783 Microprocessors 1,353

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

MPC8536CVJANGA

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

105 Cel

-40 Cel

TIN SILVER

BOTTOM

2.76 mm

29 mm

YES

64

40

260

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

3

800 rpm

YES

e2

MPC8535AVJAQGA

NXP Semiconductors

MICROPROCESSOR

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY

.95 V

90 Cel

0 Cel

BOTTOM

2.76 mm

29 mm

YES

64

29 mm

CMOS

1 V

1 mm

FIXED POINT

S-PBGA-B783

1000 rpm

YES

MPC8541CVTAJE

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

783

HBGA

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

105 Cel

-40 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

R-PBGA-B783

Not Qualified

533 rpm

YES

MPC8569EVTANLGA

NXP Semiconductors

MICROPROCESSOR, RISC

BALL

783

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.03 V

16

32

GRID ARRAY, HEAT SINK/SLUG

.97 V

105 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.94 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

800 rpm

YES

e1

MPC8555PXAKFX

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY

1.14 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

S-PBGA-B783

Not Qualified

600 rpm

YES

MPC8533EVTALJA

NXP Semiconductors

MICROPROCESSOR

BALL

783

HBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, HEAT SINK/SLUG

.95 V

90 Cel

0 Cel

BOTTOM

2.8 mm

29 mm

YES

64

133 MHz

29 mm

CMOS

1 V

1 mm

FLOATING POINT

S-PBGA-B783

667 rpm

YES

MPC8541EPXAPF

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

HBGA

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1.26 V

64

32

GRID ARRAY, HEAT SINK/SLUG

1.14 V

105 Cel

0 Cel

TIN LEAD

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

30

245

29 mm

CMOS

1.2 V

1 mm

FLOATING POINT

R-PBGA-B783

3

Not Qualified

833 rpm

YES

e0

MPC8541VTAQD

NXP Semiconductors

MICROPROCESSOR, RISC

OTHER

BALL

783

HBGA

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1.35 V

64

32

GRID ARRAY, HEAT SINK/SLUG

1.25 V

105 Cel

0 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.3 V

1 mm

FLOATING POINT

R-PBGA-B783

Not Qualified

1000 rpm

YES

MPC8560CVTAQJC

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

783

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.35 V

64

32

GRID ARRAY

1.25 V

105 Cel

-40 Cel

BOTTOM

3.75 mm

29 mm

YES

64

166 MHz

29 mm

CMOS

1.3 V

1 mm

FIXED POINT

S-PBGA-B783

Not Qualified

1000 rpm

YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.