HFBGA Microprocessors 14

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
T1040NXN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		YES	64		30	250	23 mm	CMOS	1 V	8		.8 mm	FIXED POINT	S-PBGA-B780	3	1400 rpm	YES	e1
P2041NXE1NNB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	16	32	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	1.71 V	105 Cel	12	-40 Cel		BOTTOM	2.51 mm	23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64	133 MHz			23 mm	CMOS	1.8 V	4	24	.8 mm	FIXED POINT	S-PBGA-B780		1333 rpm	YES
T1040NXN7WQA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	-40 Cel		BOTTOM	2.07 mm	23 mm		YES	64				23 mm	CMOS	1 V	8		.8 mm	FIXED POINT	S-PBGA-B780		1500 rpm	YES
T1040NXN7PQA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	-40 Cel		BOTTOM	2.07 mm	23 mm		YES	64				23 mm	CMOS	1 V	8		.8 mm	FIXED POINT	S-PBGA-B780		1400 rpm	YES
P2041NXE7NNC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	16	32	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	1.71 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	2.51 mm	23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64	133 MHz	30	245	23 mm	CMOS	1.8 V	4	24	.8 mm	FIXED POINT	S-PBGA-B780	3	1333 rpm	YES	e1
T1040NSN7MQB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		YES	64		30	250	23 mm	CMOS	1 V	8		.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T1040NSN7PQA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	0 Cel		BOTTOM	2.07 mm	23 mm		YES	64				23 mm	CMOS	1 V	8		.8 mm	FIXED POINT	S-PBGA-B780		1400 rpm	YES
T1040NXN7MQB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		YES	64		30	250	23 mm	CMOS	1 V	8		.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T1040NSN7MQA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	0 Cel		BOTTOM	2.07 mm	23 mm		YES	64				23 mm	CMOS	1 V	8		.8 mm	FIXED POINT	S-PBGA-B780		1200 rpm	YES
T1040NSN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		YES	64		30	250	23 mm	CMOS	1 V	8		.8 mm	FIXED POINT	S-PBGA-B780	3	1400 rpm	YES	e1
T1040NXN7MQA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	-40 Cel		BOTTOM	2.07 mm	23 mm		YES	64				23 mm	CMOS	1 V	8		.8 mm	FIXED POINT	S-PBGA-B780		1200 rpm	YES
T1040NXN7WQB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	-40 Cel		BOTTOM	2.07 mm	23 mm		YES	64				23 mm	CMOS	1 V	8		.8 mm	FIXED POINT	S-PBGA-B780		1500 rpm	YES
T1040NSN7WQB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		YES	64		30	250	23 mm	CMOS	1 V	8		.8 mm	FIXED POINT	S-PBGA-B780	3	1500 rpm	YES	e1
T1040NSN7WQA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	0 Cel		BOTTOM	2.07 mm	23 mm		YES	64				23 mm	CMOS	1 V	8		.8 mm	FIXED POINT	S-PBGA-B780		1500 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.