	YES	32	66.67 MHz			37.5 mm	CMOS	1.2 V	1 mm	FLOATING POINT	S-PBGA-B740		Not Qualified	400 rpm	YES	e0
MPC8360VVAHFG	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	32	32	GRID ARRAY, LOW PROFILE	1.15 V	70 Cel	0 Cel		BOTTOM	1.69 mm	37.5 mm	YES	32	66.67 MHz			37.5 mm	CMOS	1.3 V	1 mm	FLOATING POINT	S-PBGA-B740		Not Qualified	500 rpm	YES
MPC8358ECZUADDGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	GRID ARRAY, LOW PROFILE	1.14 V			TIN LEAD SILVER	BOTTOM	1.69 mm	37.5 mm	YES	32	66.67 MHz			37.5 mm	CMOS	1.2 V	1 mm	FLOATING POINT	S-PBGA-B740		Not Qualified	266 rpm	YES	e0
MPC8360VVAGFGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	GRID ARRAY, LOW PROFILE	1.14 V				BOTTOM	1.69 mm	37.5 mm	YES	32	66.67 MHz			37.5 mm	CMOS	1.2 V	1 mm	FLOATING POINT	S-PBGA-B740		Not Qualified	400 rpm	YES
MPC8360CVVAJFGA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	740	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	32	32	GRID ARRAY, LOW PROFILE	1.15 V			TIN SILVER COPPER	BOTTOM	1.69 mm	37.5 mm	YES	32	66.67 MHz			37.5 mm	CMOS	1.3 V	1 mm	FLOATING POINT	S-PBGA-B740		Not Qualified	533 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.